Thermal Analysis Using the Chrysler Improved Numerical Differencing Analyzer for Third-Generation Computers (CINDA-3G) Program.

摘要

The application of the CINDA-3G computer program to the solution of thermal problems involving integrated circuit modules is discussed in detail. Included is a brief review of heat transfer principles and thermal modeling techniques. CINDA-3G uses numerical techniques,and proper network modeling of the problem is essential. It is shown that the temperature distributions obtained with the computer program for a sample problem compare favorably with a one-dimensional analytic (hand-calculated) solution. Therefore,the CINDA-3G program appears to be a useful tool in solving complex thermal problems of limited size. (Author) Portions of this document are not fully legible.