Approximating the Steady-State Temperature of 3D Electronic Systems with Convolutional Neural Networks

摘要

Thermal simulations are an important part of the design process in many engineering disciplines. In simulation-based design approaches, a considerable amount of time is spent by repeated simulations. An alternative, fast simulation tool would be a welcome addition to any automatized and simulation-based optimisation workflow. In this work, we present a proof-of-concept study of the application of convolutional neural networks to accelerate thermal simulations. We focus on the thermal aspect of electronic systems. The goal of such a tool is to provide accurate approximations of a full solution, in order to quickly select promising designs for more detailed investigations. Based on a training set of randomly generated circuits with corresponding finite element solutions, the full 3D steady-state temperature field is estimated using a fully convolutional neural network. A custom network architecture is proposed which captures the long-range correlations present in heat conduction problems. We test the network on a separate dataset and find that the mean relative error is around 2 and the typical evaluation time is 35 ms per sample (2 ms for evaluation, 33 ms for data transfer). The benefit of this neural-network-based approach is that, once training is completed, the network can be applied to any system within the design space spanned by the randomized training dataset (which includes different components, material properties, different positioning of components on a PCB, etc.).