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International 3D Systems Integration Conference

召开年：2019
召开地：Sendai(JP)
出版时间：-

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1.Welcome from the Conference Chairman

机译：大会主席致欢迎词
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
2.IEEE 2019 International 3D Systems Integration Conference (3DIC 2019)

机译：IEEE 2019国际3D系统集成会议（3DIC 2019）
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- System integration;
- Conferences;
- Cultural differences;
- Libraries;
- Electronic mail;
3.Program-at-a-Glance

机译：程序一览
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Cultural differences;
- System integration;
- Conferences;
- Electronics packaging;
- Bonding;
- Memory management;
4.Fabrication of High Quality InAs-on-Lnsulator Structures by Smart Cut Process with Reuse of InAs Wafers

机译：重复使用InAs晶圆的智能切割工艺制造高质量的InAs透镜上结构
- 作者：Kei Sumita;Jun Takeyasu;Kimihiko Kato;Kasidit Toprasertpong;Mitsuru Takenaka;Shinichi Takagi
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Annealing;
- Silicon;
- Aluminum oxide;
- Three-dimensional displays;
- Hall effect;
- MOSFET;
- Fabrication;
5.A 6.9 μm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections

机译：具有3M Cu-Cu连接的6.9μm像素间距3D堆叠式全局快门CMOS图像传感器
- 作者：Tsukasa Miura;Masaki Sakakibara;Hirotsugu Takahashi;Tadayuki Taura;Keiji Tatani;Yusuke Oike;Takayuki Ezaki
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- CMOS image sensors;
- Bonding;
- Analog-digital conversion;
- Micromechanical devices;
- System integration;
6.Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis

机译：基于有限元分析的多芯片3D堆叠结构热应力跟踪
- 作者：Cheong-Ha Jung;Won Seo;Gu-sung Kim
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Stress;
- Three-dimensional displays;
- Solid modeling;
- Stacking;
- Thermal stresses;
- Electronic packaging thermal management;
- Through-silicon vias;
7.3DIC 2019 Conference Organization

机译：3DIC 2019会议组织
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Conferences;
- Three-dimensional displays;
- System integration;
- Cultural differences;
- Organizations;
- Asia;
- Europe;
8.A Built-in Self-Test Scheme for TSVs of Logic-DRAM Stacked 3D ICs

机译：逻辑DRAM堆叠3D IC的TSV的内置自测方案
- 作者：Wei-Hsuan Yang;Jin-Fu Li;Chun-Lung Hsu;Chi-Tien Sun;Shih-Hsu Huang
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Built-in self-test;
- Random access memory;
- Three-dimensional displays;
- Circuit faults;
9.Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages

机译：异构集成和封装的垂直堆栈热特性
- 作者：T. Robert Harris;W. Rhett Davis;Steven Lipa;W. Shepherd Pitts;Paul D. Franzon
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
10.Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs

机译：静电屏蔽TSV抑制堆叠IC之间的耦合
- 作者：Yuuki Araga;Kikuchi Katsuya;Masahiro Aoyagi
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Couplings;
- Three-dimensional displays;
- Analytical models;
- Integrated circuit modeling;
- Electrostatics;
11.Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration

机译：用于3D集成的环境中耐水解的杂化键合
- 作者：Akitsu Shigetou;Tilo H. Yang;C. Robert Kao
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bridges;
- Surface cleaning;
- Bonding;
- Atmosphere;
- Surface contamination;
- Ethanol;
12.An Introduction to Marching Memory (MM)

机译：行进记忆简介（MM）
- 作者：Tadao Nakamura
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Memory management;
- Random access memory;
- Power demand;
- Registers;
- Protocols;
- Capacitors;
- Pipelines;
13.Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration

机译：开发用于3D IC集成的激光辅助压缩键合（LABC）工艺
- 作者：Kwang-Seong Choi;Yong-Sung Eom;Seok Hwan Moon;Jiho Joo;Kwangjoo Lee;Jung Hak Kim;Ju hyeon Kim
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Temperature measurement;
- Measurement by laser beam;
- Radiation effects;
- Power lasers;
- Semiconductor device measurement;
14.Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process

