首页> 美国政府科技报告 >Plasma Immersion Ion Implantation Process for Semiconductor Fabrication. LinearReentrant Crossed-Field Amplifiers for in situ Measurements, Comparisons with Numerical Simulations and Study of Noise Mechanisms
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Plasma Immersion Ion Implantation Process for Semiconductor Fabrication. LinearReentrant Crossed-Field Amplifiers for in situ Measurements, Comparisons with Numerical Simulations and Study of Noise Mechanisms

机译:用于半导体制造的等离子体浸没离子注入工艺。用于原位测量的LinearReentrant交叉场放大器,与数值模拟的比较和噪声机制的研究

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摘要

We have performed in situ measurements in two low frequency CFAs to study severalbasic physics issues which may lead to CFA noise reduction. Our measurements include the local radio-frequency (RF) fields, electron density profiles, electron energy distributions and noise spectrums in both the linear CFA and the reentrant CFA. Comprehensive electron density measurements of the interaction region as well as parametric comparisons such as gain versus sole voltage, beam current and frequency have been used to benchmark two computer simulation codes, MASK and NESSP.

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