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Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

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1.Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application

机译：电子封装应用中聚合物材料的时间和温度相关的机械特性
- 作者：Chia-Tai Kuo;Ming-Chuen Yip;Kuo-Ning Chiang;Yi-Ming Jen
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
2.Testing iterative logic arrays for delay faults with a constant number of patterns

机译：使用恒定数量的模式测试迭代逻辑阵列的延迟故障
- 作者：Shyue-Kung Lu;Mau-Jung Lu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
3.Simulation of the alignment sensitivity on the coupling efficiency of a ball-lens capped TO-can laser diode source into a single-mode fiber

机译：对准灵敏度对球形透镜盖的TO-can激光二极管源到单模光纤的耦合效率的仿真
- 作者：Cheung Y.M.;Yiu C.H.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
4.Jetting technology: a way of the future in dispensing

机译：喷射技术：点胶的未来方式
- 作者：Quinones H.;Babiarz A.;Fang L.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
5.A study on the conductive behavior of copper filled pastes for microelectronic packaging substrates

机译：微电子封装基板用填充铜浆的导电性能研究
- 作者：Yung-Ssen Lin;Sheng-Shiang Chiu;Chi-Shung Shi;Shen-Li Fu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
6.A study of packaging effects on the performances of MEMS for high-G accelerometer

机译：封装对高G加速度计MEMS性能的影响
- 作者：Zhaonian Cheng;Weidong Huang;Xia Cai;Bulu Xu;Le Luo;Xinxin Li
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
7.The technical, social, and legal outlook for lead-free solders

机译：无铅焊料的技术，社会和法律前景
- 作者：Casey P.;Pecht M.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
8.A study on the adhesion performance of copper to polyimide for microelectronic packaging-flex substrates

机译：铜与聚酰亚胺在微电子封装-柔性基板上的粘合性能研究
- 作者：Yung-Sen Lin;Huang-Ming Liu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
9.Thermal analysis of power amplifier package in cellular phones

机译：手机功率放大器封装的热分析
- 作者：Chun-Kai Liu;Yi-Hsiang Cheng
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
10.Reliability of the SnBi lead finished Pb-free produet

机译：SnBi铅成品无铅产品的可靠性
- 作者：Ki-Hwan Park;Nam-Seog Kim;Se-Yong Oh
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
11.The introduction of MEMS packaging technology

机译：MEMS封装技术的介绍
- 作者：Hsieh C.T.;Jyh-Ming Ting;Yang C.;Chung C.K.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
12.Wire bondability of Au/Ni bond pads: effects of metallisation schemes and processing conditions

机译：Au / Ni键合焊盘的引线键合性：金属化方案和加工条件的影响
- 作者：Yu Hin Chan;Jang-kyo Kim;Liu D.;Liu C.K.;Yiu Ming Cheung;Ming Wai
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
13.Reliability and failure mode of chip-on-film with non-conductive adhesive

机译：非导电胶膜上芯片的可靠性和失效模式
- 作者：Yu-Te Hsieh
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
14.Failure analysis of BGA package by a TDR approach

机译：通过TDR方法分析BGA封装的故障
- 作者：Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;I-Chih Wu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
15.LTCC for wireless and photonic packaging applications

机译：用于无线和光子封装应用的LTCC
- 作者：Liang Chai;Shaikh A.;Stygar V.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
16.Thick-film hybrid microwave filters made in PolyTherm CVD diamond substrates

机译：由PolyTherm CVD金刚石基底制成的厚膜混合微波过滤器
- 作者：Gondek J.;Kordowiak S.;Habdank T.;Kocol J.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
17.Electromigration in tin thin film

机译：锡薄膜中的电迁移
- 作者：Hu Y.C.;Wan S.W.;Kao C.R.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
18.Propagation of Bleustein-Gulyaev waves in piezoelectric layered structures with initial stress

