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2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California

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1.Ultra-Fine Thick Film Printing with Foil Based μ-Screens

机译：使用基于箔的μ丝网进行超精细厚膜印刷
- 作者：R.D. Shipton;C. J. Robertson;D. R. Gray;J. Coit;W. White
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- screen printing;
- μ-screen;
- fine line;
- thick film;
- MCM;
2.Ultra High I/O Density Package: Sea of Leads (SoL)

机译：超高I / O密度封装：引线海（SoL）
- 作者：Muhannad S. Bakir;Chirag S. Patel;Paul A. Kohl;Kevin P. Martin;James D. Meindl
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- sea of leads (SoL);
- complaint wafer level package (CWLP);
- system-on-a-chip (SoC);
3.Vibration Fatigue, Failure Mechanism and Reliability of Plastic Ball Grid Array and Plastic Quad Flat Packages

机译：塑料球栅阵列和塑料四方扁平包装的振动疲劳，破坏机理和可靠性
- 作者：Ron S. Li;Larry Poglitsch
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
4.Thermal Management of Ultraportable Projector products

机译：超便携式投影仪产品的热管理
- 作者：Rick Lin
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- computational fluid dynamics;
- thermal modeling;
- system level analysis;
- DLP projector;
- UHP(ultra high power);
5.Polymer Collar - A Polymer Reinforced Wafer Level Package Solder Bump

机译：聚合物项圈-聚合物增强晶圆级封装焊锡凸块
- 作者：Deok-Hoon Kim;Peter Elenius;Scott Barrett
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- wafer level CSP;
- WLP;
- ultra CSP;
- solder joint reliability;
- polymer reinforced solder bump;
- Polymer collar;
6.Series Stacked lubeaxial Fans: Flow and Acoustic Performance

机译：系列堆叠式轴流风机：流量和声学性能
- 作者：Maurice Holahan;Dennis J. Hansen;Noah Shirk
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- fan;
- cooling redundancy;
- airflow;
- thermal management;
- electronics packaging;
- acoustic;
7.A two stage approach to electronic package characterization

机译：电子包装表征的两阶段方法
- 作者：Kamal Karimanal
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- thermal modeling;
- CFD;
- BGA;
- IC package characterization;
- electronic packaging;
8.A Study on Advanced Flip Chip Interconnect Technologies for Space Application

机译：用于太空应用的先进倒装芯片互连技术研究
- 作者：Sharon Ling;Binh Le;Ark Lew;Elbert Nhan
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- flip chip;
- interconnection;
- reliability;
- space application;
9.Optimization of Cooling Time for Measuring Thermal Properties of Electronic Materials using the Transient Plane Source Technique

机译：使用瞬态平面源技术优化用于测量电子材料热性能的冷却时间
- 作者：Craig Dixon;Brad Canney;Michael R. Strong
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- thermal conductivity;
- transient plane source;
- electronic materials;
- parameter optimization;
- cooling time;
10.Rapid Analytical Modeling of a Heat Transfer Device using the Engineering Equation Solver Software Package (EES)

机译：使用工程方程求解器软件包（EES）对传热设备进行快速分析建模
- 作者：Andy Delano
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- arcticooler;
- optimization;
- engineering equation solver;
- ees;
- heat sink;
- TurboCooler;
11.Reliability of 96.5Sn-3.5Ag Lead-Free Solder-Bumped Wafer Level Chip Scale Package (WLCSP) on Build-Up Microvia Printed Circuit Board

机译：积层式微孔印刷电路板上96.5Sn-3.5Ag无铅焊锡晶圆级芯片级封装（WLCSP）的可靠性
- 作者：John H. Lau;S-W. Ricky Lee
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
12.Process for Fabricating Dense, Chips-First MCMs With Thinned Die

机译：带有薄芯片的密集，芯片优先MCM的制造工艺
- 作者：John J. LeBlanc;Richard P. Tumminelli;Mark C. Singleton;Edward P. Ayers;Jason F. Haley;George V. Ives;Andrew D. Dineen
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- multi-chip module (MCM);
- deposited metal;
- thinned die;
- laser-drilling;
- laminated polymer dielectric;
- thermal shock;
13.Room Temperature Flip Chip Assembly of CdZnTe Pixel Detector Arrays

