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ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011

召开年：2011
召开地：Portland, OR(US);Portland, OR(US)
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1.AN INNOVATIVE WAY TO MEASURE TEMPERATURE BY USING THE FARADAY EFFECT

机译：利用法拉第效应测量温度的创新方法
- 作者：Pranav Limaye;Anisur Rahman
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
2.EFFECT OF THICKNESS OF PD PLATING LAYER ON SHEAR STRENGTH OF LEAD-FREE SOLDER BALL JOINT WITH ELECTROLESS NI/PD/AU PLATED ELECTRODE

机译：PD镀层厚度对无镍/ PD / AU化学镀铅无铅焊球接头抗剪强度的影响
- 作者：Takahiro Kano;Ikuo Shohji;Tetsuyuki Tsuchida;Toshikazu Ookubo
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
3.EROSION BEHAVIOR OF PLASMA NITRIDING STAINLESS STEEL BY MOLTEN SN-AG-CU LEAD-FREE SOLDER

机译：SN-AG-CU无铅焊料等离子渗氮不锈钢的腐蚀行为
- 作者：Naoya Matsubara;Ikuo Shohji;Hideyuki Kuwahara
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
4.HYBRID COOLING TECHNOLOGY FOR LARGE-SCALE COMPUTING SYSTEMS - FROM BACK TO THE FUTURE -

机译：大型计算系统的混合冷却技术-从回到未来-
- 作者：Jie Wei
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
5.HIGH PERFORMANCE THERMAL CONDUCTIVE SHEETS MADE OF CARBON FIBERS

机译：碳纤维制成的高性能导热胶
- 作者：Keisuke Aramaki;Yuichi Ishida;Hiroyuki Ryoson
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
6.A RACK-LEVEL COOLING REDUNDANCY METRIC FOR DATA CENTER APPLICATIONS

机译：数据中心应用的机架级冷却冗余度量
- 作者：James W. VanGilder;Christopher M. Healey
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
7.ENERGY EFFICIENT DATA CENTERS USING EVAPORATIVE COOLING AND AIR SIDE ECONOMIZERS

机译：使用蒸发冷却和空气侧节能器的节能数据中心
- 作者：Madhusudan lyengar;Roger Schmidt
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
8.EFFECT OF THE ORGANIC ACID SURFACE MODIFICATION ON BOND STRENGTH OF TIN AND COPPER

机译：有机酸改性对锡和铜结合强度的影响
- 作者：Shinji Koyama;Yukinari Aoki;Ikuo Shohji
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
9.Electromigration in Copper-Core Solder Ball Joints during Thermal Cycle Tests

机译：热循环测试期间铜芯焊球接头中的电迁移
- 作者：Shinichi Fujiwara;Nobuhiko Chiwata;Masaru Fujiyoshi;Motoki Wakano;Hisashi Tanie
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
10.Robust Thermal Management for Embedded CPU and GPUs in Displays

机译：显示器中嵌入式CPU和GPU的强大热管理
- 作者：Sung Ki Kim;Vincent Tan;Gamal Refai-Ahmed;Ali Akbar Merrikh
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
11.DEVELOPMENT OF A COMPLIANT NANOTHERMAL INTERFACE MATERIAL

机译：兼容的纳米热界面材料的开发
- 作者：David Shaddock;Stanton Weaver;Ioannis Chasiotis;Binoy Shah;Dalong Zhong
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
12.DEVELOPMENT OF A HYBRID PCM-AIR HEAT SINK

机译：混合PCM-空气热沉的开发
- 作者：Y. Kozak;B. Abramzon;G. Ziskind
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
13.FUNDAMENTAL STUDY ON THERMAL CHARACTERISTICS OF HEAT SPREADERS

机译：散热器热特性的基础研究
- 作者：Yasushi Koito;Yusaku Nonaka;Toshio Tomimura
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
14.THE EFFECT OF UNDER-FLOOR OBSTRUCTIONS ON DATA CENTER PERFORATED TILE AIRFLOW

