首页> 外文期刊>Compliance engineering >TLP ESD Testing of Electronic Components
【24h】

TLP ESD Testing of Electronic Components

机译:TLP ESD Testing of Electronic Components

获取原文
获取原文并翻译 | 示例
           

摘要

This article presents some guidance for selecting an appropriate o-scope for TLP measurements. It also points out that the apparently simple question as to which o-scope is most suitable does not have a simple answer. There are three distinct TLP measurements: the measurement of the DUT's Ⅰ-Ⅴ and leakage (IVL) data, the Ⅰ-Ⅴ data measurement for the SOLZ/SORZ verification data, and the waveform data for the calibration and verification of the TLP tester rise times. The new TLP document addresses the bandwidth of the scope for IVL data collection and for SORZ data, but it does not specif-ically address the rise time measurement and the associated error issue. Fortunately, the 500 MHz bandwidth is sufficient to measure rise times down to 2 nanoseconds. However, this bandwidth is inadequate to measure any rise time below 1 nanosecond (see Table Ⅰ) because the errors at this level are above the acceptable limits. The rise time is important for devices that are sensitive to ΔW/ΔT or ΔI/ΔT changes. The duplicating of HBM behavior requires 2-10 nanoseconds per the TLP standard, but engineering development may actually require <2 nanoseconds T_r. Data do exist that show changes and differences for Tr <5 nanoseconds for both HBM testing and TLP testing. Therefore, it is important that the o-scope used to measure the rise time parameter have sufficient bandwidth to ensure that the errors in the measurements are at an acceptable minimum level.

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号