机译：CdZnTe像素检测器阵列的室温倒装芯片组件
- 作者：George A. Riley;Steven Bornstein
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- flip chip assembly;
- detector arrays;
- pixel detectors;
- low temperature adhesives;
- cadmium zinc telluride;
- pyroelectric film detectors;
14.Increasing Yields in High-Density MCM-C Substrate Manufacturing

机译：高密度MCM-C基板制造中的良率提高
- 作者：Tom Hospod
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
15.Investigation into the Effects of Temperature Cycling upon the Solder Joint Connections at the Board level of a Variety of CSP Packages

机译：在各种CSP封装的板级上研究温度循环对焊点连接的影响
- 作者：Irv Memis;ob Sullivan
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
16.New Photoimageable LTCC Technology for Making a Wide Range of Ceramic Architectures and Circuits

机译：新型的可光成像的LTCC技术，可用于制造各种陶瓷结构和电路
- 作者：Barry E Taylor;Larry Bidwell;Angela Lawrence
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- photoimageable;
- low temperature cofired ceramic (LTCC);
- 951 green tape~(TM);
- PI-LTCC;
17.A Practical Example of Using Discrete Green's Functions to Predict the Temperature of an Array of Components

机译：使用离散格林函数预测组件阵列温度的实际示例
- 作者：Roy Zeighami
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
18.A Novel Low-Cost Pluggable Chip Scale Package for High-Pin-Count Applications

机译：适用于高引脚数应用的新型低成本可插拔芯片级封装
- 作者：S.W. Crane;James Jeon;Charley Ogata;Ton Wang;Andreas Cangellaris;Jose Schutt-Aine
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
19.A new Wafer Level Chip Size MCM-D Technology for Cellular Applications

机译：适用于蜂窝应用的新型晶圆级芯片尺寸MCM-D技术
- 作者：Marc de Samber;Co van Veen;Marc van Delden;Robert Milsom;Nick Pulsford
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- MCM-D;
- wafer level packaging;
- chip size packaging;
- passive integration;
- telecom applications;
20.A High-Density, Resin-Coated-Foil (RCF) Substrate Utilizing Mask and Direct-Write UV Laser Photolithography

机译：利用掩模和直接写入UV激光光刻技术的高密度树脂涂层箔（RCF）基板
- 作者：Scott Corbett;Edward Swenson;Jeff Strole;Bill Beck;John Yarno;Thayer Hughes
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- RCC~(TM) foil;
- RCF;
- laser;
- flex circuit;
- substrate;
- microvia;
- direct-write;
- multi-layer;
- polyimide;
- HDI;
21.Microminiature High-Density System Modules for Space Use

机译：用于空间的超小型高密度系统模块
- 作者：Noriko Yamada;Satoshi Kuboyama;Sumio Matsuda
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- space application;
- system module;
- FCA;
- 3D packaging;
- interconnection;
- build-up PWB;
22.Assembly and Reliability of Flip Chip-on-Laminate with Lead Free Solder

机译：无铅焊接的覆晶倒装芯片的组装和可靠性
- 作者：Zhenwei Hou;Casey Hatcher;Erin Yaeger;Mark Konarski;Larry Crane;R. Wayne Johnson
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- flip chip;
- lead-free;
- assembly;
- reliability;
23.Application Study of High Speed Separable Interconnect for High Density Area Array Packaging

机译：高速可分离互连在高密度面阵封装中的应用研究
- 作者：James Rathburn
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
24.Characteristics of miniatured VCO(Voltage Controlled Oscillator) for IMT-2K using MCM-C Technology

机译：使用MCM-C技术的IMT-2K的微型VCO（压控振荡器）的特性
- 作者：C. S. Yoo;Y. S. Lee;W. S. Lee;S. B. Kwak;N. K. Kang;J. C. Park
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- VCO;
- buried type passive components;
- low loss glass/ceramic material;
- high Q;
25.Control of warpage during build-up of multilayered high-density wiring with stiff and low-CTE base substrates

机译：控制具有刚性和低CTE基础基板的多层高密度布线建立期间的翘曲
- 作者：Sounak Banerji;P. Markondeya Raj;Ken-ichi Shinotani;Mancheol Seo;Carl Zweben;Swapan K. Bhattacharya;Rao R.Tummala
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
26.Controlled PEMs, A High Density Packaging Solution for Space

