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Electronic Components and Technology Conference, 2004. Proceedings. 54th
Electronic Components and Technology Conference, 2004. Proceedings. 54th
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2004
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1.
A novel silica planar waveguide structure with high thermal efficiency
机译:
具有高热效率的新型二氧化硅平面波导结构
作者:
Yu E.
;
Zheng D.W.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical planar waveguides;
silicon compounds;
optical communication equipment;
ridge waveguides;
transient response;
planar lightwave circuits;
silica planar waveguide structure;
high thermal efficiency structure;
integrated planar waveguide technology;
optical communication;
channel-waveguide structure;
vacuum gap based ridge waveguide;
insertion loss;
PI phase change;
thermal cross talk;
transient thermal response;
splitters;
variable optical attenuators;
5 mm;
SiO/sub 2/;
2.
Cavity-down thermal-enhanced package reliability evaluation for low-k dielectric/Cu interconnects IC
机译:
低k介电/铜互连IC的腔内热增强封装可靠性评估
作者:
Pei-Haw Tsao
;
Chender Huang
;
Allan Lin
;
Mirng-Ji Lii
;
Perng D.J.
;
Nun-Sian Tsai
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
flip-chip devices;
integrated circuit reliability;
integrated circuit packaging;
encapsulation;
delamination;
transfer moulding;
curing;
thermal management (packaging);
cavity-down package;
low-k chip;
thermal-enhanced package reliability;
IC packaging;
IC chip integrity;
low dielectric constant intermetal-dielectric;
encapsulation process;
transfer-mold process;
chip corner defects;
high shrinkage rate;
free-body movement;
curing process;
delamination failure;
low coefficient of thermal expansion;
3.
Effect of spin coating on the interfacial adhesion of epoxy adhesive on silicon substrate for the fabrication of polymer optical waveguide
机译:
旋涂对环氧粘合剂在硅基体上界面粘合的影响
作者:
Chan A.H.P.
;
Uddin M.A.
;
Chow C.K.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical fabrication;
optical planar waveguides;
optical polymers;
adhesion;
adhesives;
shear strength;
spin coating;
curing;
polymer films;
spin coating;
interfacial adhesion;
epoxy adhesive;
silicon substrate;
polymer optical waveguide fabrication;
mixed solutions;
adhesion strength;
shear button test;
crosslinking density;
fracture surfaces;
thinning behavior;
optical microscopy;
thin polymer films;
curing process;
4.
Electronics packaging - a course for the Rutgers University School of Electrical and Computer Engineering
机译:
电子封装-罗格斯大学电气与计算机工程学院的课程
作者:
Caggiano M.F.
;
Ho K.M.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
educational courses;
integrated circuit packaging;
electronic engineering education;
courseware;
further education;
electronics packaging;
university course;
audio recording process;
electrical engineering students;
industry part time students;
signal integrity;
microelectronics industry;
computer based lecture notes;
PowerPoint Slides;
web page format;
IC packages;
5.
Shape controlled synthesis of nanoparticles and their incorporation into polymers
机译:
纳米粒子的形状控制合成及其掺入聚合物中
作者:
Pothukuchi S.
;
Yi Li
;
Wong C.P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
nanoparticles;
nanocomposites;
nanowires;
percolation;
particle size;
filled polymers;
conducting polymers;
capacitance;
X-ray diffraction;
transmission electron microscopy;
reduction (chemical);
powder technology;
curing;
nanoparticles;
shape controlled synthesis;
nanotechnology;
particle size control;
epoxy matrix incorporation;
polymer-metal composites;
percolation threshold;
capacitance increase;
shaped fillers;
dielectric properties;
nanocubes;
nanospheres;
nanowires;
nanocomposites;
first connected path;
silver particle synthesis;
X-ray diffraction;
filtration;
centrifugation;
TEM;
reduction reaction;
PWB compatible composite dielectric;
low processing temperatures;
curing;
1 to 100 nm;
6.
A multiple frequency signal generator for 802.11a/b/g VoWLAN type applications using organic packaging technology
机译:
使用有机封装技术的802.11a / b / g VoWLAN类型应用的多频信号发生器
作者:
Dalmia S.
;
Bavisi A.
;
Mukherjee S.
;
Govind V.
;
White G.
;
Swaminathan M.
;
Sundaram V.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electronics packaging;
wireless LAN;
transceivers;
UHF oscillators;
microwave oscillators;
feedback oscillators;
phase noise;
multiple frequency signal generator;
802.11a/b/g VoWLAN type application;
organic packaging technology;
passive components;
GSM band;
DCS-1800 band;
multiresonant passives;
feedback networks;
frequency diversity;
concurrent oscillators;
transceivers;
2.45 GHz;
5.2 GHz;
900 MHz;
1.9 GHz;
7.
A novel joint-in-via, flip-chip chip-scale package
机译:
一种新颖的通孔倒装芯片级封装
作者:
Lee T.K.
;
Zhang S.
;
Wong C.C.
;
Tan A.C.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
chip scale packaging;
flip-chip devices;
integrated circuit metallisation;
integrated circuit reliability;
fine-pitch technology;
flip-chip chip-scale package;
joint-in-via architecture;
pad pitch resolutions;
high-density routing;
flex laminate;
material optimization;
reliability tests;
low-cost packaging;
fine-pitch;
8.
Accelerated thermal cycling: is it different for lead-free solder?
机译:
加速热循环:无铅焊料有何不同?
作者:
Tunga K.
;
Kacker K.
;
Pucha R.V.
;
Sitaraman S.K.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
thermal management (packaging);
finite element analysis;
circuit reliability;
slip;
plastic deformation;
diffusion creep;
solders;
reflow soldering;
life testing;
accelerated thermal cycling;
lead-free solder;
extreme temperatures;
temperature ramps;
dwell times;
deformation mechanisms;
solder joints;
solder composition;
time independent plastic deformation;
slip bands;
time dependent creep deformation;
diffusional flow of vacancies;
grain boundary sliding;
BGA packages;
field-use conditions;
finite-element models;
moire interferometry;
9.
Characterization of transfer molding effects on RF performance of power amplifier module
机译:
传递模塑特性对功率放大器模块RF性能的影响
作者:
Li L.
;
Kapur A.
;
Heames K.B.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
UHF power amplifiers;
transceivers;
cellular radio;
transfer moulding;
MOS capacitors;
permittivity;
dielectric losses;
S-parameters;
electronics packaging;
transfer molding effects;
RF performance;
power amplifier module;
GSM/GPRS mobile phone;
output power degradation;
design compensation;
molding compound dielectric property;
dielectric loss tangent;
electromagnetic simulations;
MOS capacitors;
wirebonds;
glob top encapsulation;
small signal gain;
RF front end;
output matching structures;
S-parameter;
1850 to 1910 MHz;
10.
Compliant die-package interconnects at high frequencies
机译:
兼容的管芯封装高频互连
作者:
Braunisch H.
;
Kyu-Pyung Hwang
;
Emery R.D.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
flip-chip devices;
inductance;
capacitance;
equivalent circuits;
lumped parameter networks;
S-parameters;
interconnections;
compliant die-package interconnects;
high frequencies;
inductance increase;
additional insertion loss;
inductive transition;
resistive transition;
capacitive transition;
optimal inductance;
die-package interface;
pad capacitance compensation effect;
full-wave simulations;
helical spring structures;
equivalent lumped-element representations;
simulated S parameters;
3-D quasistatic computation;
flip chip packaging;
first-order model;
11.
Design of multiband baluns on liquid crystalline polymer (LCP) based substrates
机译:
基于液晶聚合物(LCP)的基板上的多频带不平衡变压器的设计
作者:
Govind V.
;
Dalmia S.
;
Sundaram V.
;
White G.E.
;
Swaminathan M.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
baluns;
UHF circuits;
liquid crystal polymers;
electronics packaging;
plastic packaging;
multiband baluns;
liquid crystalline polymer;
LCP based substrates;
multiple frequency band baluns;
multiband RF front-ends;
distributed components;
lumped components;
LCP packaging technology;
930 MHz;
2000 MHz;
14.5 dB;
32.4 dB;
12.
Development of a new improved high performance flip chip BGA package
机译:
开发一种新的改进的高性能倒装芯片BGA封装
作者:
Chong D.Y.R.
;
Lim B.K.
;
Rebibis K.J.
;
Pan S.J.
;
Krishnamoorthi S.
;
Kapoor R.
;
Sun A.Y.S.