机译：晶圆上晶片工艺中的三维集成电路的集线和键合键合
- 作者：Hiroto Tanaka;Yoshiyuki Arai;Toshiyuki Jinda;Noboru Asahi;Katsumi Terada
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Heating systems;
- Temperature measurement;
- Temperature;
- Semiconductor device measurement;
- Three-dimensional displays;
15.Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields

机译：具有高对准精度和电产量的管芯对晶片直接双键合演示
- 作者：A. Jouve;L. Sanchez;C. Castan;N. Bresson;F. Fournel;N. Raynaud;P. Metzger
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Stacking;
- Surface treatment;
- Copper;
- Surface topography;
- Cleaning;
- Pollution measurement;
16.Program Schedule - October 8, 2019 (Hotel Metropolitan Sendai)

机译：活动时间表-2019年10月8日（仙台大都会饭店）
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Bonding;
- Stacking;
- System integration;
- Silicon-on-insulator;
- CMOS image sensors;
- Conferences;
17.Plenary Talk

机译：全体演讲
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- System integration;
- Bonding;
- Radio frequency;
- Conferences;
- Cultural differences;
- Annealing;
18.Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers

机译：通过SOI晶圆的混合键合开发的像素并行CMOS图像传感器三层技术
- 作者：Masahide Goto;Joeri De Vos;Toshihisa Watabe;Kei Hagiwara;Masakazu Nanba;Yoshinori Iguchi;Eiji Higurashi;Yuki Honda;Takuya Saraya;Masaharu Kobayashi;Hiroshi Toshiyoshi;Toshiro Hiramotoi
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Sensors;
- Gold;
- Three-dimensional displays;
- CMOS image sensors;
- Bonding;
- Silicon-on-insulator;
19.On Delay Elements in Boundary Scan Cells for Delay Testing of 3D IC Interconnection

机译：用于3D IC互连延迟测试的边界扫描单元中的延迟元件
- 作者：Toshiaki Satoh;Hiroyuki Yotsuyanagi;Masaki Hashizume
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Logic gates;
- Delays;
- Through-silicon vias;
- Testing;
- Circuit faults;
- Three-dimensional displays;
20.Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs

机译：用于3DIC中的细间距芯片间连接的低高度焊料微凸点焊接特性
- 作者：Yuki Miwa;Sungho Lee;Rui Liang;Kousei Kumahara;Hisashi Kino;Takafumi Fukushima;Tetsu Tanaka
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Resistance;
- Flip-chip devices;
- Three-dimensional displays;
- System integration;
- Electrical resistance measurement;
- Large scale integration;
21.Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process

机译：SiO 2 上用于Si晶片键合工艺的Mn阻挡层的光电观察
- 作者：Takahiro Nagata;Kazumichi Tsumura;Kenro Nakamura;Kengo Uchida;Jin Kawakita;Toyohiro Chikyow;Kazuyuki Higashi
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Manganese;
- Bonding;
- Silicon;
- Handheld computers;
- Plasmas;
- Surface morphology;
- Surface treatment;
22.Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application

机译：氩和氮离子轰击对溅射和电镀铜表面进行铜键合的影响
- 作者：Han Kyeol Seo;Hae-Sung Park;Sarah Eunkyung Kim
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Surface treatment;
- Bonding;
- Surface morphology;
- Copper;
- Rough surfaces;
- Surface roughness;
- Plasmas;
23.Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding

机译：用于低温Cu-Cu键的氮化钝化Cu表面的表征
- 作者：Hae-Sung Park;Han Kyeol Seo;Sarah Eunkyung Kim
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Surface treatment;
- Plasmas;
- Bonding;
- Response surface methodology;
- Rough surfaces;
- Surface roughness;
- Copper;
24.TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center

