Electrolytic-plasma polishing of copper and its alloys

摘要

The behavior of copper and its alloys (brass and nickel silver) was analysed in diluting solutions of some salt with anodic polarisation in wide region of voltage (from 0 to 420 V). The region of voltage corresponding to electrode surface dissolution, to oxide film formation or to salts films formation, gaseous vapour envelope formation were investigated. The influence of anode material on electrode process is investigated. It was shown that the process of anode dissolution is the main thing in the voltages region of stable gaseous vapour envelope. Anomalous high meaning of current efficiency process dissolution in some conditions were found. Positive and negative sites of using complex mg agent were marked. Optimal compositions of electrolytes and parameters for polishing of investigative materials were suggested。