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Topical Meeting on Electrical Performance of Electronic Packaging

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1.A comparative study of two transient analysis algorithms for lossy transmission lines with frequency-dependent data

机译：具有频率依赖数据的损耗传输线两个瞬态分析算法的比较研究
- 作者：I. M. Elfadel;H. -M. Huang;A. E. Ruehli;A. Dounavis;M. S. Nakhla
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
2.Modeling and measurement of the alpha 21364 package

机译：Alpha 21364包装的建模与测量
- 作者：Michael Tsuk;Roger Dame;Daniel Dvorscak;Chris Houghton;Jim St. Laurent
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
3.Behavioral modeling of digital IC input and output ports

机译：数字IC输入和输出端口的行为建模
- 作者：I. S. Stievano;Z. Chen;D. Becker;F. G. Canavero;G. Katopis;I. A. Maio
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
4.Experimental study of the ground plane in asymmetric coupled silicon lines

机译：非对称耦合硅线路接地平面的实验研究
- 作者：Uwe Arz;Dylan F. Williams;Hartmut Grabinski
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
5.A broad band through-line-line de-embedding technique for BGA package measurements

机译：BGA封装测量的宽带通孔线路解除嵌入技术
- 作者：Hongwei Liang;Joy Laskar;Mike Hyslop
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
6.A de-embedding technique for interconnects

机译：用于互连的去嵌入技术
- 作者：Jiming Song;Feng Ling;Greg Flynn;William Blood;Ertugrul Demircan
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
7.Model extraction and waveform correlation via a generalized frequency-and time-domain optimizer

机译：通过广义频率和时域优化器模型提取和波形相关性
- 作者：Ling Yang;Ching-Chao Huang;June Feng
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
8.Field analysis in inhomogeneously-filled stripline circuits

机译：Inhomeenelouslouslipline Stripline电路的田间分析
- 作者：Xing Wang;Sutirtha Kabir;John Weber;Steven L. Dvorak;John L. Prince
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
9.Analysis of transmission line structures using a dynamic analysis through WIPL-D

机译：通过WIPL-D使用动态分析的传输线结构分析
- 作者：J. Stamm;T. Sarkar;B. Kolundzija;M. Salazar-Palma
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
10.New efficient method of modeling electronics packages with power and ground planes

机译：用电力和地面造型电子包装的新高效方法
- 作者：Weimin Shi;Jiayuan Fang
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
11.Recovering lossy multiconductor transmission line parameters from impedance or scattering representations

机译：从阻抗或散射表示恢复有损的多导体传输线参数
- 作者：Luc Knockaert;Daniel De Zutter;Frank Olyslager;Eric Laermans;Jan De Geest
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
12.Design optimization methodology for simultaneous bidirectional interface

机译：同时双向界面设计优化方法
- 作者：D. N. de Araujo;M. Casesl N. Pham
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
13.IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

机译：IEEE第10次电子包装电气性能局部会议（猫。01号01th8565）
- 作者：Institute of Electric and Electronic Engineer
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
14.CPW high Q inductors on organic substrates

机译：有机基材上的CPW高Q电感器
- 作者：Sidharth Dalmia;Seock Hee Lee;Venky Sundaram;Sung Hwan Min;Madhavan Swaminathan;Rao Tummala
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
- MCM-L;
- Organic;
- PWB;
- High-Q inductors;
15.Development of RF/microwave on-chip inductors using an organic micromachining process

机译：使用有机微机械加工研发RF /微波片电感器
- 作者：R. Ramachandran;D. Newlin;A. Pham
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
16.Design and performance evaluation of Pentium III microprocessor packaging

机译：奔腾III微处理器包装的设计与性能评价
- 作者：Ananda Sarangi;Gang Ji;Tawfik Arabi;Gregory F. Taylor
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
17.Development of planar antennas in multi-layer packages for FR-system-on-a-package applications