;
Tan H.B.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
flip-chip devices;
ball grid arrays;
integrated circuit reliability;
chip scale packaging;
encapsulation;
reflow soldering;
thermal stress cracking;
thermal management (packaging);
multichip modules;
flip chip BGA package;
high performance package;
one-piece cavity lid package;
high pin count;
targeted reliability;
molding compound encapsulation;
thermal loading;
solder joint reliability enhancement;
process development;
fatigue life;
multichip package;
board level reliability;
package level reliability;
integrated circuit packages;
13.
Effect of thermal aging on board level drop reliability for Pb-free BGA packages
机译:
热老化对无铅BGA封装的板级压降可靠性的影响
作者:
Tz-Cheng Chiu
;
Kejun Zeng
;
Stierman R.
;
Edwards D.
;
Ano K.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
chip scale packaging;
chemical interdiffusion;
solders;
reflow soldering;
thermal management (packaging);
integrated circuit reliability;
design of experiments;
Pb-free BGA packages;
board level drop reliability;
thermal aging;
intermetallic compound growth;
solder joint reliability;
drop loading conditions;
solder pad interface;
shear tests;
pull tests;
Kirkendall voids;
reliability degradation;
design of experiments;
chip scale package;
interdiffusion process;
14.
Electrical characteristics of fine pitch flip chip solder joints fabricated using low temperature solders
机译:
使用低温焊料制造的小间距倒装芯片焊点的电气特性
作者:
Un-Byoung Kang
;
Young-Ho Kim
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
flip-chip devices;
fine-pitch technology;
solders;
contact resistance;
indium alloys;
silver alloys;
bismuth alloys;
tin alloys;
crystal microstructure;
encapsulation;
circuit reliability;
lead bonding;
thermal stresses;
fine pitch flip chip solder joints;
low temperature solders;
contact resistance;
eutectic solder joint microstructure;
flip chip joining;
underfill;
reliability testing;
octagonal shaped UBM;
solder bumps;
lift-off process;
reflow process;
flip chip bonding;
daisy chain test structure;
four-point technique;
thermal cycling;
143 degC;
138 degC;
50 micron;
80 micron;
5 mohm;
8 mohm;
-55 to 125 degC;
InAg;
BiSn;
15.
Electrical property of anisotropically conductive adhesive joints modified by self-assembled monolayer (SAM)
机译:
自组装单分子膜(SAM)改性的各向异性导电胶接头的电性能
作者:
Yi Li
;
Kyoung-sik Moon
;
Wong C.P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
adhesives;
curing;
current density;
contact angle;
electronics packaging;
adhesion;
self-assembly;
monolayers;
filled polymers;
conducting polymers;
Fourier transform spectra;
infrared spectra;
electrical conductivity;
anisotropically conductive adhesive joints;
self-assembled monolayer;
electrical property;
substrate bond pad;
metal filler;
thermal stability;
contact angles;
hydrophobic tail groups;
hydrophilic tail groups;
grazing FTIR spectra;
unidirectional electrical conductivity;
curing behavior;
current density;
16.
Improving signal integrity of system packaging by back-drilling plated through holes in board assembly
机译:
通过在板子组合件中钻孔镀覆的通孔来改善系统封装的信号完整性
作者:
Camerlo S.
;
Ahmad B.
;
Yida Zou
;
Lekhanh Dang
;
Hu M.
;
Priore S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
printed circuit manufacture;
printed circuit layout;
circuit reliability;
finite element analysis;
failure analysis;
drilling;
life testing;
thermal management (packaging);
transceivers;
signal integrity;
system packaging;
plated through holes;
back-drilling;
board assembly;
multidisciplinary design;
SerDes technology;
PWB materials;
counter-bored holes;
backplanes;
accelerated thermal cycle tests;
finite element simulation;
17.
Lead-free solder interconnect by variable frequency microwave (VFM)
机译:
通过变频微波(VFM)实现无铅焊料互连
作者:
Kyoung-sik Moon
;
Yi Li
;
Jianwen Xu
;
Wong C.P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
microwave heating;
solders;
reflow soldering;
wetting;
differential scanning calorimetry;
chemical interdiffusion;
melting;
tin alloys;
silver alloys;
copper alloys;
electronics packaging;
lead-free solder interconnect;
variable frequency microwave;
solder pastes;
wetting on metal pads;
organic flux heating;
surface joints;
intermetallic compound formation;
solder matrix boundary;
DSC profile;
SnAg;
SnAgCu;
18.
Low-cost, wafer level underfilling and reliability testing of flip chip devices
机译:
倒装芯片设备的低成本,晶圆级底部填充和可靠性测试
作者:
Grieve A.
;
Capote M.A.
;
Lenos H.A.
;
Soriano A.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
encapsulation;
integrated circuit packaging;
flip-chip devices;
microassembling;
soldering;
integrated circuit interconnections;
chip-on-board packaging;
machining;
low-cost wafer level underfilling;
reliability testing;
flip chip devices;
volume packaging;
assembly yield;
assembly reliability;
process technology;
materials systems;
wafer encapsulation;
multiple material layers;
wafer level deposition;
integrated circuit;
solder-bumped wafer dicing;
encapsulated chips;
printed circuit boards;
flip-chip attach;
capital expenditure;
FCOB;
flip chip on board;
19.
Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn-Pb solder alloys
机译:
SnAgCu与Sn-Pb焊料合金反应中的材料行为和金属间化合物特征
作者:
Changqing Liu
;
Zhiheng Huang
;
Conway P.
;
Thomson R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
tin alloys;
silver alloys;
copper alloys;
lead alloys;
solders;
thermodynamics;
circuit reliability;
crystal microstructure;
mechanical strength;
intermetallics characteristics;
lead free solders;
thermodynamic modelling techniques;
multicomponent solders;
solder joint manufacture;
long term reliability;
rework;
repair;
intermetallic precipitates;
cooling rate;
solder composition;
microstructures;
optical microscopy;
scanning electron microscopy;
microstructural evolution;
mechanical integrity;
SnAgCu-SnPb;
20.
Modeling and hardware correlation of power distribution networks for multi-gigabit designs
机译:
多千兆位设计的配电网络建模和硬件关联
作者:
Schmitt R.
;
Xuejue Huang
;
Ling Yang
;
Xingchao Yuan
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electronics packaging;
power supply circuits;
equivalent circuits;
transient analysis;
lumped parameter networks;
time-domain analysis;
frequency-domain analysis;
power distribution networks;
multigigabit designs;
hardware correlation;
low cost design;
modeling methodology;
on-chip circuits;
system tradeoffs;
high-speed memory;
supply voltage fluctuations;
package design;
frequency domain;
time domain;
lumped elements;
parallel plate transmission lines;
equivalent circuits;
field simulator;
electromagnetic wave propagation effects;
transient waveform;
21.
Moisture and temperature effects on the reliability of interfacial adhesion of a polymer/metal interface
机译:
水分和温度对聚合物/金属界面粘合可靠性的影响
作者:
Ferguson T.P.
;
Jianmin Qu
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
adhesives;
adhesion;
fracture toughness;
ageing;
oxidation;
X-ray photoelectron spectra;
circuit reliability;
electronics packaging;
plastic packaging;
encapsulation;
environmental degradation;
bending strength;
environmental testing;
filled polymers;
polymer-metal interface;
interfacial adhesion reliability;
moisture effects;
temperature effects;
constitutive damage behavior;
epoxy based underfill adhesive;
copper alloy substrate;
moisture preconditioning;
underfill flexural bend test;
underfill elastic modulus;
critical load of fracture;
interfacial fracture toughness;
oxidation;
thermal aging;
epoxy based encapsulants;
package reliability;
no-flow assembly;
XPS;
85 C;
22.
Process and design analysis for ultra fine-pitched wiresweep elimination in advanced copper heat spreader BGA package
机译:
先进的铜制散热器BGA封装中超细间距线扫消除的工艺和设计分析
作者:
Chungpaiboonpatana S.
;
Shi F.G.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
encapsulation;
design of experiments;
copper;
heat sinks;
thermal management (packaging);
fine-pitch technology;
failure analysis;
transfer moulding;
ultrafine-pitched wiresweep elimination;
advanced copper heat spreader BGA package;
design analysis;
process analysis;
ultrafine pitch wirebond interconnect;
thermally enhanced copper heat spreader;
wire loop designs;
mold material types;
device short;
full factorial experiment;
failure analysis;
heat slug design;
assembly process;
23.
Study of assembly processes for liquid crystal on silicon (LCoS) microdisplays
机译:
硅上液晶(LCoS)微型显示器的组装工艺研究
作者:
Choubey A.
;
Andros F.