机译：初始应力在压电层状结构中的Bleustein-Gulyaev波的传播
- 作者：Jin F.;Kishimoto K.;Inoue H.;Tateno T.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
19.Measurement of copper thin film adhesion by multi-stages peel test

机译：通过多阶段剥离测试测量铜薄膜的附着力
- 作者：Omiya M.;Kishimoto K.;Inoue H.;Amagai M.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
20.Fine pitch copper wire bonding on copper bond pad process optimization

机译：铜焊盘上的细间距铜线键合工艺优化
- 作者：Kan Wai Lam;Hong Meng Ho;Stoukatch S.;Van De Peer M.;Ratchev P.;Vath C.J.;Schervan A.;Beyne E.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
21.Stress relaxation in plastic molding compounds

机译：塑料模塑料的应力松弛
- 作者：Xingjia Huang;Lee S.W.R.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
22.New failure mode induced by electric current in flip chip solder joint

机译：倒装芯片焊点中电流引起的新故障模式
- 作者：Lin Y.H.;Hu Y.C.;Tsai J.;Kao C.R.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
23.The latest underfill materials for flip-chip applications

机译：倒装芯片应用的最新底部填充材料
- 作者：Kotaka K.;Suzuki O.;Fujiki T.;Suzuki K.;Homma Y.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
24.Cyclic stress-strain measurement tests of Sn3.5Ag0.75Cu solder joint

机译：Sn3.5Ag0.75Cu焊点的循环应力应变测试
- 作者：Tae-Sang Park;Soon-Bok Lee
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
25.Application of neural networks and filtered back projection to wafer defect cluster identification

机译：神经网络和滤波反投影在晶圆缺陷簇识别中的应用
- 作者：Chenn-Jung Huang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
26.High density packaging in 2010 and beyond

机译：2010年及以后的高密度包装
- 作者：Tummala R.R.;Sundaram V.;Fuhan Liu;White G.;Hattacharya S.;Pulugurtha R.M.;Swaminathan M.;Dalmia S.;Laskar J.;Jokerst N.M.;Sang Yeon Chow
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
27.Low tolerance epoxy/BaTiO₃ composite embedded capacitor films (ECFs)

机译：低公差环氧/ BaTiO _{3 复合嵌入式电容器膜（ECF）}
- 作者：Kyung-Wook Paik;Sung-Dong Cho;Joo-Yeon Lee;Jin-Gul Hyun
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
28.The interface microstructure on the reliability of flip-chip laser diode bonding

机译：界面微观结构对倒装芯片激光二极管键合可靠性的影响
- 作者：Chien-Chih Liu;Yen-Kuang Lin;Mau-Phon Houng;Yeong-Her Wang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
29.Thermalmechanical behavior of PBGA package during laser and hot air reflow soldering

机译：PBGA封装在激光和热空气回流焊接过程中的热力学行为
- 作者：Yanhong Tian;Chunqing Wang;Deming Liu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
30.Embedded capacitors technology in 2.4 GHz power amplifier with multi-layer printed wiring board (PWB) process

机译：具有多层印刷线路板（PWB）工艺的2.4 GHz功率放大器中的嵌入式电容器技术
- 作者：Chang-Sheng Chen;Shur-Fen Liu;Chun-Kun Wu;Pel-Shen Wei;Ching-Lian Weng;Uei-Ming Jow;Ying-Jiunn Lai
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
31.Process challenges and solutions for embedding Chip-On-Board into mainstream SMT assembly

机译：将板载芯片嵌入主流SMT组件的工艺挑战和解决方案
- 作者：Luthra M.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
32.Board level reliability test of MPBGA assembly

机译：MPBGA组件的板级可靠性测试
- 作者：Chi-Sheng Chung;Zheng P.J.;Lee S.C.;Wu J.D.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
33.Micro-scale mechanical properties of fine feature flip chip with lead free solders

机译：精细功能倒装芯片与无铅焊料的微观机械性能
- 作者：Changqing Liu;Geggel M.;Conway P.;Hendriksen M.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
34.Conversion cost reduction using advanced process control (SPC) and real-time data analysis with ERP linkage SMT assembly

