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Annual international wafer-level packaging conference & tabletop exhibition

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1.MINIATURIZED WLP FOR MEMS

机译：MEMS的小型化WLP
- 作者：Risto Mutikainen;Sami Nurmi;Tapani Alander;Esko Siren;Lic. Tech;Heikki Kuisma
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- MEMS packaging;
- WLP;
- flip chip;
2.ENABLING COMPREHENSIVE AND EFFICIENT TEST OF 3D CHIPS BY STANDARDIZING THE TEST ACCESS ARCHITECTURE

机译：通过标准化测试访问架构，实现对3D芯片的全面和高效的测试
- 作者：Al Crouch
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- 3D chips;
- chip test;
- TSV;
- through-silicon vias;
3.WAFER LEVEL PACKAGING: A FOUNDRY PERSPECTIVE

机译：晶圆级包装：铸造透视
- 作者：Michael Shillinger
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
4.DEVELOPMENT OF AN EIGHT-DIE NAND LSOP PACKAGE

机译：开发八模NAND LSOP包装
- 作者：Ke Xiao;Junfeng Zhao;Lefei Zhang;Mao Guo;Yong She;Yinglong Song;Eagle Lin;Dennis Chang;MJ Chen
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- LSOP;
- low cost;
- NAND packaging;
5.DEPTH MEASUREMENT OF THROUGH SILICON VIA BY USING IR CONFOCAL MICROSCOPE

机译：通过使用IR共聚焦显微镜通过硅通过硅的深度测量
- 作者：Deh-Ming Shyu;Wei-Te Hsu;Yi-Sha Ku
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- laser scanning confocal microscope;
- through silicon via;
- infrared light source;
6.SINGLE SIDED WAFER THINNING FOR 3D INTEGRATION

机译：用于3D集成的单面晶圆变薄
- 作者：Ricardo I. Fuentes
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- chemical thinning;
- etching;
- stress relief;
- waveetch;
- linear scan;
7.FLIP CHIP DIE BONDING: AN ENABLING TECHNOLOGY FOR 3DIC INTEGRATION

机译：倒装芯片模切：用于3DIC集成的启用技术
- 作者：Keith A. Cooper;Michael D. Stead;Gilbert Lecarpentier;Jean-Stephane Mottet
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- 3D integration;
- TSV;
- bonding;
- oxide removal;
- KGD;
8.MECHANICAL BEHAVIOR MEASUREMENT OF SI WAFER

机译：Si晶片的力学行为测量
- 作者：Po-Yi Chang;Yi-Sha Ku
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- fringe reflection;
- warpage;
- surface measurement;
9.NONDESTRUCTIVE CHARACTERIZATION OF CRITICAL FAILURES IN 3D INTEGRATIONS USING COMPUTED TOMOGRAPHY

机译：使用计算机断层扫描的三维集成临界失败的无损特性
- 作者：Gyujei Lee;Kang-won Lee;Hyun-joo Kim;Suk-woo Jeon;Kwang-yoo Byun;Hae-bong Park
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
10.SCALABLE INTERCONNECT TECHNOLOGY THAT ENABLES HIGH DENSITY, HIGH PERFORMANCE AND LOW PROFILE CONNECTIVITY FOR BOARD TO BOARD, PACKAGE TO BOARD AND BOARD TO FLEX APPLICATIONS

机译：可扩展的互连技术，使电路板的高密度，高性能和低轮廓连接，封装到板和电路板以实现Flex应用
- 作者：Amit Varma;Ming Wu;Charlie Stevenson
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- LGA connector;
- space transformer;
- board to board;
- interposer;
- BGA;
11.THE MEMS APPROACH FOR MAKING A LOW COST, HIGH SENSITIVITY MAGNETIC SENSOR

机译：低成本，高灵敏度磁传感器的MEMS方法
- 作者：Alan S. Edelstein;Greg A. Fischer;James E. Burnette;William F. Egelhoff
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- magnetic sensor;
- MEMS;
- 1/f noise;
12.EMBEDDED ACTIVE DEVICE PACKAGING TECHNOLOGY FOR REAL DDR2 MEMORY CHIPS

机译：嵌入式有源器件包装技术，用于真实DDR2内存芯片
- 作者：Yin-Po Hung;Tao-Chih Chang;Ching-Kuan Lee;Yuan-Chang Lee;Jing-Yao Chang;Chao-Kai Hsu;Shu-Man Li;Jui-Hsiung Huang;Fang-Jun Leu;Yu-Wei Huang;Ren-Shin Cheng;Tai-Hong Chen
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- DRAM;
- embed;
- active device;
- package;
13.3D SUBSTRATE INNOVATION FOR VERY FINE PITCH FLIP-CHIP APPLICATIONS

机译：3D基板创新为非常细小的俯仰倒装芯片应用
- 作者：Vern Solberg;Vage Oganesian
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- μPILR;
- flip-chip;
- substrate;
- interposer;
14.RELIABILITY ANALYSIS OF 3D DISPENSABLE INTERCONNECTS FOR A SYSTEM IN A PACKAGE SOLUTION