;
Sammakia B.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
microdisplays;
liquid crystal on silicon;
liquid crystal displays;
microassembling;
laminated object manufacturing;
bonding processes;
capillarity;
filling;
viscosity;
LCoS microdisplay assembly processes;
liquid crystal on silicon microdisplays;
cover glass/silicon lamination;
liquid crystal filling process;
cover glass attachment;
cell gap;
cover glass applied pressure;
capillary fluid flow;
vacuum filling process;
vacuum pressure;
filling material viscosity;
3 micron;
Si;
24.
The solder joint characterization in green WLCSP
机译:
绿色WLCSP中的焊点表征
作者:
Lee J.C.B.
;
Jun-Yuan Chen
;
Pel Chun Chen
;
Li S.W.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
chip scale packaging;
reflow soldering;
solders;
shear strength;
thermal stress cracking;
integrated circuit reliability;
surface mount technology;
ball grid arrays;
chemical interdiffusion;
thermal management (packaging);
tin alloys;
silver alloys;
copper alloys;
green wafer level CSP;
solder joint characterization;
solder paste;
mechanical package shear test;
fracture morphology;
ROHS regulation;
thermal fatigue life;
laminate BGA type package;
CTE mismatch;
interfacial metallurgical reactions;
SMT process;
package shear strength;
two layer repassivation;
-40 to 125 C;
SnAgCu;
25.
Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)
机译:
无铅印刷电路板(PCB)上晶圆级芯片规模封装(WLCSP)的无铅焊点的热疲劳寿命预测方程
作者:
Lau J.H.
;
Dongkai Shangguan
;
Lau D.C.Y.
;
Kung T.T.W.
;
Lee S.W.R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
chip scale packaging;
flip-chip devices;
integrated circuit reliability;
fatigue testing;
thermal stress cracking;
solders;
reflow soldering;
tin alloys;
silver alloys;
copper alloys;
thermal-fatigue life prediction equation;
wafer-level chip scale package;
lead-free solder joints;
lead-free printed circuit board;
isothermal fatigue;
failure modes;
failure locations;
solder paste printing;
reflow temperature profile;
flip-chip solder joints;
SnAgCu;
26.
Ultrathin soldered flip chip interconnections on flexible substrates
机译:
柔性基板上的超薄焊接倒装芯片互连
作者:
Pahl B.
;
Loeher T.
;
Kallmayer C.
;
Aschenbrenner R.
;
Reichl H.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
flip-chip devices;
fine-pitch technology;
reflow soldering;
integrated circuit interconnections;
integrated circuit reliability;
thermal management (packaging);
substrates;
ultrathin soldered flip chip interconnections;
flexible substrates;
flip chip assembly;
process development;
noflow underfiller materials;
solder reliability;
failure mechanisms;
ageing behaviour;
intermetallic phase formation;
thermal cycling;
multiple reflow tests;
flip-chip-on-flex technology;
low cost wafer bumping;
stencil printing;
fine pitch;
27.
A novel highly heat-resistant substrate material for halogen-free applications
机译:
用于无卤素应用的新型高耐热基材
作者:
Hirota K.
;
Shima K.
;
Iiyama T.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit packaging;
flammability;
flame retardants;
laminates;
substrates;
integrated circuit reliability;
life testing;
filled polymers;
thermal management (packaging);
highly heat-resistant substrate materia;
halogen-free laminate;
IC package substrate;
molecular-level design;
polymer networks;
limiting oxygen index resin constituents;
flame resistance;
metal hydrate flame retardant;
package reliability;
glass transition temperature;
chemical resistance;
accelerated test;
temperature test;
humidity stress test;
chemical stability;
28.
A thermodynamic model for electrical current induced damage
机译:
电流引起的损伤的热力学模型
作者:
Basaran C.
;
Minghui Lin
;
Hua Ye
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electromigration;
entropy;
irreversible thermodynamics;
current density;
VLSI;
integrated circuit interconnections;
mass transfer;
finite element analysis;
integrated circuit reliability;
continuum mechanics;
boundary-value problems;
thermal stress cracking;
solders;
soldering;
thermal management (packaging);
electrical current induced damage;
thermodynamic model;
electromigration induced damage;
irreversible mass diffusion;
high current density;
VLSI;
statistical mechanics;
mass transport;
damage evolution model;
microelectronics solder joints;
entropy production;
irreversible thermodynamics;
thermomechanical fatigue;
atomic vacancy flux process;
continuum mechanics;
arbitrary boundary value problem;
29.
Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy
机译:
Sn3.9Ag0.6Cu焊料合金的时效和蠕变行为
作者:
Qiang Xiao
;
Luu Nguyen
;
Armstrong W.D.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
tin alloys;
silver alloys;
copper alloys;
lead alloys;
eutectic alloys;
solders;
ageing;
creep;
crystal microstructure;
softening;
solder alloy aging behavior;
solder alloy creep behavior;
microstructure changes;
eutectic lead-free solder;
age-softening;
tin-rich crystal growth;
flow strength;
intermetallic precipitates;
creep resistance;
finely dispersed IMC precipitates;
dendrite orientational alignment;
grain boundary;
hyperbolic-sine models;
293 to 298 K;
180 degC;
SnAgCu;
PbSn;
Ag/sub 3/Sn;
Cu/sub 6/Sn/sub 5/;
30.
Co-design optimization of laminate substrates for high speed applications
机译:
用于高速应用的层压基板的协同设计优化
作者:
de Araujo D.N.
;
Cases M.
;
Pham N.
;
Matoglu E.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
laminates;
crosstalk;
integrated circuit packaging;
cost-benefit analysis;
substrates;
integrated circuit design;
application specific integrated circuits;
electric impedance;
circuit optimisation;
codesign optimization;
laminate substrates;
high speed applications;
electronic package;
electrical interface complexity;
laminate organic package;
cost effective;
design challenges;
ASIC;
simulation methodology;
power distribution requirements;
signal distribution;
signal trace impedance;
single-ended stripline;
near-end crosstalk;
31.
Design and simulation of novel optoelectronic interconnect using photonic crystal virtual waveguide with robust fabrication and misalignment tolerances
机译:
具有光子晶体虚拟波导的新型光电互连的设计和仿真,具有坚固的制造和未对准误差
作者:
Yamashita T.
;
Summers C.J.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical interconnections;
integrated optoelectronics;
photonic crystals;
optical waveguides;
finite difference time-domain analysis;
optical collimators;
mirrors;
PWE;
FDTD;
optoelectronic interconnect;
photonic crystal virtual waveguide;
fabrication tolerances;
misalignment tolerances;
self-collimated beams;
photonic band gap mirrors;
on-chip interconnect system;
plane wave expansion method;
finite difference time domain method;
coupling efficiency;
zero crosstalk signal crossings;
sharp turns;
optical signal routing;
32.
Effect of intermetallic phases on performance in a mechanical drop environment: 96.5Sn3.5Ag solder on Cu and Ni/Au pad finishes
机译:
金属间相对机械跌落环境下性能的影响:在Cu和Ni / Au焊盘表面处理的96.5Sn3.5Ag焊料
作者:
Saha S.K.
;
Mathew S.
;
Canumalla S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
chemical interdiffusion;
circuit reliability;
printed circuit testing;
reflow soldering;
impact testing;
solders;
ball grid arrays;
flip-chip devices;
tin alloys;
silver alloys;
copper;
nickel;
gold;
mechanical drop test reliability risk;
intermetallic phase growth;
surface finish incompatibility;
thin solder joint assemblies;
interposer-solder interface;
solder-ceramic interface;
interface reaction coupling;
portable electronics products;
PWB surface finishes;
SnAg;
Cu;
Ni-Au;
33.
Impediments to impedance and coupled noise: characteristic impedance design and coupled noise control on flexible circuits
机译:
阻抗和耦合噪声的障碍:柔性电路上的特征阻抗设计和耦合噪声控制
作者:
Doyle M.S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
printed circuit design;
electric impedance;
coupled circuits;
circuit noise;
interconnections;
adhesive bonding;
crosstalk;
dielectric materials;
network synthesis;
characteristic impedance design;
coupled noise control;
flexible circuits;
signal integrity analysis;
mechanical flexibility;
high-speed controlled impedance interconnect;
attenuation control;
mesh reference plane impedance prediction;
solid plane techniques;
reference plane orientation;
adhesive distribution;
cross-talk;
signal-to-mesh orientation;
dielectric separation;
dielectric loss reduction;
low loss dielectric materials;
34.
Integrated RF module produced by aerosol deposition method
机译:
通过气溶胶沉积法生产的集成射频模块
作者:
Imanaka Y.