机译：地板下的障碍物对数据中心穿孔磁砖气流的影响
- 作者：James W. VanGilder;Xuanhang (Simon) Zhang;Zachary R. Sheffer;Collyn T. OKane
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
15.A STATISTICAL APPROACH TO THERMAL ZONE MAPPING

机译：热区映射的统计方法
- 作者：Hongfei Li;Hendrik F. Hamann
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
16.ENERGY SAVINGS THROUGH HOT AND COLD AISLE CONTAINMENT CONFIGURATIONS FOR AIR COOLED SERVERS IN DATA CENTERS

机译：通过数据中心中的空气冷却服务器通过热和冷通道控制配置来节省能源
- 作者：Roger Schmidt;Aparna Vallury;Madhusudan lyengar
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- data center containment;
- hot aisle;
- cold aisle;
- chimney;
- data center ventilation;
- data center air cooling;
- servers;
- containment case study;
17.EXPERIMENTAL CHARACTERIZATION OF SERVER RACK ENERGY USE AT ELEVATED AMBIENT TEMPERATURES

机译：在较高环境温度下服务器机架能源使用的实验表征
- 作者：Madhusudan lyengar;Roger Schmidt;Vinod Kamath;Bejoy Kochuparambil
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
18.EFFECT OF AGING ON TENSILE PROPERTIES AND MICROSTRUCTURES OF EUTECTIC SN-PB SOLDER WITH SMALL AMOUNTS OF AU AND PD FOR AEROSPACE APPLICATION

机译：时效对航天用AU和PD含量小的共晶SN-PB焊料的拉伸性能和显微组织的影响
- 作者：Ryou Kikuchi;Ikuo Shohji;Yuta Saitoh;Norio Nemoto;Tsuyoshi Nakagawa;Nobuaki Ebihara;Fusao Iwase
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
19.STRESS-INDUCED AND ELECTRO-MIGRATION OF ELECTROPLATED COPPER THIN FILM INTERCONNECTIONS USED FOR 3D INTEGRATION

机译：用于3D集成的电镀铜薄膜薄膜互连的应力诱导和电迁移
- 作者：Naoki Saito;Naokazu Murata;Kinji Tamakawa;Ken Suzuki;Hideo Miura
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
20.Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

机译：微型Sn-Ag-Cu焊点的疲劳寿命和断裂行为
- 作者：Tashiro Naoki;Yoshiharu Kariya;Yoshihiko Kanda
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
21.Effect of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for Sn Based Alloy

机译：循环应变强化指数对锡基合金疲劳韧性指数的影响
- 作者：Yoshihiko Kanda;Yusuke Shiigi;Yuji Oto;Yoshiharu Kariya
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
22.MODELING OF FAN FAILURES IN NETWORKING ENCLOSURES

机译：网络机箱中的风扇故障建模
- 作者：Susheela Narasimhan;Gokul Shankaran
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
23.Heat transfer characteristics of aluminum plate pulsating heat pipes

机译：铝板脉动热管的传热特性
- 作者：Z. R. Lin;Z.Y. Lee;L.W. Zhang;S.F. Wang;A.A. Merrikh;G.Refai-Ahmed
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
24.INVESTIGATION OF EFFECT OF WIRING PATTERNS ON IN-PLANE THERMAL CONDUCTIVITY OF PRINTED CIRCUIT BOARDS

机译：布线图案对印刷电路板平面内导热性的影响的研究
- 作者：Yuta NAKANO;Tomoyuki HATAKEYAMA;Masaru ISHIZUKA;Shinji NAKAGAWA;Masataka HIROKAWA;Toshio TOMIMURA
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
25.High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

机译：用于低品位废热回收应用的高性能微槽式蒸发传热表面
- 作者：Vibhash Jha;Serguei Dessiatoun;Michael Ohadi;Amir Shooshtari;Ebrahim Al-Hajri
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
26.LIQUID COOLING NETWORK SYSTEMS FOR ENERGY CONSERVATION IN DATA CENTERS

