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Synthesis and characterization of bisphenol-A ether diamine-based polyimide POSS nanocomposites for low K dielectric and flame-retardant applications

机译:低钾介电和阻燃应用双酚A醚二胺基聚酰亚胺POSS纳米复合材料的合成与表征

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Polyhedral oligomeric silsesquloxane (POSS)- polyimide (PI) hybrid nanocomposites were prepared by a two-step approach, bisphenol-A ether diamine (BAED) and pyromelletic dianhydride (PMDA) in l-methyl-2-pyrrolidone (NMP) were used to prepare polyamic acid (PAA) to which varying weight percentages of OAPS in NMP were added. During the second step, the polycondensation was effected by thermal imidization. The formation of hybrid nanocomposites was confirmed by using FTIR spectra. The thermal properties of POSS-PI nanocomposites were studied using differential scanning calorimetry and thermogravimetric analysis. The lowest dielectric constant 2.68 was achieved for 15 wt.% POSS-PI material when compared with the value of 3.34 for the neat PI. Data from thermal studies indicate that the incorporation of POSS into polyimide significantly enhanced the glass transition temperature (7g), thermal stability, char yield and flame-retardant properties of hybrid nanocomposites than that of neat PI. The excellent combination of both dielectric and thermal properties of the material developed in the present study will find application in microelectronics.
机译:通过两步法制备了多面体低聚硅倍半氧烷(POSS)-聚酰亚胺(PI)杂化纳米复合材料,使用了在1-甲基-2-吡咯烷酮(NMP)中的双酚A醚二胺(BAED)和均苯四酸二酐(PMDA)制备聚酰胺酸(PAA),并在其中添加不同重量百分比的OAPS在NMP中。在第二步骤中,通过热酰亚胺化进行缩聚。通过使用FTIR光谱证实了杂化纳米复合材料的形成。使用差示扫描量热法和热重分析法研究了POSS-PI纳米复合材料的热性能。当与纯PI的3.34的值相比时,对于15重量%的POSS-PI材料实现了最低的介电常数2.68。热学研究的数据表明,与纯PI相比,将POSS掺入聚酰亚胺中可以显着提高杂化纳米复合材料的玻璃化转变温度(7g),热稳定性,炭产率和阻燃性。本研究开发的材料的介电和热学性能的完美结合将在微电子领域得到应用。

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