;
Akedo J.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
substrates;
printed circuit manufacture;
laminates;
spray coating techniques;
powder technology;
microwave filters;
ceramic capacitors;
aerosol deposition method;
integrated RF module;
passive components;
RF wireless communication products;
dense ceramic film;
microstructure;
dielectric properties;
high Q ceramic film;
microwave filter;
high K ceramic;
FR4 substrates;
decoupling capacitors;
epoxy-based substrates;
wiring boards;
resin substrate;
laminating film;
10 GHz;
35.
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
机译:
冲击和跌落冲击中的细间距BGA和CSP可靠性预测模型
作者:
Lall P.
;
Panchagade D.
;
Yueli Liu
;
Johnson W.
;
Suhling J.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
chip scale packaging;
impact testing;
circuit reliability;
transient response;
plastic packaging;
finite element analysis;
fine-pitch technology;
reliability prediction models;
fine-pitch BGA;
drop-impact;
portable electronic products;
explicit finite element models;
transient dynamics;
printed circuit boards;
smeared property formulations;
reduced integration element formulations;
shell elements;
solid elements;
transient-dynamic response;
in-situ strain;
deformation kinematics;
plastic ball-grid arrays;
tape-array BGA;
QFN;
C213GA;
chip scale package;
drop reliability;
flex-substrate packages;
controlled drop;
failure modes;
computational efficiency;
36.
Optimizing the output impedance of a power delivery network for microprocessor systems
机译:
优化微处理器系统的电源传输网络的输出阻抗
作者:
Mandhana O.P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
microprocessor chips;
power supply circuits;
DC-DC power convertors;
transfer functions;
equivalent circuits;
frequency-domain analysis;
electric impedance;
lumped parameter networks;
multistage power distribution network;
microprocessor system;
design oriented frequency domain analysis;
output impedance;
power delivery network;
close-loop small-signal model;
DC-DC converter;
decoupling capacitors;
loop gain;
crossover frequency;
phase margin;
power integrity;
lumped equivalent model;
37.
Package to board interconnection shear strength (PBISS) behavior at high strain rates approaching mechanical drop
机译:
接近机械跌落的高应变速率下的板对板互连抗剪强度(PBISS)行为
作者:
Hanabe M.
;
Canumalla S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
shear strength;
shear deformation;
reflow soldering;
chip-on-board packaging;
impact testing;
package to board interconnection;
interconnection shear strength test;
high strain rates;
mechanical drop;
package deformation;
portable electronic products;
failure mechanisms;
buildup layer;
trace fracture;
ball grid array packages;
shear deformation rate;
solder joint quality;
land grid array;
38.
Vibration-induced solder joint failure of a Ceramic Column Grid Array (CCGA) package
机译:
振动引起的陶瓷柱栅阵列(CCGA)封装的焊点失效
作者:
Perkins A.
;
Sitaraman S.K.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ceramic packaging;
finite element analysis;
reflow soldering;
vibrations;
fatigue;
thermal management (packaging);
ball grid arrays;
vibration-induced solder joint failure;
ceramic column grid array package;
electronic packages;
fatigue life;
solder joint stiffness;
package mass;
mode shapes;
natural frequency;
out-of-plane sinusoidal vibration;
numerical modeling;
coefficient of thermal expansion mismatch;
finite-element models;
hybrid 3D model;
power balance law;
39.
High-performance, four-layer, wire-bonded, plastic ball grid array package for a 10 Gbps per lane backplane SerDes transceiver
机译:
高性能,四层,引线键合,塑料球栅阵列封装,用于每通道10 Gbps背板SerDes收发器
作者:
Draper D.
;
Kollipara R.
;
Ming Li
;
Mullen D.
;
McMorrow S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
plastic packaging;
thermal resistance;
transceivers;
lead bonding;
thermal management (packaging);
S-parameters;
crosstalk;
backplane SerDes transceiver;
plastic ball grid array package;
four-layer wire-bonded package;
high-performance package;
SerDes-to-SerDes Mux;
package layout rules;
3-D simulations;
insertion loss;
thermal resistance;
thermal vias;
heat spreader;
solder balls;
signal integrity;
S-parameter models;
differential crosstalk;
low-cost technology;
10 Gbit/s;
40.
Leading indicators-of-failure for prognosis of electronic and MEMS packaging
机译:
电子和MEMS封装预测的主要故障指标
作者:
Lall P.
;
Islam N.
;
Rahim K.
;
Suhling J.
;
Gale S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
semiconductor device packaging;
integrated circuit packaging;
thermal management (packaging);
integrated circuit reliability;
semiconductor device reliability;
micromechanical devices;
solders;
encapsulation;
Weibull distribution;
thermal stress cracking;
ball grid arrays;
leading indicators-of-failure;
MEMS packaging;
electronic packaging;
prognosis-of-electronics methodology;
accurate assessment;
product damage;
microstructural evolution;
average phase size;
interfacial stresses;
metal backed printed circuit board;
aged material;
material damage;
time-to-1-percent failure;
residual life;
life-prediction relationships;
solder microstructure;
intermetallic development;
thermal efficiency;
encapsulant;
thermal cycling;
BGA components;
Weibull data plot;
interfacial shear stress;
41.
Use-condition-based cyclic bend test development for handheld components
机译:
基于使用条件的手持式零件的循环弯曲测试开发
作者:
Mercado L.L.
;
Phillips B.
;
Sahasrabudhe S.
;
Sedillo J.P.
;
Bray D.
;
Monroe E.
;
Kang Joon Lee
;
Lo G.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
finite element analysis;
bending;
life testing;
circuit reliability;
printed circuit testing;
cellular radio;
notebook computers;
fatigue testing;
chip scale packaging;
ball grid arrays;
handheld electronics;
use-condition-based cyclic bend test;
cell phones;
personal digital assistants;
PCB flexure;
four-point bend test;
test board design;
test setup;
test input level;
S-N curve;
transfer function;
reliability stressing;
field condition;
strain-energy-density-based power law;
finite element simulation;
JEDEC standard;
classical beam theory;
42.
An analytical model for thermal stress analysis of multi-layered microelectronics packaging
机译:
多层微电子封装热应力分析的分析模型
作者:
Yujun Wen
;
Basaran C.
会议名称:
《》
|
2004年
关键词:
thermal management (packaging);
stress analysis;
thermal stresses;
laminates;
mathematical analysis;
multilayered microelectronics packaging;
thermal stress analysis;
analytical model;
interfacial stresses;
laminated structures;
thick substrate;
thin stacks;
isothermal loading;
beam-type plate;
orthotropic material properties;
moire interferometry;
finite element analysis;
interfacial compliances;
constitutive equations;
peeling stresses;
43.
Lead free packaging and Sn-whiskers
机译:
无铅包装和锡晶须
作者:
Osenbach J.W.
;
Shook R.L.
;
Vaccaro B.T.
;
Potteiger B.D.
;
Amin A.
;
Ruengsinsub P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
tin;
nickel;
copper;
electronics packaging;
whiskers (crystal);
nucleation;
stress effects;
annealing;
reflow soldering;
electroplating;
lead free packaging;
tin whiskers;
whisker formation;
single crystal metallic filaments;
mechanically strong metallic filaments;
nucleation;
whisker growth;
stress tests;
JEDEC whisker specification;
post plate heat treatment;
reflow preconditioning;
post-plate anneal;
underplate;
matte finished plating;
Sn-Cu;
Sn-Ni-Cu;
44.
Optical data links for automotive applications
机译:
汽车应用的光学数据链路
作者:
Kibler T.
;
Zeeb E.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
automotive components;
automotive electronics;
optical fibre communication;
optical fibre networks;
optical fibres;
polymer fibres;
silicon compounds;
surface emitting lasers;
automotive optical data links;
optical data bus systems;
polymethyl methacrylate;
PMMA optical fibers;
red LED;
polymer fibers;
large core silica fibers;
polymer cladded silica fibers;
PCS fibers;
vertical-cavity surface-emitting laser diodes;
VCSEL;
cars;
trucks;
drive-by-wire systems;
video based driver assistant systems;
commercial vehicles;
100 Mbit/s;
1 Gbit/s;
85 C;
SiO/sub 2/;
45.
A high throughput optoelectronic module assembly process
机译:
高通量光电模块组装工艺
作者:
Schwab P.
;
Bowen T.
;
Perko R.
;
Delen N.
;
Goodrich J.
;
Anderson R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
microassembling;
integrated optoelectronics;
modules;
etching;
electronics packaging;
high throughput assembly process;
optoelectronic module assembly;
die bonding machine throughput;
assembly alignment;
alignment accuracy;
pick and place assembly;
assembly speed;
passive alignment;
silicon optical bench;
SiOB substrate;
semiconductor placement;
semiconductor tacking;
batch reflow process;
fiber core alignment;
crystal lattice etching techniques;
X/Y component orientation;
laser self-aligned ferrule;
active device module;
ADM;
Si;
46.