机译：数据中心节能的液体冷却网络系统
- 作者：Mayumi Ouchi;Yoshiyuki Abe;Masato Fukagaya;Haruhiko Ohta;Yasuhisa Shinmoto;Masahide Sato;Ken-ichi limura
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
27.REAL-TIME DATA CENTER TRANSIENT ANALYSIS

机译：实时数据中心瞬态分析
- 作者：Xuanhang(Simon)Zhang;James W. VanGilder
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
28.A DATA CENTER ENVIRONMENTAL ADVISORY SYSTEM

机译：数据中心环境咨询系统
- 作者：Christopher Hoover;Niru Kumari;Carlos Felix;Cullen Bash
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
29.OPTIMIZATION OF OUTSIDE AIR COOLING IN DATA CENTERS

机译：数据中心的外部空气冷却的优化
- 作者：Niru Kumari;Rocky Shih;Alan McReynolds;Ratnesh Sharma;Tom Christian;Cullen Bash
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
30.CHARACTERIZATION OF A SERVER THERMAL MASS USING EXPERIMENTAL MEASUREMENTS

机译：使用实验测量来表征服务器热质量
- 作者：Mahmoud Ibrahim;Furat Afram;Bahgat Sammakia;Kanad Ghose;Bruce Murray;Madhusudan lyengar;Roger Schmidt
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
31.Humidity Control and Dew Point Management

机译：湿度控制和露点管理
- 作者：Levente J. Klein;Hendrik F. Hamann
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
32.IC-PACKAGE THERMAL CO-ANALYSIS IN 3D IC ENVIRONMENT

机译：3D IC环境中的IC封装热协同分析
- 作者：Stephen H. Pan;Norman Chang;Ji Zheng
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
33.IR-BASED INVERSE CALCULATION OF TWO-PHASE HEAT TRANSFER COEFFICIENTS IN MICROGAP CHANNELS

机译：微间隙通道中两相传热系数的基于红外的逆计算
- 作者：Jessica Sheehan;Avram Bar-Cohen
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
34.IMPROVEMENT OF HEAT TRANSFER PERFORMANCE OF LOOP HEAT PIPE FOR ELECTRONIC DEVICES

机译：电子设备环热管传热性能的改进
- 作者：Tomonao Takamatsu;Katsumi Hisano;Hideo Iwasaki
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
35.DEVELOPMENT OF MICRO/NANO ENGINEERED WICK-BASED PASSIVE HEAT SPREADERS FOR THERMAL MANAGEMENT OF HIGH POWER ELECTRONIC DEVICES

机译：用于大功率电子设备热管理的微/纳米工程吸水基被动传热器的开发
- 作者：David H. Altman;Joseph R. Wasniewski;Mark T. North;Sungwon S. Kim;Timothy S. Fisher
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- heat spreader;
- nanostructured wicks;
- heat pipe;
- vapor chamber;
- thermal resistance;
- sintered powder wick;
- carbon nanotube (cnt);
- boiling;
36.ASSESSMENT OF THERMAL PERFORMANCE OF ELECTRONIC ENCLOSURES WITH RECTANGULAR FINS: A PASSIVE THERMAL SOLUTION

机译：带有矩形翅片的电子外壳的热性能评估：一种无源热解决方案
- 作者：A. Tamayol;F. McGregor;E. Demian;E. Trandafir;P. Bowler;P. Rada;M. Bahrami
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
37.THERMAL RESISTANCE MEASUREMENT AND THERMAL NETWORK ANALYSIS OF PRINTED CIRCUIT BOARD WITH THERMAL VIAS

机译：印制电路板热阻的热阻测量和热网络分析
- 作者：Tomoyuki Hatakeyama;Shinji Nakagawa;Masaru Ishizuka;Sadakazu Takakuwa
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
38.EXPERIMENTAL AND SIMULATION STUDY OF THE EFFECT OF POWER PACKAGE CONFIGURATION ON ITS THERMAL PERFORMANCE

