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Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit

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1.Degradation of Optical Performance of Fiber Optic Connectors in a Manufacturing Environment

机译：制造环境中光纤连接器光学性能的劣化
- 作者：T. Berdinskikh;N. Albeanu;S. Stafford;D. Silmser;H. Tkalec;J. Nguyen
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
2.How to Take Care of Loyal Customers

机译：如何照顾忠诚的客户
- 作者：N.T. Bala Balakrishnan
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
3.Non-Telecom Optoelectronics

机译：非电信光电子
- 作者：Alan Rae
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
4.Lean and Continuous Improvement

机译：精益和持续改进
- 作者：Dirk Hooiman
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
5.Usage of Ion Chromatography with Localized Extraction in Residue Analysis

机译：残留分析中局部萃取离子色谱法的使用
- 作者：Terry Munson
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
6.Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance

机译：刮刀与泵技术：焊膏打印性能的比较
- 作者：Anand Bhosale;Alden Johnson;Gerald Pham-Van-Diep
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
7.End-of-Life Management of Electronics Products Through Functional Signature Analysis

机译：通过功能签名分析，电子产品终端管理
- 作者：G. Hulsken;B. Peeters;A.C. Brombacher;J.A. van den Bogaard;R.A. Ion;H.P. Wynn;D. Shangguan
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
8.When are Conductive Adhesives an Alternative to Solder?

机译：导电粘合剂是焊料的替代品吗？
- 作者：Ken Gilleo
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- conductive adhesives;
- silver;
- lead-free;
- low-temperature;
- Nanoelectronics;
- solderless;
- epoxy;
- degradation;
9.Transitioning from a Reactive to a Proactive Manufacturing Culture

机译：从反应性转变为主动制造培养物
- 作者：Joe Belmonte
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
10.Are Lead-free Assemblies Especially Endangered by Climatic Safety?

机译：无铅组件是否受气候安全性尤为危及？
- 作者：Andreas Muehlbauer;Helmut Schweigart;Umut Tosun;Stefan Strixner
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
11.Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D, 3D or Axisymmetric?

机译：BGA寿命预测倒装芯片球网格阵列套件的有限元分析：2D，3D或轴对称？
- 作者：Virendra Jadhav;Sanjeev Sathe
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
12.Through-Hole Assembly Options for Mixed Technology Boards

机译：混合技术板的通孔组装选项
- 作者：Ross B. Berntson;Ronald Lasky;Karl P. Fluke
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- Solder Preforms;
- Pin-In -Paste;
- Intrusive Reflow;
- Mixed Technology;
- Selective Wave Soldering;
- Through-Hole Connectors;
13.CAD Toolsets: Today, Tomorrow and Over the Horizon

机译：CAD工具：今天，明天和地平线
- 作者：Michael Fitts
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
14.High Phosphorous Electroless Nickel Process for Mobile Phone PWBs

机译：用于手机PWBS的高磷化学镍工艺
- 作者：Masahiro Nozu;Akira Kuzuhara;Atsuko Hayashi;Hiroshi Otake;Shigeo Hashimoto;Donald Gudeczauskas
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
15.Study of SMT Assembly Processes for Fine Pitch CSP Packages

机译：精细间距CSP包装SMT组装工艺的研究
- 作者：Minna Arra;David Geiger;Dongkai Shangguan;Jonas Sj?berg
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
16.Reliability of High Density, High Layer Count, Multilayer Backplanes

机译：高密度，高层计数，多层背板的可靠性
- 作者：Jeffrey C. Seekatz;Michael G. Luke
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
17.Lead Free Process Transition Solder Paste Characteristic Assessment

机译：无铅工艺过渡焊膏粘贴特征评估
- 作者：Robert Farrell;Steve Beck;Richard Garnick;Paul P.E. Wang;Ken Kochi
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
18.Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories

机译：沉浸式银PCB表面处理符合承销商实验室的实施
- 作者：Donald P. Cullen;Gerard OBrien
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
19.High Speed Interconnects: The Impact of Spatial Electrical Properties of PCB due to Woven Glass Reinforcement Patterns

机译：高速互连：PCB的空间电性能由于编织玻璃增强图案而影响
- 作者：Gary Brist;Bryce Horineds;Gary Long
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
20.Via in Pad Study Evaluating the Impact on Circuit Design, Board Layout, Manufacturing, Emissions Compliance and Product Reliability