A leadless packaging concept for high frequency applications
机译:
高频应用的无铅封装概念
作者:
Theuss H.
;
Dangelmaier J.
;
Engl M.
;
Pressel K.
;
Knapp H.
;
Simburger W.
;
Gnannt K.
;
Eurskens W.
;
Hirtreiter J.
;
Weigel R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
cellular radio;
integrated circuit packaging;
lead bonding;
flip-chip devices;
MMIC;
microwave filters;
integrated circuit interconnections;
integrated circuit testing;
harmonics suppression;
frequency dividers;
microwave bipolar transistors;
semiconductor device packaging;
semiconductor device testing;
high frequency applications;
low cost leadless packaging concept;
ultra-miniaturized footprint;
contact pad dimensions;
standard package height;
semiconductor chip implementation;
flip chip;
wire bond;
package applications;
filter component;
GSM application;
third harmonic suppression;
high frequency bipolar transistors;
frequency dividers;
flip chip interconnects;
package frequency limits;
0.4 mm;
30 GHz;
47.
A new optical waveguide pressure sensor using evanescent field
机译:
利用e逝场的新型光波导压力传感器
作者:
Kodl G.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
pressure sensors;
fibre optic sensors;
tactile sensors;
optical fibre cladding;
light absorption;
light emitting diodes;
p-i-n photodiodes;
attenuated total reflection;
optical waveguide pressure sensor;
evanescent field based sensor;
fiber optic sensors;
touch sensor;
flexible optical waveguide core;
plastic optical fiber;
optical cladding light-absorptive layer;
optical attenuation;
transmitter signal source;
LED;
receiver photosensitive element;
PIN diode;
core/cladding total boundary reflection;
light absorption;
48.
Design consideration for system-in-a-package with embedded passive circuits
机译:
具有嵌入式无源电路的系统级封装的设计注意事项
作者:
Gye-An Lee
;
Megahed M.
;
De Flaviis F.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
cellular radio;
passive filters;
multiplexing equipment;
low-pass filters;
electronics packaging;
laminates;
transfer functions;
system-in-a-package;
embedded passive circuits;
design consideration;
embedded super-diplexer;
quadband GSM RF system;
cascaded diplexer;
low cost compact filter;
lowpass filter;
low cost laminate;
cascaded performance;
transfer function characteristics;
49.
Development of a novel and cost-effective bi-directional optical triplexer based on polymer PLC platform
机译:
基于聚合物PLC平台的新型低成本双向光学三工器的开发
作者:
Junehyeon Ahn
;
Youngmin Lee
;
Kwak K.
;
Dongsung Shin
;
Sungmin Kim
;
Kim T.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical fibre communication;
optical receivers;
optical transmitters;
optical planar waveguides;
optical polymers;
surface emitting lasers;
modules;
multiplexing equipment;
optical sub-assembly structures;
bi-directional optical triplexer;
polymer PLC;
polymer planar lightwave circuit;
fiber to the home applications;
vertical cavity surface emitting laser;
VCSEL light source;
OSA structures;
BiDi triplexers;
small form factor pluggable structure;
SFP;
coupling efficiency;
passive alignment processes;
optical transceivers;
active optical network FTTH system;
200 Mbit/s;
50.
Heat spreader impact on electrical performances of a 4-layer PBGA package
机译:
散热器对4层PBGA封装的电性能的影响
作者:
Pan S.J.
;
Chong D.Y.R.
;
Sun A.Y.S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
plastic packaging;
thermal management (packaging);
integrated circuit packaging;
inductance;
earthing;
electromagnetic interference;
S-parameters;
equivalent circuits;
heat sinks;
4-layer PBGA package;
electrical performances;
heat spreader impact;
electrical simulations;
high frequencies;
self inductances;
mutual inductances;
signal transmission efficiency;
low losses;
grounding;
electromagnetic interference;
self-resonant frequency;
IC packaging;
equivalent circuit;
effective inductance;
S-parameters;
solder ball arrays;
51.
Qualification of an enhanced ball grid array package using build-up layers on a metal heat spreader
机译:
使用金属散热器上的堆积层对增强型球栅阵列封装进行鉴定
作者:
Liyu Yang
;
King C.
;
Doe R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
lead bonding;
encapsulation;
life testing;
certification;
reflow soldering;
heat sinks;
thermal management (packaging);
enhanced ball grid array package;
buildup layers;
metal heat spreader;
package platform;
microvias;
reliability performance;
package certification;
accelerated stress test;
wire bonding;
business risks assessment;
solder mask opening;
solder ball size;
52.
Process technology of electronics - a graduate textbook
机译:
电子工艺技术-研究生教材
作者:
Zerna T.
;
Oppermann M.
;
Sauer W.
;
Wolter K.-J.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electronics packaging;
electronic engineering education;
educational courses;
further education;
industrial engineering;
electronics industry;
process technology of electronics;
graduate textbook;
electronics packaging;
electrical engineering curriculum;
electronic products manufacturing;
process knowledge;
technological knowledge;
53.
System-on-a-package (SOP) module development for a digital, RF and optical mixed signal integrated system
机译:
用于数字,RF和光混合信号集成系统的系统级封装(SOP)模块开发
作者:
Lim K.
;
Wan L.
;
Guidotti D.
;
Sundaram V.
;
White G.
;
Liu F.
;
Bhattacharya S.
;
Doraiswami R.
;
Chang Y.-J.
;
Yu J.
;
Sarkar S.
;
Pratap R.
;
Yoon S.-W.
;
Maeng M.
;
Pinel S.
;
Laskar J.
;
Tentzeris M.
;
Chang G.K.
;
Swaminathan M.
;
Tummala R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electronics packaging;
intelligent networks;
data communication equipment;
digital communication;
substrates;
optical planar waveguides;
modules;
system-on-a-package module development;
mixed signal integrated system;
advanced system-on-a-package concept;
Intelligent Network Communicator;
single packaging platform;
high-speed digital signal;
wireless signal;
embedded optical waveguide channel;
full functionality;
low-cost organic substrate;
multigigabit pseudo random digital bit sequence;
enhanced bandwidth;
multimode waveguides;
3.2 Gbit/s;
10 Gbit/s;
54.
1K channel optical interconnects of CMOS-PQR flip chip
机译:
CMOS-PQR倒装芯片的1K通道光学互连
作者:
ODae Kwon
;
Kwonsub Lim
;
Jungyoun Kim
;
Sangkyeom Kim
;
Moojin Kim
;
Sung-Jae An
;
Seungeun Lee
;
Dongkwon Kim
;
Junho Yoon
;
Sukchan Kang
;
Byunghun Park
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
quantum well lasers;
semiconductor laser arrays;
optical interconnections;
driver circuits;
CMOS integrated circuits;
integrated optoelectronics;
smart pixels;
flip-chip devices;
indium compounds;
gallium arsenide;
III-V semiconductors;
3D whispering gallery mode laser;
photonic quantum ring laser;
CMOS-PQR flip chip;
channel optical interconnects;
anomalous quantum wire properties;
threshold currents;
thermal redshifts;
uniform emissions;
smart pixel chip;
laser array;
laser driver chip;
optical interconnection;
CMOS repeater circuit;
independently addressable circuit;
hybrid integration process;
very high density arrays;
low power consumptions;
InGaAs;
55.
780nm VCSELs for home networks and printers
机译:
适用于家庭网络和打印机的780nm VCSEL
作者:
Nakayama H.
;
Nakamura T.
;
Funada M.
;
Ohashi Y.
;
Kato M.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
surface emitting lasers;
optical fibre networks;
laser printers;
semiconductor laser arrays;
light sources;
optical communication equipment;
multimode VCSEL MTTF;
GI plastic optical fiber;
simultaneously driven spots;
narrow beam divergence angle;
home networks;
Lumistar;
optical DVI;
digital visual interface;
GBIC modules;
independently addressable VCSEL array;
Gigabit interface connector;
laser beam printers;
printing resolution;
color print speed;
optical source;
780 nm;
200000 hr;
60 degC;
3 mW;
5 Gbit/s;
1.2 mW;
56.
Calibration of near field measurements using microstrip line for noise predictions
机译:
使用微带线进行近场测量的校准以进行噪声预测
作者:
Srinivasan K.
;
Sasaki H.
;
Swaminathan M.