机译：功率配置对热性能影响的实验与仿真研究
- 作者：Cong Yue;Xiaotian Zhang;Jun Lu;Yueh-Se Ho
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
39.TSV Interposers with Embedded Microchannels for 3D IC and LED Integration

机译：具有嵌入式微通道的TSV中介层，用于3D IC和LED集成
- 作者：John Lau;Heng-Chieh Chien;Ray Tain
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
40.ADVANCED LIQUID COOLING TECHNOLOGY EVALUATION FOR HIGH POWER CPUS AND GPUS

机译：大功率CPU和GPU的先进液体冷却技术评估
- 作者：Ridvan A. Sahan;Rahima K. Mohammed;Amy Xia;Ying-Feng Pang
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
41.SILICON HOT SPOT REMEDIATION WITH A GERMANIUM SELF COOLING LAYER

机译：锗自冷却层修复硅热斑
- 作者：Horacio Nochetto;Peng Wang;Avram Bar-Cohen
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
42.DO YOU KNOW YOUR ONBOARD TEMPERATURE SENSING IC?

机译：您知道车载温度感应IC吗？
- 作者：Herman Chu
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
43.DESIGN OF SIMULATED SERVER RACKS FOR DATA CENTER RESEARCH

机译：数据中心研究的模拟服务器机架设计
- 作者：James F. Smith;Waleed A. Abdelmaksoud;Hamza S. Erden;John F. Dannenhoffer;Thong Q. Dang;H. Ezzat Khalifa;Roger R. Schmidt;Madhusudan lyengar
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
44.SERVER HEAT LOAD BASED CRAC FAN CONTROLLER PAIRED WITH REAR DOOR HEAT EXCHANGER

机译：基于服务器热负荷的CRAC风扇控制器与后门换热器配对
- 作者：Vikneshan Sundaralingam;Pratnod Kumar;Yogendra Joshi
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- pdu power monitoring;
- crac;
- vfd;
- control;
45.COLD AISLE AIR DISTRIBUTION IN A RAISED FLOOR DATA CENTER WITH HETEROGENEOUS OPPOSING ORIENTATION RACKS

机译：具有异类对向定向机架的高架地板数据中心中的冷通道气流分布
- 作者：Pramod Kumar;Yogendra Joshi;Michael K Patterson;Robin Steinbrecher;Marissa Mena
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
46.POTENTIAL-FLOW MODELING FOR DATA CENTER APPLICATIONS

机译：数据中心应用的潜力流建模
- 作者：Christopher M. Healey;Zachary R. Sheffer;James W. VanGilder;Xuanhang (Simon) Zhang
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
47.A NUMERICAL TECHNIQUE FOR THE APPROXIMATION OF THERMAL ZONES

机译：逼近热区的数值技术
- 作者：Vanessa Lopez;Hendrik F. Hamann
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
48.EMPLOYING THERMAL ZONES FOR ENERGY OPTIMIZATION IN DATA CENTERS

机译：在数据中心中使用热区进行能量优化
- 作者：Srinivas Yarlanki;Rajarshi Das;Hendrik Hamann;Vanessa Lopez;Andrew Stepanchuk
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
49.EFFECT OF CRYSTALLOGRAPHIC QUALITY OF GRAIN BOUNDARIES ON BOTH MECHANICAL AND ELECTRICAL PROPERTIES OF ELECTROPLATED COPPER THIN FILM INTERCONNECTIONS

机译：晶界的结晶学质量对电镀铜薄膜互连的力学和电学性能的影响
- 作者：Naokazu Murata;Naoki Saito;Kinji Tamakawa;Ken Suzuki;Hideo Miura
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
50.DEVELOPMENT OF HIGHLY RELIABLE BGA AND FLIP-CHIP STRUCTURES BY USING CU-CORED SOLDER BALL

