Polymer Based Materials for Additive Processing of High Temperature ElectronicsPackaging

摘要

Work under Task 1 has begun on the evaluation of candidate high temperaturetransient liquid phase sintering (TLPS) systems as well as candidate high temperature polymer materials. In evaluating candidate metal and alloy systems, binary and available ternary phase diagrams are being reviewed to identify alloy systems that could be used in a high temperature application. The goal is to find a combination of metals and alloys that will go through TLPS at a temperature compatible with the polymer processing and that will form products that will be able to withstand the proposed high operating temperatures. DSC studies of some of these combinations have been done to confirm their potential. Metal powders studied so far include copper and various low melting point metals and alloys to ascertain the products formed by TLPS.