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首页> 外文期刊>Semiconductors >Influence of surface roughness on a change in the growth mode from two-dimensional to three-dimensional for strained SiGe heterostructures
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Influence of surface roughness on a change in the growth mode from two-dimensional to three-dimensional for strained SiGe heterostructures

机译:表面粗糙度对应变SiGe异质结从二维到三维生长模式变化的影响

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摘要

The influence of the surface microroughness on the critical thickness for the two-dimensional growth of strained SiGe structures on Si(001) and Ge(001) substrates is investigated. A decrease in the critical thickness for the two-dimensional growth of Ge films with increasing number of lattice periods or a decrease in the thickness of Si spacer layers is found for Ge/Si lattices grown on Si(001) substrates. This change is related to an increase in the surface roughness with the accumulation of elastic energy in compressed structures. A comparative study of the growth of SiGe structures on Si(001) and Ge(001) substrates shows that the critical thickness for the two-dimensional growth of tensile-strained layers is much larger than for compressed layers in a wide range of SiGe-layer compositions at an identical (in magnitude) lattice mismatch between the film and substrate.
机译:研究了表面微粗糙度对Si(001)和Ge(001)衬底应变SiGe结构二维生长临界厚度的影响.在Si(001)衬底上生长的Ge/Si晶格,随着晶格周期数的增加,Ge薄膜二维生长的临界厚度减小,或者Si间隔层厚度减小。这种变化与压缩结构中弹性能积累导致表面粗糙度增加有关。对Si(001)和Ge(001)衬底上SiGe结构生长的比较研究表明,在薄膜和衬底之间晶格不匹配的情况下,拉伸应变层的二维生长的临界厚度远大于各种SiGe层组成中的压缩层。

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