机译：利用铜芯焊球开发高可靠性的BGA和倒装芯片结构
- 作者：Hisashi Tanie;Nobuhiko Chiwata;Motoki Wakano;Masaru Fujiyoshi;Shinichi Fujiwara
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
51.EFFECT OF INTERFACIAL LAYERS ON THE PERFORMANCE OF Cu-ln LIQUID PHASE SINTERED COMPOSITES AS THERMAL INTERFACE AND INTERCONNECT MATERIALS

机译：界面层对作为热界面和互连材料的Cu-In液相烧结复合材料性能的影响
- 作者：J. Liu;P. Kumar;I. Dutta;CM. Nagaraj;R. Raj;M. Renavikar;R. Mahajan
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
52.EXPERIMENTAL INVESTIGATION OF THE THERMAL PERFORMANCE OF A MANIFOLD HIERARCHICAL MICROCHANNEL COLD PLATE

机译：流形多级微通道冷板热性能的实验研究
- 作者：Ercan M. Dede
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
53.OPTIMIZED THERMOELECTRIC MODULE-HEAT SINK ASSEMBLIES FOR PRECISION TEMPERATURE CONTROL

机译：用于精确温度控制的优化热电模块散热片组件
- 作者：Rui Zhang;David A. Brooks;Marc Hodes;Matthew van Lieshout;Vincent P. Manno
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
54.NUMERICAL SIMULATION OF LOCAL HEAT TRANSFER AND SCALING OF A SYNTHETIC IMPINGING JET IN A CANONICAL GEOMETRY

机译：规范几何中局部传热与合成射流尺度的数值模拟。
- 作者：Luis Silva;Alfonso Ortega
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
55.ON THE LATERAL MOTION OF BUBBLES GENERATED FROM RE-ENTRANT CAVITIES LOCATED ON ASYMMETRICALLY STRUCTURED SURFACES

机译：由不对称结构表面上的再进入腔产生的气泡的横向运动
- 作者：Naveenan Thiagarajan;Florian Kapsenberg;Vinod Narayanan;Sushil H. Bhavnani;Charles Ellis
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
56.DEPENDENCE OF FLOW BOILING HEAT TRANSFER COEFFICIENT ON LOCATION AND VAPOR QUALITY IN A MICROCHANNEL HEAT SINK

机译：微通道热沉中沸腾传热系数与位置和蒸气质量的相关性
- 作者：Ravi S. Patel;Tannaz Harirchian;Suresh V. Garimella
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
57.ENHANCED THERMAL MAP PREDICTION AND FLOOR PLAN OPTIMIZATION IN ELECTRONIC DEVICES CONSIDERING SUB-CONTINUUM THERMAL EFFECTS

机译：考虑亚连续热效应的电子设备中增强的热图预测和楼层平面优化
- 作者：David Romero;Aydin Nabovati;Gamal Refai-Ahmed;Daniel P. Sellan;Saeed Ghalambor;Niket Shah;Dereje Agonafer;Cristina H. Amon
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
58.AN OVERVIEW OF THE POWER 775 SUPERCOMPUTER WATER COOLING SYSTEM

机译：POWER 775超级计算机水冷却系统的概述
- 作者：Michael J. Ellsworth;Amilcar Arvelo;Gary F. Goth;Levi A. Campbell;Randy J. Zoodsma;William J. Anderl
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
59.ADVANCES IN FAN MODELING - USING MULTIPLE REFERENCE FRAME (MRF) APPROACH ON BLOWERS

机译：风扇建模的先进技术-在鼓风机上使用多重参考框架（MRF）方法
- 作者：Gokul Shankaran;M. Baris Dogruoz
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- fan modeling;
- multiple reference frame (mrf);
- swirl;
- p-q curve;
- axial fan;
- centrifugal blower;
- radial impeller;
- blade;
- vane;
60.THINNER THERMAL SOLUTION MODULE BY COMBINATION OF THIN HEAT PIPE AND PIEZO FAN

