Method and Apparatus for Non-Destructive Testing of Beam-Lead Integrated Circuit Connections

摘要

The presently known technology involving the testing of beam-lead devices deals with destructive testing such as the 'Push-Off' testing of the entire bonding of the multiplicity of leads at one time or by other destructive methods. The 'Push-Off' technology involves the use of a special substrate arranged such that a hole is directly under the bonded beam-lead device in order to allow the 'Push-Off' test to be accomplished. In accordance with this invention, a method and apparatus for non-destructive testing of beam-leaded devices is provided in which each individual lead of the beam-leaded device has a pull tab with a weakened area thereon in order to provide a non-destructive means for testing the beam-leads. The beam-lead device is tested by inserting a hook of a gram pull tester into an opening of the tab and pulling on the tab until the weakended area is broken. The weakened area is selected such that it will break when subjected to a predetermined pull and this predetermined amount being less than that required to break the tensil strength of the diffusion bond between the beam-leads and the conductors to which they are connected. In this manner, the bond strength of each individual beam-lead to its respective conductor is accurately tested in a non-destructive manner to determine the sufficiency of the bond strength of each individual lead.