机译：通过焊盘研究评估对电路设计，电路板布局，制造，排放合规性和产品可靠性的影响
- 作者：Bruce Hughes;Dana Bell;Holly Mote;Trevor Bowers;David Nelson Andy Gantt;Chuck Peltier
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
21.Design Considerations for Thin-Film Embedded Resistor and Capacitor Technologies

机译：薄膜嵌入式电阻和电容技术的设计考虑因素
- 作者：Percy Chinoy;Marc Langlois;Raj Hariharan;Mike Nelson;Anthony Cox;Tony Ridler
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
22.Electrical Characteristics of High Speed Materials

机译：高速材料的电气特性
- 作者：Eric Montgomery
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
23.An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability

机译：评估无铅装配过程对基础材料和PCB可靠性的影响
- 作者：Edward Kelley
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
24.A New Non-Halogen Flame-Retardant System for Printed Wiring Boards

机译：用于印刷线路板的新型非卤素阻燃系统
- 作者：Larry D. Timberlake;Mark V. Hanson;E. Bradley Edwards
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
25.High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes

机译：氧化物和氧化物替代过程的高频导体损耗撞击
- 作者：Gary Brist;Don Cullen
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
26.Analysis of Several Factors of No-Clean Solderpaste Residue Probeability

机译：若干无清渣残留缺损性因素分析
- 作者：John Stipp;Nick Cinquino;Karrie Mazurkiewicz;John Tuccy
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
27.Adhesive Deposit Performance Characterization using Standard X-ray Analysis Tools

机译：使用标准X射线分析工具的粘合剂沉积性能表征
- 作者：Mitsuru Kondo
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
28.Copper Electroplating Technology for Microvia Filling

机译：微米填充铜电镀技术
- 作者：Mark Lefebvre;George Allardyce;Masaru Seita;Hideki Tsuchida;Masaru Kusaka;Shinjiro Hayashi
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
29.Influence of Flux and Powder Morphology on Void Formation in Silicon Wafer Bumping

机译：助焊剂和粉末形态对硅晶片撞击空隙形成的影响
- 作者：Gloria Biard
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
30.Lead-Free Implementation: Drop-In Manufacturing

机译：无铅实施：制造业
- 作者：Jennie S. Hwang;Kaihwa Chew;Vincent Kho
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
31.Lead-Free Solder Bumping Technologies

机译：无铅焊料凸块技术
- 作者：I. S. Zavarine;O. Khaselev;Yun Zhang;C. Xu;C. Fan;J. Abys
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
32.Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis

机译：使用统计分析表征PCB电镀接电性可靠性
- 作者：Mark J. Tardibuono
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
33.Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component

机译：晶圆级CSP组件底板级可靠性改进底填充材料的评价
- 作者：A.C. Shiah;Tom Liu;Ken Lee;Y.S. Chen;C.S. Wang
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
34.Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance

机译：瞬态热谱对波焊过程对连接器性能的影响
- 作者：Alexandra L. M. Spitler;Robert D. Hilty
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
35.Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing

机译：对多个PWB /组件材料的无铅转换分析，并使用质量和可靠性测试完成
- 作者：Sammy Shina;Liz Harriman;Todd MacFadden;Donald Abbott;Richard Anderson;Helena Pasquito;George Wilkish;Marie Kistler;David Pinsky;Mark Quealy;Karen Walters;Richard McCann;Al Grusby
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
36.The 'Only Other' Sure Thing in Life

机译：生活中的“只有其他”肯定的事情
- 作者：Mike Hill
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
37.Phosphorus in Electroless Nickel Layers – Curse or Blessing?

机译：化学镀镍层磷 - 诅咒或祝福？
- 作者：Sven Lamprecht;Kuldip Johal;H.-J. Schreier;Hugh Roberts
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
38.A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly

机译：在SMT组件中的不同无铅合金和表面饰面的可靠性比较
- 作者：Jignesh Rathod;Daryl Santos;Prashant Chouta;Joe Belmonte;Alan Rae
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- Pb-free;
- Reliability;
- Lead-Pull;
- Microstructure Analysis;
- Intermetallics;
39.Using High Volume Electronics Manufacturing Technology to Develop a High Volume Fuel Cell Manufacturing Process

机译：采用大容量电子制造技术开发大量燃料电池制造工艺
- 作者：Alden Johnson;Gerald Pham-Van-Diep;Joe Belmonte
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
40.Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles

