Laser-Chemical Three-Dimensional Writing for Microelectromechanics andApplication to Standard-Cell Microfluidics

摘要

A high-speed technique has been developed for machining three-dimensional siliconparts using laser-induced chlorine etching reactions. Parts are created directly from solid-modeling computer-aided-design/computer-aided-manufacturing software. Removal rates exceeding 2 x 104 and > 105 micrometers 3/s are achieved at 1 and 15 micrometers x-y resolution, respectively. This is several order of magnitude faster than electrodischarge machining methods. Submicrometer resolution has been achieved. Laser-induced metallization of resulting structures as well as replication through compression molding have been demonstrated. A class of microfluidic flow-channel devices is under development using a standard-cell software architecture combined with field stitching.... Microelectromechanics (MEM'S), 3-D Laser etching.