;
Tummala R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electromagnetic coupling;
coupled circuits;
calibration;
microstrip lines;
circuit noise;
circuit simulation;
electromagnetic interference;
near-field electromagnetic coupling;
return current effects;
near field measurement calibration;
microstrip line;
circuit noise predictions;
HFSS simulation;
ground plane return current;
return current magnetic field;
electromagnetic interference;
electromagnetic coupling;
EMI reduction;
250 MHz to 3 GHz;
57.
Chip-on-chip 3D optical interconnect with passive alignment
机译:
具有无源对准的芯片上芯片3D光学互连
作者:
Lo J.C.C.
;
Lee S.W.R.
;
Wu J.S.
;
Kim J.K.
;
Yuen M.M.F.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical interconnections;
integrated optoelectronics;
flip-chip devices;
reflow soldering;
micromirrors;
surface emitting lasers;
photodetectors;
electronics packaging;
chip-on-chip 3D optical interconnect;
optical fiber passive alignment;
SiOB V-grooves;
flip chip solder joint reflow;
flip chip mirror carrier;
micro-mirrors;
overpass optical path;
VCSEL;
photo detectors;
58.
Circuit partitioning and RF isolation by through-substrate trenches
机译:
通过衬底穿透沟槽进行电路划分和RF隔离
作者:
Sinaga S.M.
;
Polyakov A.
;
Bartek M.
;
Burghartz J.N.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
silicon;
elemental semiconductors;
isolation technology;
circuit simulation;
crosstalk;
radiofrequency integrated circuits;
integrated circuit testing;
machining;
capacitance;
electrical contacts;
circuit partitioning;
RF isolation;
through-substrate trenches;
RF crosstalk suppression;
substrate thinning;
substrate trenching;
Medici simulation;
high resistivity thinned substrate trenches;
dedicated G-S-G test structures;
thinned Si substrates;
single-ended capacitive substrate contacts;
partial trenches;
isolated silicon islands;
20 to 100 micron;
5 to 100 micron;
1 GHz;
Si;
59.
Comparison of via-fabrication techniques for through-wafer electrical interconnect applications
机译:
晶圆间电互连应用的通孔制造技术比较
作者:
Polyakov A.
;
Grob T.
;
Hovenkamp R.A.
;
Kettelarij H.J.
;
Eidner I.
;
de Samber M.A.
;
Bartek M.
;
Burghartz J.N.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit interconnections;
integrated circuit packaging;
mechanical strength;
powder technology;
laser beam cutting;
laser ablation;
sputter etching;
bipolar transistors;
through-wafer vertical interconnects;
IC packaging;
via-fabrication techniques;
through-wafer vias;
via diameter;
via shape;
via geometry;
mechanical strength;
powder blasting;
laser melt cutting;
laser ablation;
deep reactive ion etching;
ring-on-ring method;
four-point bending method;
stress-relief post-processing;
bipolar transistors;
via edge electrically affected zone;
10 to 20 micron;
240 micron;
Si;
60.
Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder
机译:
无铅95.5Sn-3.8Ag-0.7Cu焊料的蠕变和疲劳特性
作者:
Pang J.H.L.
;
Xiong B.S.
;
Low T.H.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
solders;
tin alloys;
silver alloys;
copper alloys;
creep;
fatigue;
thermal stresses;
solder creep;
solder fatigue;
lead free solder;
bulk solder;
solder joints;
stress testing;
steady-state creep law constitutive equation;
low cycle fatigue behavior;
test temperatures;
test frequencies;
frequency modified strain-based fatigue models;
energy-based fatigue models;
solder fatigue life prediction analysis;
-40 degC;
25 degC;
75 degC;
125 degC;
1 Hz;
0.01 Hz;
0.001 Hz;
SnAgCu;
61.
Design of CMOS voltage controlled oscillators using package inductor
机译:
使用封装电感器的CMOS压控振荡器的设计
作者:
Tae-Je Cho
;
Se-Yong Oh
;
Yoon S.-W.
;
Laskar J.
;
Tummala R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
voltage-controlled oscillators;
inductors;
CMOS analogue integrated circuits;
ball grid arrays;
Q-factor;
integrated circuit packaging;
fine-pitch technology;
UHF oscillators;
package inductor;
CMOS voltage controlled oscillator;
embedded inductors integration;
multilayer package;
high quality inductor;
fine pitch ball grid array;
wafer level packaging;
Q-factor;
total figure-of-merit;
2 GHz;
62.
Effect of organic package core via pitch reduction on power distribution performance
机译:
降低间距的有机封装芯对配电性能的影响
作者:
Audet J.
;
OConnor D.P.
;
Grinberg M.
;
Libous J.P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
flip-chip devices;
chip scale packaging;
CMOS integrated circuits;
application specific integrated circuits;
cost reduction;
organic package core via pitch reduction;
power distribution performance;
CMOS technology;
area array flip-chip pad pitch;
package design tradeoffs;
ASIC die;
wirability;
package cost;
electrical modeling;
cost effective electronic packaging;
organic chip carrier;
sequential buildup chip carrier;
chip-package codesign;
63.
Electroplated Sn-Au structures for fabricating fluxless flip-chip Sn-rich solder joints
机译:
电镀锡-金结构,用于制造无助焊剂倒装芯片的富锡焊点
作者:
Jongsung Kim
;
Dongwook Kim
;
Wang G.L.
;
Jeong Park
;
Lee C.C.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electroplating;
flip-chip devices;
multilayers;
soldering;
solders;
chemical interdiffusion;
acoustic microscopy;
X-ray chemical analysis;
X-ray diffraction;
scanning electron microscopy;
tin alloys;
gold alloys;
electronics packaging;
electroplated structures;
fluxless flip-chip solder joints;
fluxless bonding process;
noneutectic multilayer design;
phase formation;
X-ray diffraction;
microstructure;
EDX;
SEM;
intermetallic compound grains;
scanning acoustic microscopy;
remelting temperature;
through thickness photoresist pattern;
SnAu;
64.
Fabrication and parametric study of wafer-level multiple-copper-column interconnect
机译:
晶圆级多铜柱互连的制作及参数研究
作者:
Liao E.B.
;
Ang S.S.
;
Tay A.A.O.
;
Feng H.H.
;
Nagarajan R.
;
Kripesh V.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
chip scale packaging;
integrated circuit interconnections;
copper;
integrated circuit reliability;
photolithography;
electroplating;
multiple-copper-column interconnect;
wafer-level interconnect;
parametric study;
electronic packaging;
chip-to-next-level interconnects;
compliant interconnect scheme;
thermomechanical reliability;
simplified model;
geometric effects;
chip-scale-packaging;
photolithography;
electrolytic plating;
Cu;
65.
Heterogeneous integration of InP/InGaAsP MQW thin film edge emitting lasers and polymer waveguides
机译:
InP / InGaAsP MQW薄膜边缘发射激光器和聚合物波导的异质集成
作者:
Hung-Fei Kuo
;
Sang-Yeon Cho
;
Jokerst N.M.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
semiconductor quantum wells;
quantum well lasers;
integrated optoelectronics;
optical polymers;
optical waveguides;
optical interconnections;
indium compounds;
gallium arsenide;
III-V semiconductors;
heterogeneous integration;
InP/InGaAsP MQW thin film edge emitting lasers;
thin film EEL;
coupled optical output;
integrated polymer waveguide;
embedded laser/waveguide structure;
planar lightwave circuits;
embedded optical interconnections;
embedded thin film laser;
external optical source;
bump bonded optical source;
beam turning element;
optical wave launch;
InP-InGaAsP;
66.
High coupling tapered hyperbolic fiber microlens
机译:
高耦合锥形双曲光纤微透镜
作者:
Yang H.M.
;
Huang S.Y.
;
Lee C.W.
;
Wang S.H.
;
Cheng W.H.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
microlenses;
etching;
optical fibre fabrication;
Fresnel diffraction;
optical fibre couplers;
mode matching;
tapered hyperbolic-end fiber microlens;
high coupling microlens;
single-mode fiber;
symmetric tapering;
etching process;
hyperbolic lensing;
fusing process;
tapering asymmetry;
far-field profiles;
Gaussian profile;
improved mode matching;
coupling efficiency;
optimal performance;
step-index fibers;
reproducible microlenses;
laser-to-fiber coupling;
Fresnel diffraction;
82 percent;
67.
High frequency thermosonic flip chip bonding for gold to gold interconnection
机译:
高频热超声倒装芯片键合,实现金与金的互连
作者:
Pang C.C.-H.