机译：受控PEM，一种高密度的太空包装解决方案
- 作者：Mary C. Massey;William E. McMullen;Wennei Chen;Brian E. Parrish;Zoltan A. Szalontai
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
27.Distributed Elements and MM-Wave Characterization of Low Cost MCM-D Substrates

机译：低成本MCM-D基板的分布元素和MM波表征
- 作者：Janusz Grzyb;Didier Cottet;Gerhard Troester
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- microstrip and slot antennas;
- MCM-D technology;
- large area panel processing (LAP);
28.An Integrated Tool for Fabrication of Electronic Components by Laser Direct-Write

机译：激光直写制造电子元件的集成工具
- 作者：Scott A. Mathews;Michael T. Duignan;David N. Wells;Paolina Atanassova;Toivo Kodas
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- laser direct write;
- MAPLE-DW;
- laser forward transfer;
- mesoscale patterning;
- integrated passives;
- laser micromachining;
29.Gold to Gold Thermosonic Flip-Chip Bonding

机译：金对金热超声倒装芯片键合
- 作者：L. K. Cheah;Y. M. Tan;J. Wei;C. K. Wong
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- lead-free;
- fluxless process;
- flip-chip and thermosonic bonding;
30.Direct Metalization for Semiconductors, Interposers and Active Devices

机译：半导体，中介层和有源器件的直接金属化
- 作者：Phillip D. Stapleton
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- autocatalytic;
- electroless;
- metalization and suicides;
31.High Density LTCC Technology, Using Photo Patterned Conductors

机译：高密度LTCC技术，使用光图案化导体
- 作者：Michael Ehlert;Peter Barnwell
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- high density;
- LTCC;
- wireless;
- microwave;
- thick film;
32.Cyanate-Bismaleimide-Epoxy Resin Compositions for Flip Chip, BGA and CSP Pre-Encapsulation

机译：用于倒装芯片，BGA和CSP的预封装的氰酸盐-铋-丙二酰亚胺-环氧树脂组合物
- 作者：Y. Joon Lee;Howard A. Lenos;Robert V. Burress;M. Albert Capote
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- CBE resin;
- pre-encapsulant;
- screen-printability;
- laminate;
- laser-drilling;
33.Thermal Modeling and Mechanical Analysis of Very Thin Silicon Chips for Conformal Electronic Systems

机译：保形电子系统中非常薄的硅芯片的热建模和力学分析
- 作者：Jedediah J Young;Ajay P Malshe;W.D. Brown;Timothy Lenihan;Douglas Albert;Volkan Ozguz
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
34.THINKING LIKE A START-UP

机译：像初学者一样思考
- 作者：Spencer Murrell
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
35.A study of the interconnection by conductive paste in ALIVH~R-FB substrate

机译：ALIVH〜R-FB基板中导电胶互连的研究
- 作者：Satoru TOMEKAWA;Takeshi SUZUKI;Yasuhiro NAKATANI;Fumio ECHIGO;Daizo ANDOH
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- conductive paste;
- metallic bond;
- ALIVH substrate;
- compressibility ratio;
36.A Prototype for Time-based Parallel Inspection of Substrate Networks

机译：基于时间的基板网络并行检查的原型
- 作者：Aranggan Venkataratnam;Kimberly E. Newman;David C. Keezer
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- MCM Substrate Test, High Density Interconnect Test, FPGA and VHDL;
37.Practice report on a high volume consumer MCP and substrate selection

机译：大量消费者MCP和基材选择的实践报告
- 作者：Georg Meyer-Berg;Desmond Chin;Sven-Tuve Persson;Albert Achen
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- FCM;
- substrate;
- cost;
- yield;
- packaging;
- thin film;
- BCB;
38.VERY HIGH SPEED 3D 'SYSTEM IN PACKAGE'

机译：极高速度的3D“打包系统”
- 作者：Christian VAL;Marie-Cecile VASSAL;Olivier LIGNIER;Michel MARDIGUIAN
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
39.Thermal Design Considerations for Portable DLP~(TM) Projectors