机译：聚合物超薄基板的性能用作嵌入式电容器：未填充和填充系统与铁电粒子的比较
- 作者：John Andresakis;Takuya Yamamoto;Pranabes Pramanik;Nick Buinno
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
41.Enhancing Interlaminar Bond Strength for High Performance Resin Systems and Liquid Photoimageable Soldermasks with an Organo-metallic Copper Surface Treatment Process

机译：用有机金属铜表面处理过程提高高性能树脂系统和液体光上可移动酱油的层间粘结强度
- 作者：Michael Carano;Lee Burger;Al Kucera;Roger Bernards
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
42.Liquid Solders for High Temperature Solder Joints

机译：高温焊点的液体焊料
- 作者：Mathias Nowottnick;Wolfgang Scheel;Klaus Wittke;Uwe Pape
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
43.Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications

机译：使用定期脉冲反向（PPR）用于电镀厚板应用
- 作者：Erik Reddington;Gary Hamm;Mark Kapeckas;Wade Sonnenberg;Leon Barstad;Mark Lefebvre;Ray Cruz
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
44.PCB Design Using the Metric System

机译：PCB设计使用度量系统
- 作者：Andrew Kowalewski
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
45.Continuous Improvement: Know Thy Customer: Customer Relationship Management Pays

机译：持续改进：了解您的客户：客户关系管理支付
- 作者：David Shaffer
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
46.Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing

机译：使用热循环测试焊接联合可靠性鉴定各种组件安装修改配置
- 作者：David Hillman;Jennet Kramerand;Bryan James
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
47.Drawing Note Generator

机译：绘图笔记生成器
- 作者：Karen McConnell;Harry Finocchiaro;Scott Park
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
48.Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation

机译：TIN晶须生长 - 基质效果了解CTE错配和IMC形成
- 作者：Y. Zhang;C. Fan;C. Xu;O. Khaselev;J. A. Abys
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- tin;
- tin whisker;
- whisker formation;
- temperature cycling;
- thermal cycling;
- CTE mismatch;
- intermetallic compound formation;
- compressive stress;
- tensile stress;
49.FPGA on Board

机译：FPGA在船上
- 作者：Rick Stroot
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
50.Lead-Free and Mixed Assembly Solder Joint Reliability Trends

机译：无铅和混合装配焊点可靠性趋势
- 作者：Jean-Paul Clech
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
51.Signal Integrity Analysis Techniques used to Characterize PCB Substrates

机译：信号完整性分析技术用于表征PCB基板的信号
- 作者：Sean S. Mirshafiei
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
52.Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures

机译：SMT封装作为共晶和无铅温度回流型材的函数的水分和回流敏感性评价
- 作者：Vijay Gopalakrishnan;Vivek Venkataraman;Robert Murcko;Krishnaswami Srihari;Scott J. Anson
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
53.Creating a New Optoelectronics Standard: Specifications for Process Carriers Used to Handle Optical Fibers in Manufacturing

机译：创建新的光电子化标准：用于处理制造中的光纤的过程载体规范
- 作者：Randy Heyler
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
54.Effects of Conductor Surface Condition on High Frequency Loss

机译：导体表面条件对高频损耗的影响
- 作者：Martin Bayes;Al Horn
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
55.Investigating Compliant Tooling Solutions within a Mass Imaging Process

机译：调查批量成像过程中的兼容工具解决方案
- 作者：Clive Ashmore
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
56.Creep of Sn-(3.5-3.9)wtAg-(0.5-0.8)wtCu Lead-Free Solder Alloys and Their Solder Joint Reliability

机译：蠕变的Sn-（3.5-3.9）wt％Ag-（0.5-0.8）Wt％Cu无铅焊料合金及其焊接接头可靠性
- 作者：John Lau;Walter Dauksher
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
57.Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing

机译：无铅焊接：DOE研究了解其对电子装配除盖的影响
- 作者：Mike Bixenman;Dirk Ellis;Steve Owens
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
58.Advanced Microvia Design

机译：先进的Microvia设计
- 作者：Happy Holden
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
59.Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces

机译：底部填充物和密封剂的喷射，用于在狭小空间中的高速分配
- 作者：Steven J. Adamson
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
60.Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach

机译：复杂电子组件的波浪焊接过程优化：实验方法的设计
- 作者：Subrahmania Janakiraman;Robert Murcko;Krishnaswami Srihari;Scott J. Anson;James Holton
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
61.Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers

机译：用传统的在线测试仪测试现代低压装置的问题及挑战
- 作者：Alan J. Albee
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
62.Test and Inspection of Lead-Free Assemblies

