Exploring New RF Circuit Structures with Embedded Patterned Substrate Layers.

摘要

This report presents the findings made under the ARO contract listed. The significant results show how millimeter wave interconnects with embedded patterned substrate layers (EPSLs) improve insertion loss and coupling. The frequency domain S-parameter performance is characterized with a commercial full wave solver and effective permittivity. Additional results on how surface roughness in interconnects affect loss are shown. A simulation strategy that allows full three-dimensional statistical characterization of surface roughness was developed. This methodology allows engineers to estimate the impact of the effects of surface roughness on signal propagation. EPSLs do improve insertion loss and reduces coupling in tightly spaced interconnects. The biggest improvement gains are for high permittivity substrates such as Alumina.