...
机译:A Vapor-Phase Deposited Polymer Film to Improve the Adhesion of Electroless-Deposited Copper Layer onto Various Kinds of Substrates
Department of Chemical and Biomolecular Engineering and KI for the NanoCentury, Korea Advanced Institute of Science and Technology (KAIST), 305-701 Daejeon, Republic of Korea;
ACI Development Team, ACI Division, Samsung Electro-Mechanics Co., Ltd. (SEMCO), 443-743 Suwon, Republic of Korea;