机译：无铅装配的测试和检查
- 作者：Michael J Smith
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
63.Dynamic Testing and Modeling for Solder Joint Reliability Evaluation

机译：焊接联合可靠性评估的动态测试和建模
- 作者：Phil Geng;James F. Maguire
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
64.Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses

机译：用于确定CSP设计和装配弱点的机械弯曲技术
- 作者：Mark R. Larsen;Ian R. Harvey;David Turner;Brent Porter;Jm Ortowski
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- PCB;
- cyclic bend testing;
- chip scale package;
- CSP;
- solder joint reliability;
- fatigue cracking;
- board flex sensitivity;
- tensile stress;
- surface mount;
- and delamination;
65.PCB Materials Behaviours towards Humidity and Impact of the Design, Finishes, Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability

机译：PCB材料对装配质量和焊接联合可靠性的设计，饰面，烘焙和装配过程的湿度和影响的影响
- 作者：Walter Horaud;Sylvain Leroux;Hélène Frémont;Dominique Navarro
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- ENIG;
- OSP;
- HASL;
- Im Sn;
- Im Ag;
- lead free;
- clean;
- no clean;
- wettability;
- spreading;
- voiding;
- aluminium bonding;
- design for reliability;
- moisture;
- baking;
- Fick's law;
- PCB material;
- paper;
- E-glass;
- aramid;
- phenol;
- epoxy;
- BT;
- polyimide;
- hydrocarbon;
66.Qualification of Stacked Microvia Boards for Handset Assembly

机译：手机装配堆积微型板的资格
- 作者：Mumtaz Y. Bora
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
67.Three-dimensional Simulations of Current Density Distributions for Patterned Wafers and PCB's

机译：图案晶圆和PCB的电流密度分布的三维模拟
- 作者：G. Nelissen;B. Van den Bossche;M. Purcar;J. Deconinck
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
68.Is That Splice Really Good Enough? Improving Fiber Optic Splice Loss Measurement

机译：那是拼接真的很好吗？改善光纤拼接损耗测量
- 作者：J. Meitzler;L.Wesson;P. Arrowsmith;R. Suurmann;M. Rodriguez;D. Gignac;S. Pradhan;J. Garren;J. Johnson;T. Watanabe;E. Mies
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- optoelectronics;
- optical fiber;
- fusion;
- splice;
- loss measurement;
- gage Ramp;
- R;
69.Decoupling with Anodized Ta

机译：用阳极氧化Ta去耦
- 作者：L Schaper;R. Ulrich;D. Mannath;J. Morgan;K. Maner
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
70.Flip Chip Connections Using Bumps, Wells, and Imprinting

机译：使用凸块，孔和印迹倒装芯片连接
- 作者：Peter C. Salmon
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
71.Comparing Digital and Analogue X-ray Inspection for BGA, Flip Chip and CSP Analysis

机译：比较BGA，倒装芯片和CSP分析的数字和模拟X射线检测
- 作者：David Bernard;Steve Ainsworth
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
72.Designing Embedded Resistors and Capacitors

机译：设计嵌入式电阻器和电容器
- 作者：Richard Snogren
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
73.Comparative Evaluation of AOI Systems

机译：AOI系统的比较评价
- 作者：Ashok Wadhwa;Bob Trinnes
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
74.Reliability Assessment of CSP Underfill Methods

机译：CSP底部填充方法的可靠性评估
- 作者：Mandar Painaik;Senthil Kanagavel;Daryl L. Santos
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- CSP;
- Underfill;
- and corner-fill;
75.Relationships of Copper Diffusion and Surface Oxide Formation to Tin Whisker Growth

机译：铜扩散与表面氧化物形成与锡须生长的关系
- 作者：P. Bush;G. L. Jones;I. Boguslavsky
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
76.'Built-In-Trace' Resistors

机译：“内置轨迹”电阻器
- 作者：Daniel Brandler
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
77.Embedded Passives in High Layer Count High Reliability Printed Wiring Boards

机译：高层嵌入式的无源电缆数量高可靠性印刷线路板
- 作者：Michael G. Luke;Jeffrey C. Seekatz
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
78.Lead and Lead-free Solder Project LCIA Characterization Methods

机译：铅和无铅焊料项目LCIA表征方法
- 作者：Maria Leet Socolof;Jack R. Geibig;Mary B. Swanson
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
79.New Materials for HDI Interconnect Applications

