Dynamic Solder Management.

机译：动态焊接管理。

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Results from initial 2D steady-state isothermal simulations of wave soldering of DSM modified PCBs are presented. The effects of small ( 2mm ) obstacles on solder flow paths can be clearly seen, more sophisticated, realistic models are under development and will be reported next quarter.

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作者
Cummings, M.; Lindsay, G.;
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年度 1992
页码 1-13
总页数 13
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Soldering; Flow; Models; Paths; Simulation; Steady state;

机译：焊接;流动;模型;路径;模拟;稳态;

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Dynamic Solder Management.

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