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Changes in Properties of a /Silicon System during Gradual Etching off of the Porous Silicon Layer

机译:多孔硅层逐渐腐蚀过程中 / Silicon系统的性能变化

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摘要

Scanning electron microscopy has shown etching of a porous silicon layer in an HF solution to be irregular. The intensity of porous silicon photoluminescence significantly decreases during gradual etching off, and its peak initially shifts to shorter and then to longer wavelengths. Under red-light pulse excitation, photovoltage measurements have shown that the boundary potential φ_s of the p-Si substrate is positive, and φ_s grows with the etching time and as the temperature decreases from 300 to 200 K. At T < 230 K, the photomemory of φ_s caused by nonequilibrium electron capture by p-Si boundary traps is observed. The concentration of shallow traps and boundary electron states in p-Si increases as porous silicon is etched. At T < 180 K, the system of boundary electron states is rearranged. Photovoltage measurements with white-light pulses have revealed electron capture at oxide traps of aged porous silicon.
机译:扫描电子显微镜已显示出在HF溶液中对多孔硅层的蚀刻是不规则的。多孔硅的光致发光强度在逐步蚀刻期间会显着降低,并且其峰值最初会移至较短的波长,然后移至较长的波长。在红光脉冲激励下,光电压测量表明p-Si衬底的边界电势φ_s为正,并且φ_s随着蚀刻时间的增长而增长,并且随着温度从300 K降低到200K。在T <230 K时,观察到由p-Si边界陷阱捕获非平衡电子引起的φ_s的光记忆。随着多孔硅被蚀刻,p-Si中浅陷阱的浓度和边界电子态增加。在T <180 K时,边界电子态系统重新排列。用白光脉冲进行的光电压测量表明,电子已被老化的多孔硅的氧化物陷阱捕获。

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