机译：薄型热管和压电风扇结合使用的更薄的热溶液模块
- 作者：Ahmad Jalilvand;Yoji Kawahara;Masataka Mochizuki;Vijit Wuttijumnong;Yuji Saito;Thang Nguyen
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
61.THE MICROELECTRONICS COOLING IMPACT AND COMPARISON OF 2D AND 3D UNSTEADY EFFECTS OF A PAIR OF OPPOSED CONFINED ANGLED IMPINGING AIR JETS

机译：一对对置有限角度撞击空气射流的微电子冷却影响和2D和3D非定常效应的比较
- 作者：Victor Adrian Chiriac;Jorge Luis Rosales
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- opposite;
- confined;
- angled;
- impinging;
- jets;
- cooling;
- unsteady;
- laminar;
62.REDUCED RACK EXHAUST TEMPERATURE GRADIENT VIA VARIABLE CHASSIS FLOW RATE

机译：通过可变底盘流量降低机架排气温度梯度
- 作者：Thong Dang;Carine Serreli;H. Ezzat Khalifa;Roger R. Schmidt;Madhusudan Iyengar
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
63.NUMERICAL STUDY ON THE REDUCTION OF RECIRCULATION USING SEALED COLD AISLES AND ITS EFFECTS ON THE EFFICIENCY OF THE COOLING INFRASTRUCTURE

机译：密封冷通道减少回风的数值研究及其对冷却基础设施效率的影响
- 作者：Mahmoud Ibrahim;Bruce Murray;Bahgat Sammakia;Madhusudan lyengar;Siddharth Bhopte;Roger Schmidt
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
64.CONTRIBUTION OF HEAT PIPE TO THE ENERGY CONSERVATION OF DATA CENTER AND CLOUD COMPUTERS

机译：热管对数据中心和云计算计算机的节能的贡献
- 作者：Masataka Mochizuki;Thang Nguyen;Koichi Mashiko;Yuji Saito;Xiao Ping Wu;Tien Nguyen;Vijit Wuttijumnong;Randeep Singh
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
65.HIGH STRAIN RATE FRACTURE BEHAVIOR OF Sn-Ag-Cu SOLDER JOINTS ON Cu SUBSTRATES

机译：铜基体上锡-银-铜焊料接头的高应变率断裂行为
- 作者：Z. Huang;P. Kumar;I. Dutta;J. H. L. Pang;R. Sidhu;M. Renavikar;R.Mahajan
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
66.An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes with Rectangular Shaped Evaporator

机译：矩形蒸发器微型回路热管传热特性的实验研究
- 作者：Z.R. Lin;Z.Y. Lee;L.W.Zhang;S.F. Wang;A.A. Merrikh;G. Refai-Ahmed
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- miniature flat loop heat pipe;
- rectangular-shaped evaporator;
- gpu cooling;
67.TWO-PHASE MINICHANNEL COLD PLATE FOR ARMY VEHICLE POWER ELECTRONICS

机译：军用电力电子两相微通道冷板
- 作者：Darin J. Sharar;Brian Morgan;Nicholas R. Jankowski;Avram Bar-Cohen
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
68.Impedance-Based Void Fraction Measurement and Flow Regime Identification in MicroChannel Flows

机译：微通道流中基于阻抗的空隙率测量和流态识别
- 作者：Sidharth Paranjape;Susan N. Ritchey;Suresh V. Garimella
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
69.THERMAL CHARACTERIZATION OF NON-ISOLATED DC TO DC CONVERTOR

机译：非隔离式DC-DC转换器的热特性
- 作者：Shiladitya Chakravorty;Bahgat Sammakia;Varaprasad Calmidi
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
70.CHARACTERIZATION OF METALLICALLY BONDED CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS USING A HIGH ACCURACY 1D STEADY-STATE TECHNIQUE

