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Manufacturing Methods for Electroplating Silver, Gold, and Rhodium on Electrical Connector Contacts.

机译:在电连接器触点上电镀银,金和铑的制造方法。

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摘要

The objective of this contract was as follows: (1) A program was directed at the problem of developing manufacturing methods for electroplating silver, gold, rhodium, and other relative contact electroplatings on electrical connector contacts. The manufacturing methods optimized under the contract emphasize quality electroplating of contacts, and minimized efforts which might normally be devoted to basic contact design and basis metal investigations. (2) The electroplating of contacts performed under this contract was directed toward improving and supplementing the quality of contacts plated under MIL-C-26636 and used in MIL-C-26500 connectors. (3) The work task of this contract was organized in such a manner that contact electroplating processes and techniques are upgraded and then further optimized by the dictates of the skin effect phenomena, as applicable, so that industrial processes and controls for producing satisfactory quality contacts are firmly established. (Author).

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