机译：用于FR系统on-Package应用程序的多层包中的平面天线的开发
- 作者：Kyutae Lim;Ade Obatoyinbo;Mekita Davis;Joy Laskar;Rao Tummala
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
18.Efficient construction of two-port passive macromodels for resonant networks

机译：高效施工谐振网络的双端口无源宏观典型
- 作者：Sung-Hwan Min;Madhavan Swaminathan
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
19.Comparison between Chebyshev and power series expansion functions for interpolating data

机译：切口河豚和电源系列扩展功能的比较模拟数据
- 作者：Sayantan Chakravorty;Sung-Hwan Min;Madhavan Swaminathan
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
20.Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

机译：物理上一致的传输线模型，用于有损电介质中的高速互连
- 作者：Karen M. Coperich;Jason Morsey;Andreas C. Cangellaris;A. Ruehli
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
21.Powering Intel Pentium 4 generation processors

机译：动力Intel Pentium 4代处理器
- 作者：Michael T. Zhang
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
22.Accurate closed-from expressions for the frequency-dependent line parameters of coupled on-chip interconnects on silicon substrate

机译：精确关闭 - 从硅衬底上耦合片上互连的频率相关线参数的表达式
- 作者：Hai Lan;Amy Luoh;Andreas Weisshaar
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
23.Analysis of transmission line circuits using multi-dimensional model reduction techniques

机译：多维模型减少技术分析传输线路电路
- 作者：Pavan Gunupudi;Roni Khazaka;Michel Nakhla
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
24.Design and verification of differential transmission lines

机译：差分传输线的设计与验证
- 作者：Henry Wu;Wendemagegnehu T. Beyene;Newton Cheng;Ching-Chao Huang;Chuck Yuan
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
25.Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane

机译：功率/地面高效FDTD建模的等效电路表示和尺寸减小技术
- 作者：Heeseok Lee;Hyungsoo Kim;Jingook Kim;You Chul Jeong;Joungho Kim
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
26.Architectural approaches to reducing power related system costs

机译：降低电力相关系统成本的建筑方法
- 作者：Gunther S.H.;Institute of Electric and Electronic Engineer
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
27.Measuring radiation of small electronic equipment in three-dimensional TEM cells

机译：三维TEM细胞中小型电子设备的测量辐射
- 作者：M. Klingler;V. Deniau;S. Egot;B. Demoulin;T. Sarkar
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
28.Global multi-level reduction technique for nonlinear simulation of high-speed interconnect circuits

机译：高速互连电路非线性模拟的全局多级别缩减技术
- 作者：P. Gunupudi;R. Khazaka;A. Dounavis;M. Nakhla;R. Achar
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
29.Accurate closed-form expressions for the frequency-dependent line parameters of coupled on-chip interconnects on silicon substrate

机译：用于硅衬底上耦合片上互连的频率相关线参数的精确闭合表达式
- 作者：Lan H.;Luoh A.;Weisshaar A.;Institute of Electric and Electronic Engineer
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
30.ARIES: using annular ring embedded resistors to set capacitor ESR in power distribution networks

机译：白羊座：使用环形环嵌入式电阻将电容器ESR设置为配电网络
- 作者：Cyr V.S.;Novak I.;Biunno N.;Institute of Electric and Electronic Engineer
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
31.A novel efficient approach of including frequency-dependent power delivery effects in bus signal integrity simulation

机译：一种新的高效方法，包括总线信号完整性模拟中的频率相关的电力输送效果
- 作者：Weimin Shi;Chantal Wright
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
32.SI and design considerations for Gbps PCBs in communication systems

机译：通信系统中GBPS PCB的SI和设计考虑因素
- 作者：Zhen Mu;Ken Willis
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
33.Simulations of frequency dependencies of delta-I noise

机译：Delta-i噪声的频率依赖性模拟
- 作者：Bernd Garben;Roland Frech;Jochen Supper
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
34.Package model extraction from multi-port S-parameters

机译：多端口S参数的包模型提取
- 作者：James A. Andrews;Sutirtha Kabir
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
35.An iteration-free fast multilevel solver for dense method of moment systems