机译：包解决方案中系统3D可分解互连的可靠性分析
- 作者：Suzette K. Pangrle;Jeff S. Leal;Scott McGrath;Grant Villavicencio;Keith Barrie;DeAnn Melcher;Sartaj Ajrawat;John Bray;Elizabeth Hankes;Jeff Leff;Elmer DelRosario;Marc Robinson;Sunil Kaul;Ken Holcomb;Catherine Shearer;Mark Kowalski;Anna Hall
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- 3D integration;
- reliability;
- edge interconnects;
15.DEMONSTRATION OF ULTRA-THIN SI GRINDING PROCESS CONTROLLED BY IN-SITU NON-CONTACT GAUGE FOR 3D STACKED IC (3D-SIC)

机译：用原位非接触量表控制3D堆积IC（3D-SIC）控制超薄SI研磨过程的示范
- 作者：Ming Zhao;Greet Verbinnen;Anne Jourdain;Eric Beyne;Bart Swinnen;Leonardus Leunissenimec vzw;Shinji Yoshida;Susumu Hayakawa;Tomotaka Tabuchi
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- 3D-SIC;
- grinding;
- non-contact gauge (NCG);
16.THE ENCAPSULATION OF MEMS/SENSORS AND THE REALIZATION OF MOLDED VIAS ON PACKAGE LEVEL AND WAFER LEVEL WITH FILM ASSISTED MOLDING

机译：MEMS /传感器的封装以及薄膜辅助模制品对封装水平和晶片水平的模塑通孔的实现
- 作者：Ton van Weelden;Lingen Wang
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- film assisted technology;
- MEMS and sensor encapsulation;
- wafer level molding;
- thru-mold via;
17.Cu PILLAR ELECTROPLATING PROCESS CONTROL FOR WAFER LEVEL PACKAGING

机译：铜柱电镀过程控制晶圆级包装
- 作者：Jim Zhang;Richard Hollman;Zhenqiu Liu;Arthur Keigler
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
18.LAMINATE BASED FAN-OUT EMBEDDED DIE TECHNOLOGIES: THE OTHER OPTION

机译：基于层压板的扇出嵌入式模具技术：其他选择
- 作者：Theodore (Ted) G. Tessier;Mark Dhaenens;David Clark;Tanja Karila;Tuomas Waris
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- embeddable die customization?;
- EDC?;
- redistribution;
- laminate embedded die fan-out packaging;
- iBGA~?;
- iQFN~?;
- iSiP~?;
19.COST COMPARISON FOR FLIP CHIP, WIRE BOND, AND WAFER LEVEL PACKAGING

机译：倒装芯片，线键和晶片级包装的成本比较
- 作者：Chet A. Palesko;Amy J. Palesko;E. Jan Vardaman
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- cost modeling;
- trade offs;
- wafer level packaging;
- flip chip;
- wire bond;
20.ELECTRICAL, THERMAL AND MECHANICAL CHARACTERIZATION OF eWLB (EMBEDDED WAFER LEVEL BGA)

机译：EWLB的电气，热和机械表征（嵌入式晶圆级BGA）
- 作者：Seung Wook Yoon;Meenakshi Prashant;Gaurav Sharma;Roger Emigh;Kai Liu;Sin Jae Lee;Ray Coronado;Yeong J. Lee;Rajendra Pendse
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
21.FINE PITCH 3D DISPENSABLE ELECTRICAL INTERCONNECTS FOR SYSTEM IN PACKAGE SOLUTIONS

机译：包装解决方案中系统的细距3D可分配电互连
- 作者：Jeff S. Leal;Suzette K. Pangrle;Charles Whyte;Keith Barrie;Jeff Leff;Scott McGrath;Gerardo Ayala
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- 3D integration;
- edge interconnects;
- SIP;
- printed electronics;
22.TECHNOLOGY SOLUTIONS FOR A DYNAMIC AND DIVERSE WLCSP MARKET

机译：动态和多样化WLCSP市场的技术解决方案
- 作者：Ravi Chilukuri
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- WLCSP;
- BLR;
- CSP~(n3);
- CSP~(n2) CSP~(n1);
23.INTEGRATION OF ELECTROGRAFTED LAYERS FOR THE METALLIZATION OF DEEP TSVS

机译：电解层对深度TSV的金属化的整合
- 作者：C. Truzzi;S. Lerner;F. Raynal;V. Mevellec;N. Frederich;D. Suhr;I. Bispo;B. Couturier
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- through silicon vias;
- TSV;
- electrografting;
- chemical grafting;
- polymer dielectric;
- ECD;
24.DEVELOPMENT OF NEXT GENERATION eWLB (EMBEDDED WAFER LEVEL BGA) PACKAGING

机译：开发下一代EWLB（嵌入式晶圆级BGA）包装
- 作者：Seung Wook Yoon;Yaojian Lin;Pandi Chelvam Marimuthu;Rajendra Pendse;Ganesh V. P;Andreas Bahr;Thorsten Meyer
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
25.WAFER BONDING PROCESS SELECTION