;
Kin-Yik Hung
;
Man-Lung Sham
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit bonding;
flip-chip devices;
integrated circuit packaging;
gold;
ultrasonic bonding;
shear strength;
integrated circuit interconnections;
high frequency thermosonic bonding;
gold interconnections;
ultrasonic frequency process window;
bond power/force interaction effects;
die shear strength;
package standoff height;
FR-4 substrates;
ceramic substrates;
vibrating amplitude;
bond robustness;
63 kHz;
109 kHz;
Au;
68.
High manufacturability and thermal stability mini-flat transmitter for 10Gb/s Ethernet applications
机译:
适用于10Gb / s以太网应用的高可制造性和热稳定性微型平板发射机
作者:
Shin-Ge Lee
;
Chih-Li Chen
;
Chu-Li Chao
;
Chun-Hsing Lee
;
Li-Chun Liao
;
Chih-Hao Hsu
;
Fu-Yi Cheng
;
Cheng-Hung Tsai
;
Min-Fa Huang
;
Chiung-Hung Wang
;
Mu-Tao Chu
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical transmitters;
local area networks;
metropolitan area networks;
thermal stability;
flip-chip devices;
bonding processes;
gold alloys;
tin alloys;
circuit reliability;
LAN;
MAN;
manufacturability;
thermal stability;
Ethernet mini-transmitter;
two lens semi-passive alignment structure;
SC receptacle;
pigtail type optical transmitter;
coupling efficiency;
flip chip bonder process;
silicon optical bench;
high resistivity SiOB;
pressure-free bonding technique;
electroplated solder;
eye diagram;
extinction ratio;
transmitter reliability;
10 Gbit/s;
1310 nm;
35 percent;
0 to 80 degC;
Si;
AuSn;
69.
Integrated Module Board (IMB); an advanced manufacturing technology for embedding active components inside organic substrate
机译:
集成模块板(IMB);用于将活性成分嵌入有机基板内部的先进制造技术
作者:
Palm P.
;
Tuominen R.
;
Kivikero A.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
printed circuit manufacture;
circuit reliability;
modules;
chip-on-board packaging;
integrated module board;
advanced manufacturing technology;
active components embedding;
organic substrate;
electronics packaging;
printed wiring board;
single manufacturing process flow;
high interconnection density;
high reliability;
packaging efficiency;
70.
Integrated Substrate Technology
机译:
集成基板技术
作者:
Chanchani R.
;
Bethke D.T.
;
Webb D.B.
;
Sandoval C.
;
Wouters G.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
multichip modules;
substrates;
capacitors;
inductors;
thin film resistors;
microstrip circuits;
interconnections;
copper;
integrated substrate technology;
advanced microsystems;
BCB/Cu multilayer stack;
silicon wafers;
alumina wafers;
LTCC wafers;
embedded thin film passive components;
design rules;
minimum featured size;
embedded inductors;
embedded thin-film resistors;
embedded capacitors;
microstrip lines;
RF module;
return losses;
transmission losses;
integrated system-on-a-chip;
substrate size;
interconnection density;
polymer thin-film dielectric;
metal conductors;
Cu;
71.
Laser diode package-level performance optimization based on far field distribution
机译:
基于远场分布的激光二极管封装级性能优化
作者:
Soskind Y.
;
Perkins J.
;
Wall T.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
semiconductor lasers;
semiconductor device packaging;
transceivers;
optical communication equipment;
Gaussian distribution;
modules;
modal field distribution;
semiconductor laser diode;
critical input parameter;
transceiver modules;
package-level performance optimization;
far field distribution;
optical design;
equivalent far field Gaussian definition;
laser beam ellipticity;
angular scans;
optimum magnification;
72.
LCP injection molded packages - keys to JEDEC 1 performance
机译:
LCP注塑成型封装-JEDEC 1性能的关键
作者:
Ross R.J.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit packaging;
semiconductor device packaging;
liquid crystal polymers;
injection moulding;
plastic packaging;
thermal management (packaging);
power MOSFET;
microassembling;
charge-coupled devices;
CMOS integrated circuits;
adhesion;
LCP injection molded packages;
JEDEC 1 performance;
liquid crystal polymer;
high temperature thermoplastic polymer;
injection molding compounds;
electronic cavity packages;
thermally enhanced LDMOS;
three tier assembly system;
partially matched RF packages;
leaded packages;
CCD;
CMOS;
adhesion;
assembled packages;
73.
Nanocrystalline copper and nickel as ultra high-density chip-to-package interconnections
机译:
纳米晶铜和镍作为超高密度芯片到封装互连
作者:
Bansal S.
;
Saxena A.
;
Tummala R.R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
copper;
nickel;
integrated circuit packaging;
integrated circuit interconnections;
grain size;
microhardness;
grain growth;
fracture toughness;
plastic deformation;
fatigue;
Young's modulus;
nanostructured materials;
nanoelectronics;
fine-pitch technology;
ultrahigh-density chip-to-package interconnections;
nanocrystalline interconnect materials;
nanoscale interconnections;
fine pitch;
grain size;
equichannel angular extrusion;
microhardness;
nanohardness;
activation energy;
grain growth;
tensile strength;
plastic deformation;
elastic modulus;
fracture toughness;
fatigue behavior;
off-chip interconnections;
Cu;
Ni;
74.
Optical interconnects on printed circuit board level - results based on the German funded project OptiCon
机译:
印刷电路板级的光学互连-基于德国资助项目OptiCon的结果
作者:
Franke M.
;
Schiefelbein F.-P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical backplanes;
optical planar waveguides;
printed circuit manufacture;
assembling;
optical interconnects;
printed circuit board level;
electro-optical assembly technology;
optical waveguides integration;
hybrid assembly technology;
scalability;
on-board-bandwidth;
electro-optical printed circuit boards;
multimode waveguides;
backplane interconnection;
75.
Packaging of thermally tunable fiber Bragg grating sensor
机译:
热可调光纤布拉格光栅传感器的包装
作者:
Ling Xie
;
Pinjala D.
;
Sudharsanam K.
;
Pamidighantam R.
;
Navas K.O.K.
;
Jingbo Zhang
;
Wanxun He
;
Baoxi Xu
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
Bragg gratings;
optical fibre filters;
optical tuning;
thermistors;
temperature measurement;
temperature control;
packaging;
tunable optical filters;
thermistor;
thermally actuated optical FBG filter;
temperature control;
thermal isolation;
heat dissipation;
FBG sensor packaging;
thermally tunable fiber Bragg grating;
access applications;
thermal sensing;
thermal control;
tunability;
76.
Physics-based reliability assessment of embedded passives
机译:
基于物理的嵌入式无源可靠性评估
作者:
Damani M.
;
Pucha R.V.
;
Bhattacharya S.
;
Tummala R.
;
Sitaraman S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
printed circuits;
circuit reliability;
network analysis;
thermal stress cracking;
delamination;
capacitors;
inductors;
resistors;
deformation;
finite element analysis;
failure analysis;
RLC circuits;
cracking;
delamination;
embedded capacitors;
embedded resistors;
embedded inductors;
thermal cycling;
deformation;
finite element model;
thermally induced stresses;
PCB physics-based reliability assessment;
embedded passives;
thermo-mechanical-electrical modeling;
reliability testing;
thermal excursions;
failure mechanisms;
RLC parameters;
77.
Polymeric waveguides on rigid and flexible PCB
机译:
刚性和柔性PCB上的聚合物波导
作者:
Wei-Chung Lo
;
Li-Cheng Shen
;
Hsiang-Hung Chang
;
Huan-Chun Fu
;
Yu-Chih Chen
;
Shu-Ming Chang
;
Yuan-Chang Lee
;
Wun-Yan Chen
;
Ming-Chieh Chou
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
printed circuits;
optical interconnections;
optical planar waveguides;
optical polymers;
circuit reliability;
optical interconnection layer quality;
FR4 rigid circuit board;
rigid PCB;
flexible PCB;
polymeric waveguides;
board level interconnects;
optical waveguides;
reliability;
78.
Process issues and characterization of LTCC substrates
机译:
LTCC基板的工艺问题和特性
作者:
Sunappan V.
;
Periannan A.
;
Chua Kai Meng
;
Wong Chee Khuen
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ceramic packaging;
interconnections;
punching;
drying;
seals (stoppers);
laminated object manufacturing;
firing (materials);
sintering;
furnaces;
modules;
printing;
substrates;
LTCC substrate interconnection;
via formation;
via fill printing precision;
high density multilayer LTCC assembly;
mechanical punching;
high accuracy stencil printing;
screen print quality;
collating process;
via hole alignment;
LTTC tape collation;
stacking holes;
drying operation;
vacuum sealing;
lamination;
firing profiles;
debinding;
sintering;
belt-type furnace;
box furnace;
setters;
ceramic interconnect modules;
4 mil;
79.