机译：围绕TSV的TiN保护环，用于交叉抑制数据中心并行网络
- 作者：Alit Apriyana Anak Agung;Peng Zhao;Chuan Seng Tan
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Crosstalk;
- Through-silicon vias;
- Integrated circuit interconnections;
- Tin;
- Insertion loss;
- Couplings;
- Signal integrity;
25.Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer

机译：150°C以下具有Au钝化层的低温Cu-Cu直接键合
- 作者：Demin Liu;Po-Chih Chen;Yi-Chieh Tsai;Kuan-Neng Chen
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Gold;
- Passivation;
- Surface cleaning;
- Oxidation;
- Three-dimensional displays;
26.Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration

机译：用于3D集成的纳米级互连的制备和形态表征
- 作者：Murugesan Mariappan;Mitsumasa Koyanagi;Hiroyuki Hashimoto;Ji Chel Bea;Takafumi Fukushima
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Silicon;
- Metals;
- Three-dimensional displays;
- Fabrication;
- System integration;
- Industries;
27.Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology

机译：用于3D芯片堆叠技术的低温Cu柱共晶键合研究
- 作者：Yi-Chieh Tsai;Chia-Hsuan Lee;Kuan-Neng Chen
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Three-dimensional displays;
- Temperature measurement;
- Reliability;
- Electrical resistance measurement;
- Stacking;
28.Protective Layer for Collective Die to Wafer Hybrid Bonding

机译：集体晶片对晶片混合键合的保护层
- 作者：Fumihiro Inoue;Julien Bertheau;Samuel Suhard;Alain Phommahaxay;Takuya Ohashi;Tetsuro Kinoshita;Yohei Kinoshita;Eric Beyne
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Blades;
- Surface treatment;
- Wafer bonding;
- Three-dimensional displays;
- Stacking;
- Coatings;
29.Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application

机译：SiO 2 / Si衬底上用于Coast-last TSV的各种CoWB化学镀膜的Cu扩散阻挡特性
- 作者：T. Matsudaira;S. Shindo;T. Shimizu;T. Ito;S. Shinguhara;S. Shimizu
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Annealing;
- Films;
- Silicon;
- Metals;
- Through-silicon vias;
- Atomic layer deposition;
- Three-dimensional displays;
30.Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing

机译：利用CMOS模拟信号处理技术开发用于3D堆叠式神经网络芯片的CDS电路
- 作者：Koji Kiyoyama;Qian Zhengy;Hiroyuki Hashimoto;Hisashi Kino;Takafumi Fukushima;Tetsu Tanaka
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Biological neural networks;
- Synapses;
- Signal processing;
- Noise reduction;
- Axons;
- Three-dimensional displays;
31.Study of MacEtch using Additives for Preparation of TSV

机译：MacEtch用添加剂制备TSV的研究
- 作者：Shunsuke Hanatani;Takuya Yorioka;Tomohiro Shimizu;Takeshi Ito;Shoso Shingubara
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Silicon;
- Etching;
- Surfactants;
- Additives;
- Substrates;
- Morphology;
- Gold;
32.Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place Route

机译：使用逐个模具放置和布线的微间距面对面3D系统集成的设计支持
- 作者：Giuliano Sisto;Peter Debacker;Rongmei Chen;Geert Van Der Plas;Richard Chou;Eric Beyne;Dragomir Milojevic
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Metals;
- Tools;
- Two dimensional displays;
- Timing;
- Logic gates;
- Standards;
33.Cu-Cu Bonding Challenges with ‘i-ACF’ for Advanced 3D Integration

机译：使用“ i-ACF”实现高级3D集成的Cu-Cu粘接挑战
- 作者：Shunji Kurooka;Yoshinori Hotta;Ai Nakamura;Mitsumasa Koyanagi;Takahumi Fukushima
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Atmosphere;
- Electrodes;
- Heating systems;
- Thermal resistance;
- Annealing;
34.Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape

机译：高膨胀胶带胶粘剂应力-应变曲线的优化研究
- 作者：Tadatomo Yamada;Ken Takano;Toshiaki Menjo;Shinya Takyu
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Semiconductor device measurement;
- Standards;
- Stress measurement;
- Packaging;
- Three-dimensional displays;
- System integration;
- Blades;
35.3D Integrated Pixel Sensor with Silicon-on-Insulator Technology for the International Linear Collider Experiment

机译：用于国际线性对撞机实验的采用绝缘体上硅技术的3D集成像素传感器
- 作者：Miho Yamada;Shun Ono;Yasuo Arai;Ikuo Kurachi;Toru Tsuboyama;Masayuki Ikebe;Masayuki Ikebe
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Detectors;
- Spatial resolution;
- Gold;
- Stacking;
- Bonding;
- Physics;
36.Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs

机译：顶部硅中介层嵌入背面埋入式金属PDN，以减少大规模数字IC的电源阻抗
- 作者：Takuji Miki;Makoto Nagata;Akihiro Tsukioka;Noriyuki Miura;Takaaki Okidono;Yuuki Araga;Naoya Watanabe;Haruo Shimamoto;Katsuya Kikuchi
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Silicon;
- Impedance;
- Power supplies;
- Cryptography;
- Metals;
- Wiring;
- Monitoring;
37.A Design Scheme for 3-D Stacked CNN Accelerators

机译：3-D堆叠CNN加速器的设计方案
- 作者：Jubee Tada;Kazuto Takahashi;Ryusuke Egawa
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Power demand;
- Bonding;
- Wires;
- Three-dimensional displays;
- System integration;
- Integrated circuit interconnections;
38.Transformer-Less Floating Gate Driver for 3D Power SoC

机译：适用于3D Power SoC的无变压器浮栅驱动器
- 作者：Minami Nakayama;Seiya Abe;Satoshi Matsumoto
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Power supplies;
- DC-DC power converters;
- Switches;
- Logic gates;
- Driver circuits;
- Silicon;
39.Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications

机译：面向5G应用的新型超紧凑，完全基于TGV的自屏蔽带通滤波器的设计和评估
- 作者：Ziyue Zhang;Yingtao Ding;Zhiming Chen;Mingrui Zhou;Lei Xiao;Ziru Cai;Miao Xiong;Xiao Gong
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Band-pass filters;
- Three-dimensional displays;
- Fabrication;
- Inductors;
- Radio frequency;
- Capacitors;
- Glass;
40.Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation

机译：沉积温度和退火条件对低温TSV衬里形成臭氧-乙烯自由基生成-TEOS-CVD SiO 2 的影响
- 作者：Rui Liang;Sungho Lee;Yuki Miwa;Kousei Kumahara;Murugesan Mariappan;Hisashi Kino;Takafumi Fukushima;Tetsu Tanaka
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- System integration;
- Annealing;
- Absorption;
41.Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System

机译：负热膨胀材料底部填充以抑制3D集成系统中的机械应力的研究
- 作者：Hisashi Kino;Takafumi Fukushima;Tetsu Tanaka
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Stress;
- Finite element analysis;
- Integrated circuits;
- Metals;
- Thermal expansion;
- X-ray scattering;
42.3D Integration Technologies for the Stacked CMOS Image Sensors

机译：堆叠式CMOS图像传感器的3D集成技术
- 作者：Y. Kagawa;H. Iwamoto
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Through-silicon vias;
- Substrates;
- Stacking;
- Bonding;
- Random access memory;
- Wiring;
43.Power-Performance Advantages of InFO Technology for Advanced System Integration

机译：InFO技术在高级系统集成方面的性能优势
- 作者：Chuei-Tang Wang;Douglas Yu
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Bandwidth;
- Inductors;
- Flip-chip devices;
- Radio frequency;
- System integration;
- Q-factor;
44.A Universal ADC for Sensor Applications