机译：用于致密的时刻系统的自由迭代快速多级求解器
- 作者：Dipanjan Gope;Vikram Jandhyala
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
36.Prime: passive realization of interconnect models from measured data

机译：Prime：从测量数据互连模型的被动实现
- 作者：Jason Morsey;Andreas C. Cangellaris
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
37.Modeling of interconnects and electromagnetic field distributions using FDTD method

机译：使用FDTD方法建模与电磁场分布
- 作者：Takayuki Watanabe;Masaya Suzuki;Atsushi Kamo;Hideki Asai
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
38.High sensitivity magnetic near field probe based on ferromagnetic thin-film technology

机译：基于铁磁薄膜技术的高灵敏度磁场探头
- 作者：Masahiro Yamaguchi;Hiroaki Kikuchi;Satoshi Sugimoto;Ken-Ichi Arai;Mizuki Iwanami;Atsushi Nakamura;Shigeki Hoshino
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
- Magnetic near field;
- Probe;
- Spatial resolution;
39.Analysis of power/Ground planes by PCB simulator with model order reduction technique

机译：用模型顺序减速技术分析PCB模拟器电源/地面平面
- 作者：Hidemasa Kubota;Atsushi Kamo;Takayuki Watanabe;Hideki Asai
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
40.Understanding modeling and measurements of differential transmission lines

机译：了解差分传输线的建模与测量
- 作者：Barry J. Rubin
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
41.Modelling of multi-layered power supply planes with vias

机译：用VYS的多层电源平面建模
- 作者：Shih Yen Lee;Yong Kee Yeo;Nhon Do;Wui Weng Wong
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
42.Flat package inductance extraction with ground plane current precalculation

机译：平面电感提取与接地平面电流预钙管
- 作者：Gunther Lippens;Daniel De Zutter
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
43.Measurement of RF properties of glob top and under-encapsulant materials

机译：基础顶部和密封剂材料的RF性能测量
- 作者：Li Li;Ben Cook;Mark Veatch
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
44.Unit cell modeling of meander delay line based on finite-difference time-domain method and Floquet's theorem

机译：基于有限差分时间域法和Floquet定理的曲折延迟线单元电池建模
- 作者：Heeseok Lee;Namhoon Kim;Joungho Kim
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
45.Characterization of via-induced parallel-plate resonances in a printed circuit board

机译：印刷电路板中通孔凸起的平行板共振的表征
- 作者：M. Iwanami;S. Hoshino
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
46.Digital signal processors (DSPs) for low power consumption wireless applications

机译：用于低功耗无线应用的数字信号处理器（DSP）
- 作者：Paul Marino;Artis C. Street
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
47.Crosstalk for curvilinear conductors by utilising a nonuniform transmission line approach

机译：利用非均匀传输线方法串扰为曲线导体
- 作者：Ye Chunfei;Li Erping;Gan Yiin Shenn
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
48.Author Index

机译：作者索引
- 作者：Institute of Electric and Electronic Engineer
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
49.Integrated RF function architectures in fully-organic SOP technology

机译：完全有机SOP技术中集成的RF功能架构
- 作者：M. F. Davis;A. Sutono;A. Obatoyinbo;S. Chakraborty;K. Lim;S. Pinel;J. Laskar;S. Lee;R. Tummala
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
50.Fast capacitance extraction of conductors embedded in a layered medium

机译：嵌入层状介质中的导体的快速电容提取
- 作者：Y. C. Pan;W. C. Chew
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
51.Characterization of the novel anisotropic uniplanar compact photonic band-gap ground plane (UC-PBG-GP)

机译：新型各向异性uniplanar紧凑型光子带隙接地平面（UC-PBG-GP）的表征
- 作者：C. Caloz;T. Itoh
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
52.Effects of decreasing extent of electromagnetic field at LSI mounting area on radiated emission form PCB