机译：HDI互连应用的新材料
- 作者：David Bedner;William Varnell;Gerhard Horst
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
80.A Comparative Study of Material Properties of SnPb and Leadfree Surface Finishes

机译：SNPB材料特性的比较研究和引线表面饰面
- 作者：C. Xu;C. Fan;Y. Zhang;E. Walsh;I. Zavarine;O. Khaselev;E. Kudrak;J. Abys
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
81.Process Capability Studies – The Better Way

机译：过程能力研究 - 更好的方法
- 作者：D.L. Santos;N. Msimang;S. Dogdu
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- Process Capability;
- Confidence Intervals;
- Electronics Manufacturing;
82.Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder

机译：使用无铅焊料的大型和复杂PCB的组装和返工过程的开发
- 作者：David A. Geiger;Jin Yu;Dongkai Shangguan
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- CCGA;
83.Deposition of Gold and Silver Surface Finishes Using Organic-Based Solutions

机译：使用基于有机的溶液沉积金银表面饰面
- 作者：Jinghua Sun;Eric Dahlgren;Dian Tang;Thomas OKeefe;Matthew OKeefe;Keryn Lian;Manes Eliacin
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
84.Enhancing the Performance of a Graphite Direct Metalization Process

机译：增强石墨直接金属化过程的性能
- 作者：Lee Burger;Roger Bernards;Michael Carano;Beth LaFayette
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
85.Process for Plugging Low to High Aspect Ratio Through-Holes with Polymer Thick Film Conductive Ink in Production Volumes

机译：用高分子厚膜导电油墨堵塞低至高纵横比通孔的工艺
- 作者：Michael OHanlon;Lynne Dellis
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
86.The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB

机译：用于PWB的新开发的浸入银涂层的化学和性质
- 作者：Yung-Herng Yau;Chonglun Fan;Chen Xu;Anthony Fiore;Karl Wengenroth;Joe Abys
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
87.NEMI Cost Analysis: Optical Versus Copper Backplanes

机译：NEMI成本分析：光学与铜背板
- 作者：Adam T. Singer;Nancy Chiarotto;David Godlewski;Kurt Wachler;Peter Arrowsmith;Harry Lucas;Gary Hoeppel;Dave Haas;David L. Wolf;John T. Fisher
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
88.Effect of Lead-Free Alloys on Voiding at Microvia

机译：无铅合金对微米血管无铅的影响
- 作者：Arnab Dasgupta;Benlih Huang;Ning-Cheng Lee
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
- solder;
- soldering;
- lead-free;
- void;
- voiding;
- microvia;
- surface mount;
- reflow;
89.Thermal Mechanical Analysis T-260 Printed Wiring Board Testing

机译：热机械分析T-260印刷线路板测试
- 作者：William Varnell;Helen Enzien
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
90.A Fast, Precise and Reproducible QC-Rheometry Routine for Solder Paste

机译：用于焊膏的快速，精确和可重复的QC-流变学常规
- 作者：Ineke van Tiggelen-Aarden
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
91.Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages

机译：用于细间距和堆叠模具BGA包装的无铅焊接环氧树脂模具化合物的研制
- 作者：Chinnu Brahatheeswaran
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
92.Design and Development of a High Performance Wirebond BGA Package

机译：设计与开发高性能线路BGA包装
- 作者：Clifford R Fishley;Abi Awujoola;Len Mora;Alex Lacap
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
93.Wafer Applied Underfill: Flip Chip Assembly and Reliability

机译：晶圆应用底部填充物：倒装芯片组装和可靠性
- 作者：Wayne Johnson;Qing Wang;Fei Ding;Zhenwei Hou;Larry Crane;Hao Tang;Gary Shi;Renzhe Zhao;Jan Danvir;Jing Qi
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
94.Improved Electrical Properties of Epoxy Molding Compound and Circuit Board Materials Using Halogen-Free Flame Retardant Systems

机译：使用无卤素阻燃系统改善环氧模塑化合物和电路板材料的电性能
- 作者：Alan Rae
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
95.Solder Preforms: Increasing Automated Placement Efficiency

机译：焊料预制件：增加自动放置效率
- 作者：Mitch Holtzer;Chrys Shea;Patrick Lusse
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年
96.Harsh Environment vs. Environmentally-Friendly Electronics

机译：恶劣的环境与环保电子产品
- 作者：Alan Rae
- 会议名称：《Association Connecting Electronics Industries Printed Circuits Expo, APEX and Designers Summit》 | 2004年