机译：适用于传感器应用的通用ADC
- 作者：Akira Matsuzawa
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- CMOS image sensors;
- Energy resolution;
- Optical switches;
- Capacitors;
- Voltage measurement;
- Signal resolution;
45.Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects

机译：高密度3D-IC互连的未对准分析和电性能
- 作者：Imed Jani;Didier Lattard;Pascal Vivet;Lucile Arnaud;Edith Beigné
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Integrated circuit interconnections;
- Three-dimensional displays;
- Resistance;
- Capacitance;
- Semiconductor device modeling;
- Tools;
46.3DIC 2019 Authors Index

机译：3DIC 2019作者索引
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Bonding;
- Through-silicon vias;
- Indexes;
- Silicon;
- Hybrid power systems;
47.High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology

机译：采用Bumpless TSV技术的高带宽内存（HBM）和高带宽NAND（HBN）
- 作者：Koji Sakui;Takayuki Ohba
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Three-dimensional displays;
- Bandwidth;
- Random access memory;
- Impedance;
- Two dimensional displays;
- Silicon;
48.Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C

机译：在100°C下用金薄膜进行低温晶圆级金属键合
- 作者：Po-Chih Chen;Demin Liu;Kuan-Neng Chen
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Bonding;
- Gold;
- Copper;
- Surface treatment;
- Three-dimensional displays;
49.Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias

机译：通过硅过孔实现WOW无凸点的温度循环可靠性
- 作者：Chia-Hsuan Lee;Hsin-Chi Chang;Jui-Han Liu;Hiroyuki Ito;Young Suk Kim;Kuan-Neng Chen;Takayuki Ohba
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Cleaning;
- Resistance;
- Reliability;
- Kelvin;
- Three-dimensional displays;
- Integrated circuit interconnections;
50.Reduction of TSV Pumping

机译：减少TSV抽运
- 作者：Quy Dinh;Kazuo Kondo;Tetsuji Hirato
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Copper;
- Through-silicon vias;
- Annealing;
- Polyimides;
- Silicon;
- Stress;
- Thermal expansion;
51.3D Test Wrapper Chain Optimization with I/O Cells Binding Considered

机译：考虑了具有I / O单元绑定的3D测试包装器链优化
- 作者：Fan-Hsuan Tang;Hsu-Yu Kao;Shih-Hsu Huang;Jin-Fu Li
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Three-dimensional displays;
- Optimization;
- System integration;
- Benchmark testing;
- Greedy algorithms;
- Time complexity;
52.Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core

机译：含铜和焊芯的环形槽隔离（ATI）TSV的热应力比较
- 作者：Wei Feng;Naoya Watanabe;Haruo Shimamoto;Masahiro Aoyagi;Katsuya Kikuchi
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Silicon;
- Stress;
- Thermal stresses;
- Metals;
- Substrates;
- Insulators;
53.Development of 3D-IC Embedded Flexible Hybrid System

机译：3D-IC嵌入式柔性混合系统的开发
- 作者：Sungho Lee;Yuki Susumago;Zhengyang Qian;Noriyuki Takahashi;Hisashi Kino;Tetsu Tanaka;Takafumi Fukushima
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Gold;
- Silicon;
- Three-dimensional displays;
- Substrates;
- Fabrication;
- Wiring;
54.High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating

机译：机械自对准和化学镀实现高密度和低温互连
- 作者：Sreejith Kochupurackal Rajan;Ming Jui Li;Muhannad S. Bakir;Gary S May
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Plating;
- Nickel;
- Bonding;
- Copper;
- Silicon;
- Three-dimensional displays;
55.Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror

机译：使用Si-Photonics集成曲面微镜的光学TSV
- 作者：Akihiro Noriki;Isao Tamai;Yasuhiro Ibusuki;Akio Ukita;Satoshi Suda;Daisuke Shimura;Yosuke Onawa;Hiroki Yaegashi;Takeru Amano
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Silicon;
- Optical waveguides;
- Optical coupling;
- Photonics;
- Through-silicon vias;
- Mirrors;
- Optical reflection;
56.X-ray Photon-Counting Imager with CdTe/Si-LSI Stacking