机译：辐射发射辐射发射地区LSI安装区域电磁场减小程度的影响
- 作者：Satoru Haga;Ken Nakano;Toshio Sudo
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
53.The use of loop inductances in signal integrity modeling

机译：在信号完整性建模中使用环路电感
- 作者：Michael Tsuk
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
54.Microwave frequency crosstalk model of redistribution line patterns on wafer level package

机译：微波频率串扰模型晶圆级包装中的再分配线图案模型
- 作者：Myunghee Sung;Namhoon Kim;Junwoo Lee;Baekkyu Choi
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
55.Modeling shared-via decoupling in a multi-layer structure using the CEMPIE approach

机译：使用CEMPIE方法在多层结构中建模共享 - 通过解耦
- 作者：Wei Cui;Jun Fan;Shaofeng Luan;James. L. Drewniak
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
56.Modelling complex via hole structures

机译：通过孔结构建模复合物
- 作者：Eric Laermans;Jan De Geest;Daniel De Zutter;Frank Olyslager;Stefaan Sercu;Danny Morlion
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
57.Robust extraction of the frequency-dependent characteristic impedance of transmission lines using one-port TDR measurements

机译：一种使用单端口TDR测量的传输线频依赖性特性阻抗的鲁棒提取
- 作者：Woopoung Kim;Seock Hee Lee;Madhavan Swaminathan;Rao R. Tummala
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
58.Effective decoupling radius of decoupling capacitor

机译：解耦电容的有效去耦半径
- 作者：Huabo Chen;Jiayuan Fang;Weimin Shi
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
59.Characterization of thin film organic materials at high frequency

机译：高频薄膜有机材料的特征
- 作者：Sidharth Dalmia;Joseph M. Hobbs;Venky Sundaram;Madhavan Swaminathan;George E. White;Rao R. Tummala;S. Ogitani
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
60.An approach to measuring power supply impedance of microprocessors

机译：测量微处理器电源阻抗的方法
- 作者：Greg Taylor;Craig Deutschle;Tawfik Arabi;Brian Owens
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
61.Reduced-order models based on measured S-parameters for time-frequency analysis of microwave circuits using genetic algorithms

机译：基于遗传算法的微波电路时频分析的测量阶模型
- 作者：Jose M. Gomez;Beatriz Gomez;Miguel Ruiperez;Jose I. Alonso
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
62.High bandwidth low latency chip to chip interconnects using high performance MLC glass ceramic POWER4 MCM

机译：使用高性能MLC玻璃陶瓷功率4 MCM的高带宽低延长芯片芯片互连
- 作者：P. Walling;A. Tai;H. Hamel;R. Weekly
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
63.Millimeter wave package design: a comparison of simulation and measurement results

机译：毫米波封装设计：模拟和测量结果的比较
- 作者：Lei Shan;Mounir Meghelli;Joong-Ho Kim;Jean Trewhella;Marc Taubenblatt;Modest Oprysko
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
64.An alternating implicit block overlapped FDTD (AIBO-FDTD) method and its estimation with parallel computation

机译：交替隐式块重叠的FDTD（AIBO-FDTD）方法及其与并行计算的估计
- 作者：Pornanong Pongpaibool;Atsushi Kamo;Takayuki Watanabe;Hideki Asai
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
65.Reducing power bus impedance at resonance with lossy components

机译：用损坏部件降低功率总线阻抗
- 作者：Theodore M. Zeeff;Todd H. Hubing
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
66.'Watts' the matter: power reduction issues

机译：“瓦斯”这个问题：减少问题
- 作者：Correale A. Jr.;Institute of Electric and Electronic Engineer
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
67.Analysis of multi-layered irregular power distribution planes with vias using transmission matrix method

机译：使用传输矩阵法分析通孔的多层不规则配电平面
- 作者：Joong-Ho Kim;Madhavan Swaminathan
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
68.Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes

机译：三维互连结构的广义PEEC模型和任意形状的综合循环
- 作者：Aosheng Rong;Andreas C. Cangellaris
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
69.The effects of via transitions on differential signals

