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Determination and review of specific heat capacity measurements during isothermal cure of an epoxy using TM-DSC and standard DSC techniques

机译:使用TM-DSC和标准DSC技术确定和审查环氧树脂等温固化期间的比热容测量

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The technique normally used to measure C_p during isothermal cure is Temperature Modulated-Dynamic Scanning Calorimetry TM-DSC. It is however not standardised, experimentally complicated and quite time intensive. As will be shown, C_p may also be estimated during isothermal cure just from using dynamic heating experiments on a fully cured sample. Such values are often sufficient for isothermal heat transfer models that otherwise employ a constant C_p value obtained from the fully cured epoxy. Secondly, the results from dynamic heating experiments provide a quick means, in comparison to isothermal TMDSC measurements, of estimating C_p variation during cure as well as providing a good estimate value for C_p towards the end of isothermal cure. As will be shown, such values obtained from a standardised measurement procedure are very helpful in setting up TMDSC experiments that are more sensitive to experimental error influenced by factors such as sample weight and geometry. The DSC results illustrate that the measured heat capacity C _p for a fully cured epoxy over a temperature range are very similar to values for samples partially cured at corresponding isothermal temperatures, under the prerequisite that vitrification takes place. In such cases the primary influence on C_p is specific measurement temperature and not degree of cure. For isothermal cure temperatures investigated between 150 and 200 °C, the total change of C_p during cure is nearly constant and correlates well with values published by authors on other epoxy based systems. Taking C_p variation as constant, it is possible from just dynamic heating experiments on the cured epoxy to estimate C_p for the uncured epoxy system at specific cure temperatures. The next step would be to estimate the full C_p profile during isothermal cure, however, in such cases, the time to vitrification would also be needed as additional information.
机译:等温固化期间通常用于测量C_p的技术是温度调制动态扫描量热法TM-DSC。但是,它不是标准化的,实验上很复杂并且非常耗时。如将显示的,仅在完全固化的样品上使用动态加热实验,也可以在等温固化期间估算C_p。这样的值对于等温传热模型通常是足够的,这些模型否则将采用从完全固化的环氧树脂获得的恒定C_p值。其次,与等温TMDSC测量相比,动态加热实验的结果提供了一种快速的方法,可以估算固化过程中的C_p变化,并为等温固化结束时的C_p提供良好的估算值。如将显示的那样,从标准化测量程序中获得的这些值对于建立TMDSC实验非常有帮助,该实验对受样品重量和几何形状等因素影响的实验误差更为敏感。 DSC结果表明,在发生玻璃化的前提下,在一定温度范围内对完全固化的环氧树脂测得的热容C _p与在相应的等温温度下部分固化的样品的值非常相似。在这种情况下,对C_p的主要影响是特定的测量温度而不是固化程度。对于在150至200°C之间研究的等温固化温度,固化过程中C_p的总变化几乎是恒定的,并且与作者在其他基于环氧的系统上发表的值高度相关。将C_p变化定为常数,可以通过仅在固化的环氧树脂上进行动态加热实验来估计特定固化温度下未固化的环氧树脂体系的C_p。下一步将是估计等温固化过程中的整个C_p曲线,但是,在这种情况下,也需要玻璃化时间作为附加信息。

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