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International Wafer Level Packaging Conference

召开年：2018
召开地：San Jose(US)
出版时间：-

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1.Fabrication of Redistribution Structure Using Highly Reliable Photosensitive Polyimide for Fan Out Panel Level Packages

机译：使用高度可靠的光敏聚酰亚胺来制造再分配结构，用于扇出面板水平封装
- 作者：Hitoshi Araki;Yu Shoji;Yuki Masuda;Keika Hashimoto;Kazuyuki Matsumura;Yutaro Koyama;Masao Tomikawa
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Polyimides;
- Surface treatment;
- Glass;
- Coatings;
- Plating;
- Reliability;
- Resistance;
2.Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration

机译：低密度扇出SIP用于带有异质集成的可穿戴设备和物联网
- 作者：A. Martins;M. Pinheiro;A. F. Ferreira;R. Almeida;F. Matos;J. Oliveira;Eoin óToole;H. M. Santos;M. C. Monteiro;H. Gamboa;R. P. Silva
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Sensors;
- Reliability;
- Radio frequency;
- Internet of Things;
- Packaging;
- Antenna accessories;
3.An Innovative Application of Fan-Out Packaging for Test Measurement-Grade Products

机译：用于测试和测量级产品的扇出包装的创新应用
- 作者：Barrett Poe
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
4.Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic Rf Mems/Cmos

机译：玻璃水平扇出用于单片RF MEMS / CMOS的高性能，低成本包装
- 作者：Rameen Hadizadeh;Anssi Laitinen;David Molinero;Nelson Pereira;Márcio Pinheiro
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Capacitance;
- Packaging;
- Radio frequency;
- Micromechanical devices;
- Reliability;
- Inductance;
- Mathematical model;
5.Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging

机译：使用替代图案化解决方案进行先进包装的精细RDL形成
- 作者：Habib Hichri;Markus Arendt;Richard Hollman;Ognian Dimov;Sanjay Malik
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Plating;
- Laser ablation;
- Surface treatment;
- Packaging;
- Thermal stability;
- Metals;
- Polyimides;
6.Advanced EWLB (Embedded Wafer Level Ball Grid Array) Solutions for Mmwave Applications

机译：MMWAVE应用的高级EWLB（嵌入式晶圆级别球电网阵列）解决方案
- 作者：Dian Wang;Fazhi An;Seung Wook Yoon
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Packaging;
- Automotive engineering;
- Radar;
- Performance evaluation;
- Reliability;
- Sensors;
- Integrated circuits;
7.Fan-Out Wafer Processing In The High Density Packaging Era

机译：在高密度包装时代的扇出晶片加工
- 作者：David Butler;Chris Jones;Steve Burgess;Tony Wilby;Paul Densley
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Metals;
- Performance evaluation;
- Plasma temperature;
- Substrates;
- Silicon;
- Passivation;
- Throughput;
8.Advancing Advanced Process Control in Backend Factories

机译：推进后端工厂的高级过程控制
- 作者：Ben Williams;Todd Nowalk;Chris Reeves
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Tools;
- Process control;
- Data collection;
- Production facilities;
- TCPIP;
- Temperature sensors;
9.Exposed Die Fan-Out Wafer Level Packaging by Transfer Molding

机译：通过转印成型暴露的模具扇出晶片水平包装
- 作者：S.H.M. Kersjes;J.L.J. Zijl;N. de Jong;H. Wensink
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Electromagnetic compatibility;
- Clamps;
- Transfer molding;
- Force;
- Tools;
- Wafer scale integration;
- Dynamics;
10.High Speed 3D Inspection of Advanced Package Interconnect Uniformity

机译：高速3D检查高级包互连均匀性
- 作者：Zonghu He;John Schaefer
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Three-dimensional displays;
- Inspection;
- Throughput;
- Copper;
- Semiconductor device measurement;
- Cameras;
- Lasers;
11.Advanced Packaging Metrology And Lithography That Overcomes FOWLP/FOPLP Die Placement Error

机译：克服Fowlp / Foplp模具放置误差的先进包装计量和光刻
- 作者：Keith Best;Mike Marshall
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Metrology;
- Software;
- Lithography;
- Throughput;
- Packaging;
- Measurement uncertainty;
- Time measurement;
12.Wave Front Phase Imaging of Wafer Warpage

机译：晶圆翘曲的波前相成像
- 作者：Juan Trujillo;Jose Manuel Ramos Rodrigues
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Optical surface waves;
- Surface waves;
- Microscopy;
- Lenses;
- Mirrors;
- Surface topography;
13.Chip Board Interaction Analysis of 22-NM Fully Depeleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)

机译：晶圆级包装绝缘子（FD-SOI）技术22-NM全闭硅的芯片板相互作用分析（WLP）
- 作者：Jae Kyu Cho;Jens Paul;Simone Capecchi;Dirk Breuer;Frank Kuechenmeister;Doug Scott;JongJin Choi;Wonjoon Kang
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Silicon;
- Testing;
- Wafer scale integration;
- Reliability;
- Metallurgy;
- Temperature measurement;
- Performance evaluation;
14.Thermal Debonding and Warpage Adjust of Fowlp - A Crucial Step in the Evolution of Advanced Packaging?

机译：热剥离和翘曲调整Fowlp - 一种先进包装演进的关键步骤？
- 作者：Sophia Oldeide;Regine Beckmann;Laurent Giai-Miniet;Klemens Reitinger
- 会议名称：《International Wafer Level Packaging Conference》 | 2018年
- Compounds;
- Silicon;
- Temperature sensors;
- Packaging;
- Force;
- Temperature distribution;