机译：通过转换对差分信号的影响
- 作者：Chen Wang;Jun Fan;James L. Knighten;Norman W. Smith;Ray Alexander;James L. Drewniak
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
70.RF modeling of vertical interconnection between power-ground plane combined with 2D TLM

机译：电力接地平面与2D TLM的垂直互连的RF建模
- 作者：Ryosuke Ito;Rodrigo Carrillo-Ramirez;Robert W. Jackson
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
71.Fast electromagnetic modeling for electronic packaging in layered media

机译：分层媒体电子包装快速电磁建模
- 作者：Xue Min Xu;Qing Huo Liu
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
72.Time-domain scattering method using triangle impulse responses for modeling electronic packaging components

机译：使用三角形脉冲响应来建模电子包装组件的时域散射方法
- 作者：Zhaoqing Chen;Albert Ruehli
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
73.Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures

机译：耦合电磁电路模拟任意形状导电结构
- 作者：Yong Wang;Vikram Jandhyala;C. J. Richard Shi
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
74.Picosecond-pulse propagation measurement on microstrip meander lines using a novel optical near-field mapping probe

机译：使用新型光学近场映射探针的微带曲折线上的皮秒脉冲传播测量
- 作者：Jongjoo Lee;Joungho Kim
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
75.Design oriented analysis of package power distribution system considering target impedance for high performance microprocessors

机译：考虑高性能微处理器的目标阻抗的封装配电系统设计导向分析
- 作者：Om P. Mandhana
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
76.Triangle impulse response (TIR) calculation for lossy transmission line simulation

机译：三角形脉冲响应（TIR）损耗传输线仿真计算
- 作者：Tingdong Zhou;Zhaoqing Chen;Wiren D. Becker;Steve L. Dvorak;John L. Prince
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
77.Modeling of multi-vias coupling for high speed interconnects

机译：高速互连多通孔耦合的建模
- 作者：Chung-Chi Huang;Leung Tsang;Dennis Miller;Alok Tripathi
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
- High speed interconnect;
- Vias;
- Coupling;
78.Simultaneous switching noise analysis on bus lines using coupled circuit and electromagnetic simulation

机译：耦合电路和电磁仿真的总线上同时切换噪声分析
- 作者：Yuichi Mabuchi;Motoo Suwa;Hideshi Fukumoto;Atsushi Nakamura
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
79.Recent advances in reduced-order modeling of complex interconnects

机译：复杂互连的下降阶建模的最新进展
- 作者：S. Grivet-Talocia;I. A. Maio;F. G. Canavero
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
80.Characterization of on-chip capacitance effects for I/O circuits and core circuits

机译：对I / O电路和核心电路片上电容效应的表征
- 作者：Toshio Sudo;Ken Nakano;Junichi Kudo;Satoru Haga
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
81.Aries: using annular-ring embedded resistors to set capacitor ESR in power distribution networks

机译：白羊座：使用环形环嵌入式电阻将电容器ESR设置为配电网络
- 作者：Valerie St. Cyr;Istvan Novak;Nick Biunno;Jim Howard
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
82.Composite effects of reflections and ground bounce for signal line through a split power plane

机译：通过分流电力平面反射和地面反射的复合效果
- 作者：Sheng-Mou Lin;Ruey-Beei Wu
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
83.Complex dielectric constant measurement techniques for high-speed signaling

机译：用于高速信令的复杂介电常数测量技术
- 作者：Dong-Ho Han;Yuan-Liang Li
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年
84.Solution space analysis of interconnects for low voltage differential signaling (LVDS) applications

机译：低压差分信令（LVDS）应用的互连界面的解决方案空间分析
- 作者：Seungyoung Ahn;Albert Chee W. Lu;Wei Fan;Lai L. Wai;Joungho Kim
- 会议名称：《Topical Meeting on Electrical Performance of Electronic Packaging》 | 2001年