机译：晶圆键合工艺选择
- 作者：E. Pabo;T. Tang;V. Dragoi;T. Matthias
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- wafer bonding;
- process selection;
26.3D WAFER LEVEL PACKAGING OF MICRO CAMERA DEVICES

机译：3D微相机设备的晶圆级包装
- 作者：Martin Wilke;Kai Zoschke;Julia Roder;Veronika Glaw;Michael Topper;Ingrid Kuna;Karin Samulewicz;Oswin Ehrmann;Klaus-Dieter Lang;Herbert Reichl
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- TSV;
- image sensors;
- wafer level camera;
- polymer insulated TSV;
- spin coated TSV;
27.LOW COST, HIGH DENSITY CHIP-LAYER VIAS FOR CHIPS-FIRST STACKED PACKAGES

机译：低成本，高密度芯片层，用于芯片 - 第一堆叠封装
- 作者：James E. Kohl;Charles W. Eichelberger;S. Keith Phillips;Nancy G. Perkins
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- chips-first;
- system-in-a-package;
- SiP;
- 3D-SiP;
- thermal management;
28.WAFER LEVEL EMBEDDED SYSTEM IN PACKAGE (WL-ESiP) FOR 3D SiP SOLUTION

机译：用于3D SIP解决方案的包装（WL-ESIP）中的晶圆级嵌入式系统
- 作者：In-Soo Kang;Gi-Jo Jung;Byoung-Yool Jeon;Jae-Hyouk Yoo;Byeung-Gee Kim
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- WL-eSiP;
- wafer level molding;
- 3D SiP;
- mobile;
29.EWLB SYSTEM IN PACKAGE - POSSIBILITIES AND REQUIREMENTS

机译：ewlb系统在包装中 - 可能性和要求
- 作者：Thorsten Meyer;Gerald Ofher;Christian Geissler;Klaus Pressel
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- eWLB;
- fan-out WLB;
- wafer level package;
- SiP;
- system in package;
- side by side;
30.SITE-SPECIFIC ANALYSIS OF ADVANCED PACKAGIN( ENABLED BY FOCUSED ION BEAMS (FIB)

机译：特定于先进包装的特定分析（通过聚焦离子束（FIB）启用
- 作者：Richard J. Young;Chad Rue;Michael Schmidt;Ruud Schampers;David Wall
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- packaging;
- cross-section;
- site specific;
- focused ion beam;
- FIB;
31.COST EFFECTIVE WAFER LEVEL ENCAPSULATION FOR MEMS AND OTHER CIRCUIT ELEMENTS

机译：用于MEMS和其他电路元件的经济高效的晶圆级封装
- 作者：Jay Mitchell;Sangwoo Lee;Warren Welch;Khalil Najafi
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- wafer-level;
- packaging;
- solder;
- vertical feedthroughs;
- hermetic;
32.WAFER LEVEL PROCESSING AND INTEGRATION TECHNIQUES FOR CMOS IMAGE SENSOR MODULE MANUFACTURING

机译：CMOS图像传感器模块制造的晶片级处理和集成技术
- 作者：Bioh Kim;Thorsten Matthias;Gerald Kreindl;Viorel Dragoi;Markus Wimplinger;Paul Lindner
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- CMOS image sensor;
- wafer-level camera;
- wafer-level optics;
- wafer-level processing and integration;
33.EXPLORATION OF MIGRATION AND STRESS EFFECTS IN POPS CONSIDERING INHOMOGENEOUS TEMPERATURE DISTRIBUTION

机译：考虑不均匀温度分布的流行脉冲中迁移和应力效应的探讨
- 作者：L. Meinshausen;K. Weide-Zaage
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- bump;
- electromigration;
- void growth;
- reliability;
- heat sources;
34.DESIGN METHODS FOR 3D IC INTEGRATION

机译：3D IC集成的设计方法
- 作者：Peter Schneider;Sven Reitz;Joern Stolle;Roland Martin;Andy Heinig;Andreas Wilde
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- 3D integration;
- design methods;
- multi physics;
- modeling;
- simulation;
35.HIGH VOLUME MANUFACTURING SOLUTION FOR WAFER LEVEL LENS MOLDING AND STACKING

机译：晶圆级透镜成型和堆叠的大容量制造解决方案
- 作者：Kien Mun Lau;Michael Kast;Gerald Kreindl;Markus Wimplinger;Dominik Treiblmayr;Robert Breyer;Thorsten Matthias
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- wafer level optics;
- wafer level camera;
- CMOS image sensor;
- UV-NIL;
- lens-to-lens alignment accuracy;
- wafer-to-wafer;
36.MICROSPRINGS FOR INTEGRATED TEST AND PACKAGING

机译：集成测试和包装的微粒
- 作者：Eugene M. Chow
- 会议名称：《Annual international wafer-level packaging conference tabletop exhibition》 | 2010年
- spring;
- interconnect;
- wafer-level packaging (WLP);
- multichip module (MCM);
- high density;