机译：CdTe / Si-LSI堆叠的X射线光子计数成像仪
- 作者：Toru Aoki;Katsuyuki Takagi;Toshiyuki Takagi;Hiroki Kase;Akifumi Koike
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- X-ray imaging;
- Photonics;
- II-VI semiconductor materials;
- Cadmium compounds;
- Large scale integration;
- Imaging;
- Stacking;
57.Heterogeneous and 3D Integration at DARPA

机译：DARPA的异构和3D集成
- 作者：Timothy M. Hancock;Jeffrey C. Demmin
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
58.Heat Transfer in Nanostructured Si and Heat Flux Control Technique

机译：纳米结构硅中的传热和热通量控制技术
- 作者：Masahiro Nomura
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Phonons;
- Heating systems;
- Silicon;
- Crystals;
- Heat transfer;
- Conductivity;
59.Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction

机译：使用Au微凸点结的堆叠式像素传感器/检测器技术
- 作者：Makoto Motoyoshi;Koki Yanagimura;Taiko Fushimi;Shunta Endo
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Gold;
- Detectors;
- Three-dimensional displays;
- Bonding;
- Junctions;
- System integration;
60.Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI

机译：热TSV在3D-LSI中的多层石墨烯生长优化
- 作者：Murugesan Mariappan;Mitsumasa Koyanagi;Takafumi Fukushima
- 会议名称：《》 | 2019年
- Through-silicon vias;
- Graphene;
- Three-dimensional displays;
- Heating systems;
- Silicon;
- System integration;
- Nickel;
61.Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations

机译：合并PDK以构建3D电路的设计环境：方法，挑战和局限性
- 作者：O. Billoint;K. Azizi-Mourier;G. Cibrario;D. Lattard;M. Mouhdach;S. Thuries;P. Vivet
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Metals;
- Merging;
- Layout;
- Tools;
- Foundries;
- Load modeling;
62.Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

机译：迈向完整的直接混合键合D2W集成流程：良模具和模具平面化模块的开发
- 作者：E. Bourjot;P. Stewart;C. Dubarry;E. Lagoutte;E. Rolland;N. Bresson;G. Romano;D. Scevola;V. Balan;J. Dechamp;M. Zussy;G. Mauguen;C. Castan;L. Sanchez;A. Jouve;F. Fournel;S. Cheramy
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- 3DIC;
- KGD;
- hybrid bonding;
- planarization;
- D2W;
63.Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes

机译：静态电流通过嵌入式二极管的模间电阻性开路缺陷的电场测试方法
- 作者：Hanna Soneda;Masaki Hashizume;Hiroyuki Yotsuyanagi;Shyue-Kung Lu
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Integrated circuit interconnections;
- Three-dimensional displays;
- Circuit faults;
- Through-silicon vias;
- Production;
- Voltage measurement;
64.Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration

机译：带TSV集成的表面电极离子阱的设计考虑因素和制造挑战
- 作者：Jing Tao;Hong Yu Li;Peng Zhao;Yu Dian Lim;Anak Agung Alit Apriyana;Chuan Seng Tan
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Electrodes;
- Ions;
- Radio frequency;
- Silicon;
- Fabrication;
- Geometry;
65.SiN used as a Stressor in Germanium-On-Insulator Substrate

机译：SiN用作绝缘体锗衬底上的应力源
- 作者：Sethavut Duangchan;Keisuke Yamamoto;Dong Wang;Hiroshi Nakashima;Akiyoshi Baba
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Substrates;
- Surface treatment;
- Silicon compounds;
- Rough surfaces;
- Surface roughness;
- Silicon;
- Bonding;
66.Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration

