The increase in GaAs production is driving the change to 150mm-dia. wafers and generating a desire within the industry for high-throughput, high-yield deposition equipment. Sputter cluster tools have been shown to provide similar benefits in productivity to those used in the Si industry. Benefits specific to GaAs metallization processes make sputtering an attractive process for contact, interconnect, backside, and component deposition in high-volume manufacturing facilities. By adapting production-proven Si sputtering equipment to the particular needs of the GaAs industry, sputter cluster tools are becoming a viable and cost-effective alternative to traditional evaporated metallization schemes.
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