机译：基于高精度一维稳态技术的金属结合碳纳米管热界面材料的表征
- 作者：Joseph R. Wasniewski;David H. Altman;Stephen L. Hodson;Timothy S. Fisher;Anuradha Bulusu;Samuel Graham;Baratunde A. Cola
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
71.ENERGY MODELING OF AIR-COOLED DATA CENTERS: PART I THE OPTIMIZATION OF ENCLOSED AISLE CONFIGURATIONS

机译：空冷数据中心的能量建模：第一部分，封闭通道配置的优化
- 作者：Dustin W. Demetriou;H. Ezzat Khalifa
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
72.ENERGY MODELING OF AIR-COOLED DATA CENTERS: PART II THE EFFECT OF RECIRCULATION ON THE ENERGY OPTIMIZATION OF OPEN-AISLE, AIR-COOLED DATA CENTERS

机译：空冷数据中心的能量建模：第二部分再循环对开放式空冷数据中心的能量优化的影响
- 作者：Dustin W. Demetriou;H. Ezzat Khalifa
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
73.EVALUATION OF A DATA CENTER RECIRCULATION NON-UNIFORMITY METRIC USING COMPUTATIONAL FLUID DYNAMICS

机译：基于计算流体动力学的数据中心换向非均匀性评价
- 作者：Dustin W. Demetriou;H. Ezzat Khalifa
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
74.DYNAMIC REDUCED ORDER THERMAL MODELING OF DATA CENTER AIR TEMPERATURES

机译：数据中心空气温度的动态降阶热模型
- 作者：Rajat Ghosh;Yogendra Joshi
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- Transient data center;
- Proper Orthogonal Decomposition;
- Reduced order model;
75.FROM CHIP TO COOLING TOWER DATA CENTER MODELING: CHIP LEAKAGE POWER AND ITS IMPACT ON COOLING INFRASTRUCTURE ENERGY EFFICIENCY

机译：从芯片到冷却塔数据中心建模：芯片泄漏功率及其对冷却基础设施能源效率的影响
- 作者：Thomas J. Breen;Ed J. Walsh;Jeff Punch;Amip J. Shah;Cullen E. Bash;Niru Kumari;Tahir Cader
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
76.SPATIALLY-AWARE OPTIMIZATION OF ENERGY CONSUMPTION IN CONSOLIDATED DATA CENTER SYSTEMS

机译：整合数据中心系统中能源消耗的空间感知优化
- 作者：Hui Chen;Mukil Kesavan;Karsten Schwan;Ada Gavrilovska;Pramod Kumar;Yogendra Joshi;School of Computer
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
77.AN INVESTIGATION INTO COOLING SYSTEM CONTROL STRATEGIES FOR DATA CENTER AIRFLOW CONTAINMENT ARCHITECTURES

机译：数据中心气流遏制体系结构的冷却系统控制策略的研究
- 作者：Michael K Patterson;Rainer Weidmann;Markus Leberecht;Manuel Mair;Richard M Libby
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
78.MULTIVARIATE PREDICTION OF AIRFLOW AND TEMPERATURE DISTRIBUTIONS USING ARTIFICIAL NEURAL NETWORKS

机译：基于人工神经网络的气流和温度分布的多元预测
- 作者：Zhihang Song;Bruce T. Murray;Bahgat Sammakia
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
79.EFFECT OF MICRO STRUCTURE ON FATIGUE CHARACTERISTICS OF LEAD FREE SOLDER JOINTS

机译：微观结构对无铅焊料接头疲劳特性的影响
- 作者：Takahiro Akutsu;Qiang Yu
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
80.COOLING PERFORMANCE COMPARISONS OF FIVE DIFFERENT PLATE-PIN COMPOUND HEAT SINKS BASED ON TWO DIFFERENT LENGTH SCALE