机译：便携式DLP〜（TM）投影仪的散热设计注意事项
- 作者：Scott P. Overmann
- 会议名称：《》 | 2001年
- thermal management;
- portable;
- projector;
- DLP~(TM);
- DMD~(TM);
40.Stress Engineered Metal Interconnects

机译：应力工程金属互连
- 作者：David K. Fork;Christopher Chua;Lai Wong;Andrew S. Alimonda;Donald L. Smith;Mitul Modi;Qi Zhu;Lunyu Ma;Suresh Sitaraman
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- interconnects;
- packaging;
- probing;
- sputtering;
- thin film;
- stress;
41.Redundant Fan Strategies; A Quantitative Approach

机译：冗余粉丝策略；定量方法
- 作者：Maurice Holahan
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- fault tolerant;
- hot swap;
- cooling redundancy;
- N+l;
- fan;
- airflow;
- acoustic;
- electronics cooling;
- FNM;
- flow network modelling;
- network analysis;
- packaging;
- thermal management;
- thermal;
- mission critical;
42.Rapid Inductance Extraction of Complex Trace Structures

机译：复杂痕量结构的快速电感提取
- 作者：Jack Ou;M. F. Caggiano
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- FPBGA, parasitic inductance, signal integrity, parasitic extraction.;
43.Novel electroless bumping technologies for MCM-D: bumping of single chips and straight-wall bumping on Cu metallisations

机译：适用于MCM-D的新型化学碰撞技术：单芯片碰撞和Cu金属化上的直壁碰撞
- 作者：Herbert De Pauw;J. Vanfleteren;J. De Baets;A. Van Calster
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- interconnection;
- bumping;
- electroless;
- flip-chip;
- technology;
44.Plasma Processing of High Density Vias in Compliant Wafer Level Package

机译：符合晶圆级封装的高密度通孔的等离子体处理
- 作者：Yiming Li;Chirag S. Patel;Dennis Hess;Kevin Martin;James Meindl
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- wafer level package;
- plasma process;
- high density vias;
45.Optimization of the Fan-Heat Sink Systems in Portable Electronics Environment

机译：便携式电子环境中的风扇散热器系统的优化
- 作者：C.K. Loh;Dan Nelson;D.J. Chou
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- thermal resistance;
- gap/length ratio;
- pressure drop;
- optimization and fan-heat sink system;
46.Structure-Property Relations of Photosensitive Polynorbornene Based Dielectric

机译：光敏聚降冰片烯基介电材料的结构性质关系
- 作者：Yiqun Bai;Punit Chiniwalla;Paul A. Kohl;Sue Ann Bidstrup-Allen;Ed Elce;Rob Shick;Chris McDougall
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
47.Human factors issues in the design of handheld wireless devices

机译：手持无线设备设计中的人为因素问题
- 作者：Russell J. Branaghan
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
48.Integral Heater for Reworking High Density Interfaces

机译：集成加热器，用于返工高密度接口
- 作者：Mary C. Massey;William E. McMullen;Ryan S. Berkely
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
49.Integrated Passive Elements on Low Cost MCM-D Substrates

机译：低成本MCM-D基板上的集成无源元件
- 作者：Janusz Grzyb;Didier Cottet;Gerhard Troester
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- large area panelProcessing;
- MCM-D technology;
- integrated inductors and capacitors;
50.Loop Heat Pipe Technology for Electronics Cooling

机译：电子冷却回路热管技术
- 作者：Dmitry Khrustalev
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- loop heat pipe;
- capillary structure;
- electronics cooling;
- passive device;
51.New tools and methods for the thermal transient testing of packages

机译：封装热瞬态测试的新工具和方法
- 作者：Marta Rencz;Vladimir Szekely;A. Poppe;G.Farkas;B. Courtois
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
52.Microwave and Millimeterwave Transceivers for Radio Links and LMDS Communications - The Challenge for Technology and Packaging Strategy

机译：用于无线电链路和LMDS通信的微波和毫米波收发器-技术和封装策略的挑战
- 作者：Martin Oppermann
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- high frequency packaging;
- strategies;
- future electronics and materials;
- technology trends/roadmap;
53.A MLGA Connector for High Speed and High Density