机译：弗劳恩霍夫在3D IC集成方面的初步和持续的贡献
- 作者：Peter Ramm;Armin Klumpp;Christof Landesberger;Josef Weber;Andy Heinig;Peter Schneider;Guenter Elst;Manfred Engelhardt
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Three-dimensional displays;
- Through-silicon vias;
- Dielectrics;
- Substrates;
- Solid modeling;
- System integration;
67.Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections

机译：电镀金薄膜互连的长期可靠性的结晶度依赖性
- 作者：Ken Suzuki;Ryota Mizuno;Yutaro Nakoshi;Hideo Miura
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Annealing;
- Gold;
- Grain boundaries;
- Temperature measurement;
- Current density;
- Resistance;
- Reliability;
68.Variability Cancellation to Improve Diagnostic Performance of Testing through Silicon Vias in Power Distribution Network of 3D-IC

机译：取消可变性以改善3D-IC配电网络中通过硅过孔的测试的诊断性能
- 作者：Koutaro Hachiya;Atsushi Kurokawa
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Through-silicon vias;
- Resistance;
- Electrical resistance measurement;
- Testing;
- Probability distribution;
- Standards;
- Manufacturing;
69.Multichip CMOS Image Sensor Structure for Flash Image Acquisition

机译：用于闪存图像采集的多芯片CMOS图像传感器结构
- 作者：Yoshiaki Hagiwara
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Photodiodes;
- Junctions;
- Three-dimensional displays;
- Charge coupled devices;
- Silicon;
- Charge transfer;
70.An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems

机译：芯片封装相互作用的准确评估是设计弹性3D IC系统的关键因素
- 作者：Valeriy Sukharev;Armen Kteyan;Jun-Ho Choy
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Stress;
- Temperature;
- Metals;
- Transistors;
- Three-dimensional displays;
- Silicon;
- Reliability;
71.A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems

机译：成本优化的异构2.5D系统的基于图的微转移打印模型
- 作者：Robert Fischbach;Tilman Horst;Jens Lienig
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Layout;
- Semiconductor device modeling;
- Manufacturing;
- Printing;
- Semiconductor process modeling;
- Optimization;
- IEEE Sections;
72.Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers

机译：芯片级封装的Si光子收发器的垂直光电互连
- 作者：Koichi Takemura;Akio Ukita;Yasuhiro Ibusuki;Mitsuru Kurihara;Akihiro Noriki;Takeru Amano;Daisuke Okamoto;Yasuyuki Suzuki;Kazuhiko Kurata
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Photonics;
- Silicon;
- Integrated optics;
- Optical device fabrication;
- Transceivers;
- Optical fibers;
73.Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface

机译：基于非接触式3D ThruChip接口的邻近通信的分层设计方法和优化
- 作者：Srinivasan Gopal;Deukhyoun Heo;Tanay Karnik
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
74.Process Complexity and Cost Considerations of Multi-Layer Die Stacks

机译：多层模具叠层的工艺复杂性和成本考虑
- 作者：Dimitrios Velenis;Joeri De Vos;Soon-Wook Kim;Jaber J. Derakhshandeh;Pieter Bex;Giovanni Capuz;Samuel Suhard;Kenneth June Rebibis;Stefaan Van Huylenbroeck;Erik Jan Marinissen;Alain Phommahaxay;Andy Miller;Gerald Beyer;Geert Van der Plas;Eric Beyne
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Stacking;
- Bonding;
- Three-dimensional displays;
- Through-silicon vias;
- Testing;
- Compounds;
- System integration;
75.Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D FO Package

机译：材料性能对2.5D和FO封装翘曲和焊点可靠性的影响的研究
- 作者：Koji Hamaguchi;Mitsuki Nakata;Kouta Segawa;Naoya Suzuki;Toshihisa Nonaka
- 会议名称：《International 3D Systems Integration Conference》 | 2019年
- Reliability;
- Soldering;
- Substrates;
- Finite element analysis;
- Strain;
- Plastics;
- Mathematical model;