机译：基于两种不同长度尺度的五种不同平板销钉复合散热片的冷却性能比较
- 作者：Feng Zhou;David Geb;Ivan Catton
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
81.AN INVESTIGATION OF POWER MIGRATION POLICIES FOR MANY-CORE PROCESSORS TO MANAGE ON-CHIP THERMAL PROFILE

机译：多核处理器管理芯片上热特性的功率迁移策略的研究
- 作者：Man Prakash Gupta;Minki Cho;Saibal Mukhopadhyay;Satish Kumar
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
82.ON THE NEED FOR ENERGY EFFICIENCY METRICS THAT SPAN INTEGRATED IT-FACILITY INFRASTRUCTURES

机译：跨集成IT设施基础架构的能源效率指标的需求
- 作者：Amip J. Shah;Cullen E. Bash;Niru Kumari;Tahir Cader;Thomas J. Breen;Ed J. Walsh;Jeff Punch
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
83.INFLUENCE OF EXPERIMENTAL UNCERTAINTY ON PREDICTION OF HOLISTIC MULTI-SCALE DATA CENTER ENERGY EFFICIENCY

机译：实验不确定性对整体多尺度数据中心能量效率预测的影响
- 作者：Thomas J. Breen;Ed J. Walsh;Jeff Punch;Amip J. Shah;Niru Kumari;Cullen E. Bash;Scot Heath;Brandon Rubenstein
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
84.An Experimentally Validated Model for Transport in Thin, High Thermal Conductivity, Low CTE Heat Spreaders

机译：在薄，高导热率，低CTE散热器中传输的实验验证模型
- 作者：Ram Ranjan;Jayathi Y. Murthy;Suresh V. Garimella;David H. Altman
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
85.CRITICAL HEAT FLUX DURING SUBMERGED JET IMPINGEMENT BOILING OF SATURATED WATER AT SUB-ATMOSPHERIC CONDITIONS

机译：亚大气条件下饱和水淹没射流沸腾过程中的临界热通量
- 作者：Ruander Cardenas;Vinod Narayanan
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
86.A DATA-CENTRIC APPROACH FOR INTEGRATED DATA CENTER MANAGEMENT

机译：集成数据中心管理的以数据为中心的方法
- 作者：Christopher Hoover
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
87.LAMINAR CONVECTIVE HEAT TRANSFER OF ALUMINA-POLYALPHAOLEFIN NANOFLUIDS CONTAINING SPHERICAL AND NON-SPHERICAL NANOPARTICLES

机译：包含球形和非球形纳米粒子的铝-聚丙烯酸酯纳米流体的层流对流换热
- 作者：Leyuan Yu;Dong Liu;Frank Botz
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
88.EXPERIMENTAL CHARACTERIZATION AND VISCOPLASTIC MODELING OF THE TEMPERATURE DEPENDENT MATERIAL BEHAVIOR OF UNDERFILL ENCAPSULANTS

机译：填充物温度依赖性材料行为的实验表征和粘塑性建模
- 作者：Nusrat J. Chhanda;Jeffrey C. Suhling;Pradeep Lall
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- Underfill;
- Encapsulant;
- Viscoelastic;
- Viscoplastic;
- Material Behavior;
- Creep;
89.SUMBERGED JET IMPINGEMENT BOILING ON A POLISHED SILICON SURFACE

机译：抛光的硅表面上的浸没式射流冲击冷却
- 作者：Preeti Mani;Ruander Cardenas;Vinod Narayanan
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
90.THE EFFECTS OF DOPANTS ON THE AGING BEHAVIOR OF LEAD FREE SOLDERS

机译：掺杂对无铅焊料老化行为的影响
- 作者：Zijie Cai;Jeffrey C. Suhling;Pradeep Lall;Michael J. Bozack
- 会议名称：《ASME Pacific Rim technical conference and exhibition on packaging and integration of electronic and photonic systems, MEMS and NEMS;IPACK2011》 | 2012年
- lead free solder;
- sac;
- sac-x;
- dopant;
- aging;
- stress-strain curve;
- creep;