机译：使用高级过程控制（SPC）降低转换成本，并通过ERP链接SMT组装进行实时数据分析
- 作者：Kohli H.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
35.A comparison of package thermal resistance using simulation and measurement for two-layer and four-layer PBGA substrate designs

机译：使用模拟和测量比较两层和四层PBGA基板设计的封装热阻
- 作者：Hsieh S.;Soon Shin Chee;Pan S.;Jyi-Yu Sun;Lam P.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
36.A study on the flammability of halogen-free core materials for microelectronic packaging substrates

机译：微电子封装基板用无卤芯材的可燃性研究
- 作者：Yung-Sen Lin;Chung-Yi Chung
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
37.Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates

机译：Sn-Ag-Cu，Sn-Ag-Cu-Ni-Ge无铅焊料与金属基材之间的界面反应
- 作者：Chiang-Ming Chuang;Po-Cheng Shi;Kwang-Lung Lin
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
38.Role of adhesive modulus on reliability of FCBGA with heat spreader

机译：粘合剂模量对带有散热器的FCBGA可靠性的影响
- 作者：Hsien-Fu Hsiao
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
39.Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF

机译：使用NCA / ACF评估倒装芯片互连中的剪切应力的分析方法
- 作者：Se Young Yang;Soon-Bok Lee;Woon-Seong Kwon;Kyung-Wook Paik
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
40.Current-mode BIST structure for mixed-signal circuits

机译：混合信号电路的电流模式BIST结构
- 作者：Chun-Lung Hsu;Keh-Chang Huang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
41.High transparent and conductive ZnO thin films doped with Ti

机译：掺钛的高透明导电ZnO薄膜
- 作者：Yang-Ming Lu;Chen-Min Chang;Shu-I Tsai
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
42.Environmental friendly CSP

机译：环保的CSP
- 作者：Chung C.L.;Kao P.;Fu S.L.;Chou S.;Lu A.;Tsai R.B.;Lee Y.J.;Huang M.L.;Ku P.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
43.Improvement of bonding properties of PTFE by low pressure plasma treatment

机译：通过低压等离子体处理改善PTFE的粘结性能
- 作者：Hu Y.C.;Lin B.K.;Du Y.J.;Sheen I.H.;Ding P.W.;Tao W.H.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
44.Research of the temperature at the rake face of cutting tools by using boundary element method

机译：边界元法研究刀具前刀面温度
- 作者：Jin-chein Lin;Liang P.W.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
45.Board-level reliability of lead-free SnAgCu solder joint

机译：无铅SnAgCu焊点的板级可靠性
- 作者：Jian-Shu Wu;Shan-Pu Yu;I-Hsuan Peng;Jong-Lih Wang;Chung B.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
46.Development of novel ultra-high dielectric constant polymer based composite

机译：新型超高介电常数聚合物基复合材料的研制
- 作者：Yang Rao;Wong C.P.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
47.Development of no-flow underfill for board level assembly

机译：开发用于板级组装的无流动底部填充
- 作者：Zhuqing Zhang;Haiying Li;Wong C.P.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
48.Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

机译：室温老化导致BGA焊球剪切强度降低的实验研究
- 作者：Tsui Y.-K.;Lee S.W.R.;Xingjia Huang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
49.Electrical characterization of BGA test socket for high-speed applications

机译：用于高速应用的BGA测试插座的电气特性
- 作者：Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;Li-Kuei Fang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
50.LFBGA packaging stress measurements with piezoresistive sensors

机译：使用压阻传感器进行LFBGA包装应力测量
- 作者：Ben-Je Lwo;Kun-Fu Tseng;Chin-Hsing Kao;Tung-Sheng Chen;Jeng-Shian Su
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
51.Mechanical reliability improvement with proper package design in CSP