机译：用于高速和高密度的MLGA连接器
- 作者：Young Soo Kim;Se 1;Kim;Hyun Seek Choi;Byung Hun Kum;Young Woo Ko;Hyo Jae Bang;Woo Kyung Kim;Junho Lee;Seungyong Baek;Junwoo Lee;Seungyoung Ahn;Joungho Kim
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- MLGA;
- passive component;
- high speed/high density connector;
54.Assembly and Reliability of 'Large Die' Flip-Chip Chip Scale Packages

机译：“大芯片”倒装芯片级封装的组装和可靠性
- 作者：Kevin Gaffney;Robert Erich
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- large die chip scale package;
- stacked die;
- flip chip assembly and flip chip reliability;
55.Design and Reliability Study of Lead Bonding Process in WAVE~(TM) Packages

机译：WAVE〜（TM）封装中引线键合工艺的设计和可靠性研究
- 作者：llyas Mohammed;Young-Gon Kim;Teck-Gyu Kang
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
56.Design Concepts for Small, Fine Pitch Modules Used in Compact Systems

机译：紧凑系统中使用的小型，细间距模块的设计概念
- 作者：Mark J. Kuzawinski
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- compact system design;
- thermal performance;
- circuit card wiring;
- electrical performance;
57.An Overview and Comparison of Viable Lead-Free Alloys

机译：可行的无铅合金概述与比较
- 作者：Karl Seelig;David Suraski
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- lead-free alloys;
- test results;
- comparative data;
- process;
- implementation;
58.Effects of SMT Solder Processes on Blind Via Integrity in Multilayer Polyimide Chips First MCMs

机译：SMT焊接工艺对多层聚酰亚胺芯片首批MCM的通孔完整性影响
- 作者：Caroline A. Kondoleon;John J. LeBlanc
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- chips first MCMs;
- polyimide;
- dielectric layer;
- moisture;
- solder process;
- electrical integrity;
59.AN ELASTIC FREE-FREE BEAM SUBJECTED TO TRANSVERSE IMPACT LOAD AT ONE END

机译：一端承受横向冲击载荷的弹性自由梁
- 作者：Zhongping Bao;Suresh Goyal;Subrata Mukherjee
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
60.Chip-MCM Co-design of a 14 GHz Low Noise Amplifier using the MCM-D Design Library

机译：使用MCM-D设计库的14 GHz低噪声放大器的Chip-MCM协同设计
- 作者：G. Carchon;K. Vaesen;S. Brebels;W. De Raedt;B. Nauwelaers;E. Beyne
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- MCM-D;
- integrated passives;
- LNA;
- co-design;
61.Buried Passives Used with Thick-Film Processes on Alumina for High Frequency Applications

机译：用于氧化铝的厚膜工艺中使用的埋入式无源器件，用于高频应用
- 作者：Randy Wu;Major Chi;Ken Wu;Fred Hyatt
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- integral passives;
- buried passives;
- thick film;
- alumina;
- dielectric constant;
- loss tangent;
62.Capabilities of A Flip Chip Defects Inspection Method by Using Laser Techniques

机译：激光技术检测倒装芯片缺陷的能力
- 作者：Sheng Liu;I. Charles Ume;Achyuta Achari;Juergen Gamalski
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
63.Comparison of the Interconnected Mesh Power System (IMPS) and Buried Stripline Interconnect Topologies

机译：互连网状电源系统（IMPS）和埋入式带状线互连拓扑的比较
- 作者：Leonard W. Schaper;Michael D. Glover
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- IMPS;
- power distribution;
- crosstalk;
- substrate topology;
- signal integrity;
64.Electrical Measurement, Modeling and Analysis for High-Speed and High-Density IC Package Design

机译：高速和高密度IC封装设计的电气测量，建模和分析
- 作者：Dong-Hun (Peter) Shin;Michael E. Brenneman;Byong-Su(Brian) Seol;Young-Gon Kim
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年
- BGA;
- package;
- parasitics;
- electrical measurement;
- electrical modeling;
- simulation;
65.Failure Mechanism of Thermal Fatigue and Improvement of Solder Joints in Microelectronic Packaging

机译：微电子封装中的热疲劳破坏机理和焊点的改进
- 作者：Ma Jusheng;Wang Qian;Chen Guohai;Huang Le
- 会议名称：《2001 HD International Conference on High-Density Interconnect and Systems Packaging Apr 17-20, 2001, Santa Clara, California》 | 2001年