机译：通过CSP中适当的封装设计提高机械可靠性
- 作者：Kao N.;Wang Y.P.;Hsiao C.S.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
52.Thermal fatigue resistance of the Sn-9Zn-xAg lead-free solders/Cu interface

机译：Sn-9Zn-xAg无铅焊料/ Cu界面的耐热疲劳性
- 作者：Tao-Chih Chang;Min-Hsiung Hon;Moo-Chin Wang;Dong-Yih Lin
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
53.Characterisation of crystallisation behaviour of electroless Ni-P plating during heating

机译：加热过程中化学镀Ni-P的结晶行为表征
- 作者：Guo Z.;Keong K.G.;Sha W.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
54.Factor considerations on the novel surface acoustic wave devices by using piezoelectric materials

机译：使用压电材料的新型表面声波器件的因素考虑
- 作者：I-Tseng Tang;Han-Jan Chen;Mau-Phon Houng;Yeong-Her Wang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
55.Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

机译：镓对Sn-Zn-Ag-Ga和Sn-Zn-Ag-Al-Ga焊料合金的润湿性，微观结构和力学性能的影响
- 作者：Kang-I Chen;Kwang-Lung Lin
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
56.Filling the via hole of IC by VPES (vacuum printing encapsulation systems) for stacked chip (3D packaging)

机译：通过VPES（真空印刷封装系统）为堆叠芯片（3D封装）填充IC的通孔
- 作者：Okuno A.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
57.Worldwide markets for wafer level packages

机译：晶圆级封装的全球市场
- 作者：Vardaman E.J.;Matthew L.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
58.Electromigration induced failure in SnAg_3.8Cu_0.7 solder joints for flip chip technology

机译：倒装芯片技术中SnAg _{3.8 Cu _{0.7 焊点中的电迁移导致失效}}
- 作者：Hsu Y.-C.;Shao T.-L.;Chih Chen
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
59.LCD driver IC assembly technologies and status

机译：LCD驱动器IC的组装技术及现状
- 作者：Geng-Shin Shen
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
60.Finite element analysis of substrate warpage during die attach process

机译：芯片贴装过程中基板翘曲的有限元分析
- 作者：Beh K.S.;Ourdjini A.;Venkatesh V.C.;Khong Y.L.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
61.Bumpless flip chip packages

机译：无凸点倒装芯片封装
- 作者：Lin C.W.C.;Chiang S.C.L.;Yang T.K.A.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
62.The development of CAD/CAE/CAM integrated and interface support system for coupling joint shaft

机译：联轴器CAD / CAE / CAM集成接口支持系统的开发
- 作者：Lin Jin-Chein;Lin C.S.;Chang L.C.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
63.High accuracy flip-chip assembly of MOEMS optical switch example

机译：MOEMS的高精度倒装芯片组装光开关实例
- 作者：Quirke C.;Lecarpentier G.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
64.The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization

机译：Ni对Sn-Ag焊料与Cu金属化界面反应的影响
- 作者：Tsai J.Y.;Kao C.R.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
65.Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish

机译：SnAgCu无铅焊料与Ni表面处理之间的液态/固态和固态/固态反应
- 作者：Wei-Chen Luo;Kao C.R.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
66.Thin GaAs film on GaAs/Si substrate

机译：GaAs / Si基板上的GaAs薄膜
- 作者：Yung Sheng Chang;Chih Yuan Huang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
67.Direction of System LSI

机译：系统LSI的发展方向
- 作者：Furuta Y.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
68.Spalling suppression by Sn-3.5Ag incorporated with Cu particles

机译：通过掺入Cu颗粒的Sn-3.5Ag抑制剥落
- 作者：Liu C.Y.;Wang S.J.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
69.Tightly coupling LTCC microwave coupled lines: analysis, modeling and realization

机译：紧耦合LTCC微波耦合线：分析，建模和实现
- 作者：Deng J.D.S.;Feng-ka Hsiao;Kuo J.I.;Kuo Young Horng;Ching-Yuan Lee;Chung-Sen Wu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
70.Post-weld-shift in butterfly package

机译：焊后移位的蝴蝶包装
- 作者：Huang W.K.;Hsu Y.C.;Sheen M.T.;Cheng W.H.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
71.Evolution of intermetallic compounds at interface between PBGA solder ball and pads during laser reflow soldering

机译：激光回流焊接过程中PBGA焊球和焊盘之间界面处金属间化合物的演变
- 作者：Yanhong Tian;Chunqing Wang;Pater C.K.;Deming Liu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
72.Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys

机译：Sn-Zn-Ag焊料合金的显微组织特征和振动断裂行为
- 作者：Song J.M.;Lan G.F.;Lui T.S.;Chen L.H.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
73.Reliability issues on the novel surface acoustic wave notch filter

机译：新型表面声波陷波滤波器的可靠性问题
- 作者：Han-Jan Chen;I-Tseng Tang;Mau-Phon Houng;Yeong-Her Wang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
74.Influence of Sb addition on microstructural evolution of Sn-Ag solder

机译：添加锑对锡银焊料微结构演变的影响
- 作者：Hwa-Teng Lee;Ming-Hung Chen;Shuen-Yuan Hu;Cheng-Shyan Li
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
75.Electrical properties of ultrasmall low temperature solder joints for LCD driver IC packaging applications

机译：用于LCD驱动器IC封装应用的超小型低温焊点的电性能
- 作者：Un-Byoung Kang;Young-Ho Kim
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
76.High speed data transmission common mode noise suppression - application to USB 2.0 and IEEE 1394

机译：高速数据传输共模噪声抑制-适用于USB 2.0和IEEE 1394
- 作者：Yeh P.;Wang A.;Tseng B.C.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
77.The electrical properties of oxides-added thick-film resistors on aluminum nitride substrates

机译：氮化铝基板上添加氧化物的厚膜电阻器的电性能
- 作者：Ming-Liang Hsieh;Lih-Shan Chen
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
78.Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages

机译：高级电子封装中无铅Sn-9Zn焊料与Au焊盘之间的材料相互作用
- 作者：Lin Y.L.;Tsai J.;Kao C.R.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
79.Analysis the influence of electroplate on the chip-type LTCC filter's input/output ports

机译：分析电镀对芯片型LTCC滤波器输入/输出端口的影响
- 作者：Ching-Wen Tang;Wen-Hsi Lee;Hsin-Yin Yao;Wen-Long Leu;Chi-Yang Chang
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
80.High performance packaging with multilayer ceramic antenna switch module for wireless communication

机译：具有用于无线通信的多层陶瓷天线开关模块的高性能包装
- 作者：Wen-His Lee;Chen H.;Tang C.W.;Su C.Y.;Lei R.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
81.High speed electrical performance comparison between bump with RDL and wire bond technologies

机译：使用RDL的凸点和引线键合技术之间的高速电气性能比较
- 作者：Chi-Tsung Chiu;Sung-Mao Wu;Chi-Ping Hung
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
82.Trend of semiconductor packaging, high density and low cost

机译：半导体封装的趋势，高密度和低成本
- 作者：Tsukada Y.;Kobayashi K.;Nishimura H.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
83.Surface-mountable dual side-feed circularly polarized ceramic chip antenna

机译：表面安装的双侧馈圆极化陶瓷芯片天线
- 作者：Tsung-Wen Chiu;Wang C.;Chih-Ming Su;Kin-Lu Wong
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
84.Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

机译：凸块冶金中磷含量和固态时效对无铅Sn-Ag-Cu焊料与化学镀镍/浸金之间金属间化合物形成的影响
- 作者：Tai S.F.;Ourdjini A.;Khong Y.L.;Venkatesh V.C.;Tamin M.N.
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》
85.Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates

机译：HDIIVH基板上可折叠MultiChip模块封装的热设计和可靠性
- 作者：Hsiang-Chen Hsu;Lih-Shan Chen;Lee-Wei Chu
- 会议名称：《Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on》