Reliability of large organic flip-chip packages for industrial temperature environments
机译:
大型有机倒装芯片封装在工业温度环境下的可靠性
作者:
Bansal A.
;
Yuan Li
;
Fritz D.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit packaging;
integrated circuit reliability;
flip-chip devices;
thermal stress cracking;
fine-pitch technology;
ball grid arrays;
heat sinks;
thermal management (packaging);
integrated circuit modelling;
integrated circuit testing;
surface mount technology;
field programmable gate arrays;
large organic flip-chip packages;
industrial temperature environments;
thermal fatigue reliability;
fine pitch BGA packages;
multilayer organic built-up substrates;
integral heat spreader;
high density FPGA devices;
FEM;
high stress regions;
heat spreader/stiffener attach adhesive;
thermal interface materials;
temperature cycle tests;
substrate land pad geometry;
moisture preconditioning;
solder mask defined pads;
nonsolder mask defined pads;
failure modes;
SMD;
NSMD;
-55 to 125 degC;
80.
Undergraduate students' research activities
机译:
本科生的研究活动
作者:
Svasta P.
;
Golumbeanu V.
;
Ionescu C.
;
Ene D.V.
;
Chirileasa D.S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electronics packaging;
educational courses;
electronic engineering education;
further education;
undergraduate student research activities;
microsystems packaging;
electronic packaging;
human resource challenge;
teamwork;
project development;
human resource shaping process;
undergraduate educational program;
IEEE-CPMT student members;
81.
A micromechanics model for electrical conduction in isotropically conductive adhesives during curing
机译:
各向异性导电胶在固化过程中的微力学模型
作者:
Bin Su
;
Jianmin Qu
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
adhesives;
curing;
contact resistance;
shrinkage;
finite element analysis;
percolation;
micromechanics;
filled polymers;
conducting polymers;
tunnelling;
electrical resistivity;
isotropically conductive adhesives;
curing;
electrical conduction;
micromechanics model;
3-D model;
spherical particles;
conductive adhesive block;
contact resistances;
constriction resistance;
tunnel resistance;
finite element analysis;
shrinkage;
contact radius;
bulk resistivity change;
82.
A novel fiber alignment shift measurement technique employing an ultra high precision laser displacement meter in laser-welded laser module packaging
机译:
在激光焊接的激光模块包装中采用超高精度激光位移计的新型光纤对准位移测量技术
作者:
Yi-Cheng Hsu
;
Yue-Lin He
;
Maw-Tyan Sheen
;
Ying-Chien Tsai
;
Jao-Hwa Kuang
;
Wood-Hi Cheng
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
laser beam welding;
measurement by laser beam;
displacement measurement;
optical fibre couplers;
semiconductor lasers;
semiconductor device packaging;
modules;
optical fabrication;
fiber alignment shift measurement;
ultrahigh precision laser displacement meter;
laser-welded laser module packaging;
post-weld-shift induced alignment shifts;
lateral shift;
position angle;
swing angle;
tilt angle;
low-cost lightwave transmission systems;
coaxial-type laser modules;
receptacle-type module;
single-mode fiber ferrule;
laser diode;
coupling efficiency;
fiber pigtailing;
83.
Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications
机译:
用于多频带无线应用的系统级封装中并发LNA的芯片封装协同设计
作者:
Torikka T.
;
Xinzhong Duo
;
Li-Rong Zheng
;
Tjukanoff E.
;
Tenhunen H.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
wireless LAN;
Bluetooth;
wideband amplifiers;
UHF amplifiers;
microwave amplifiers;
liquid crystal polymers;
substrates;
passive filters;
Q-factor;
electronics packaging;
chip-package codesign;
concurrent low noise amplifier;
liquid crystal polymer;
system-on-package module;
multiband radio transceivers;
wideband LNA;
multiband passive filter;
wireless LAN;
Bluetooth;
embedded chip technologies;
quality factors;
insertion loss;
1 to 13 GHz;
84.
Demonstration of an MT-compatible connectorisation of a laser-ablated optical interconnection on a printed circuit board
机译:
演示与MT兼容的印刷电路板上的激光烧蚀光学互连的连接器
作者:
Van Steenberge G.
;
Geerinck P.
;
Van Put S.
;
Van Koetsem J.
;
Morlion D.
;
Van Daele P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
optical backplanes;
printed circuit manufacture;
laser ablation;
microlenses;
micromirrors;
optical planar waveguides;
optical communication equipment;
MT-compatible connectorisation;
laser-ablated optical interconnection;
printed circuit board;
multimode polymer waveguides;
micromirrors;
alignment features;
microlenses;
frequency tripled laser;
excimer laser;
parallel optical link;
integrated waveguides;
optical board manufacturing;
board-level interconnects;
deflecting optics;
85.
Design and analysis methodologies of a 6.4 Gb/s memory interconnect system using conventional packaging and board technologies
机译:
使用常规封装和板技术的6.4 Gb / s内存互连系统的设计和分析方法
作者:
Beyene W.T.
;
Hao Shi
;
Feng J.
;
Yuan C.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit interconnections;
printed circuit design;
integrated circuit design;
integrated circuit modelling;
integrated circuit packaging;
circuit simulation;
equalisers;
extreme data rate memory channel;
memory interconnect system;
packaging technologies;
board technologies;
XDR system;
high-speed memory system;
circuit simulation tools;
fullwave electromagnetic/hardware correlation;
preemphasis equalization technique;
6.4 Gbit/s;
86.
Development of a curriculum in nano and MEMS packaging and manufacturing for integrated systems to prepare next generation workforce
机译:
为集成系统开发纳米和MEMS封装与制造课程,以培养下一代劳动力
作者:
Malshe A.P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit packaging;
semiconductor device packaging;
micromechanical devices;
nanoelectronics;
educational courses;
electronic engineering education;
industrial training;
next generation workforce;
MEMS packaging;
nano packaging;
curriculum development;
nano manufacturing;
MEMS manufacturing;
educational framework;
market driven revolution;
technology driven revolution;
demands training;
skilled workforce;
subject multilingual workforce;
87.
Effect of solder ball pitch and substrate material of printed wiring board on reliability under thermal cycling - a finite element analysis
机译:
焊球间距和印刷线路板基板材料对热循环可靠性的影响-有限元分析
作者:
Khan S.
;
Asaduzzaman M.
;
Lamontia M.A.
;
Sloan J.G.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ball grid arrays;
thermal management (packaging);
plastic deformation;
creep;
soldering;
finite element analysis;
substrates;
circuit reliability;
thermal stresses;
stress-strain relations;
thermal stress cracking;
solder ball pitch;
substrate material;
printed wiring board;
reliability under thermal cycling;
finite element analysis;
stresses-strains;
thermal fatigue;
solder-ball failure;
cumulative creep-energy-density;
critical-solder-balls;
surface dielectric rupture;
in-plane tensile strains;
BGA pitch;
Von Misses stress;
anisotropic material constants;
low CTE;
88.
Fatigue life estimation of a stretched-solder-column ultra-fine-pitch wafer level package using the macro-micro modelling approach
机译:
使用宏-微建模方法估算拉伸焊料柱超细间距晶圆级封装的疲劳寿命
作者:
Chng A.C.
;
Tay A.A.O.
;
Lim K.M.
;
Wong E.H.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
fine-pitch technology;
ball grid arrays;
chip scale packaging;
finite element analysis;
solders;
reflow soldering;
integrated circuit interconnections;
integrated circuit reliability;
thermal management (packaging);
thermal stress cracking;
fatigue;
fatigue life estimation;
stretched-solder-column package;
ultrafine-pitch wafer level package;
macro-micro modelling;
package warpage estimates;
interconnect fatigue life estimates;
interconnection height;
chip thickness;
substrate CTE;
thermomechanical reliability;
large package;
small interconnections;
shell elements;
beam elements;
applied plastic shear strain;
FEA code;
high lead solder interconnect;
89.
High-frequency characterization of differential signals in a flip-chip organic package
机译:
倒装芯片有机封装中差分信号的高频特性
作者:
Chiu C.
;
Hanyi Ding
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
integrated circuit interconnections;
integrated circuit measurement;
integrated circuit packaging;
integrated circuit modelling;
S-parameters;
ball grid arrays;
flip-chip devices;
time-domain reflectometry;
computational electromagnetics;
BGA;
package high-frequency characterization;
differential signals;
flip-chip organic package;
chip package interconnect;
constant characteristic impedance;
S-parameters;
chip mounting pad side probing;
time domain reflectometry;
TDR;
electromagnetic simulations;
90.
Mechatronics toward development of a fully automated meniscus coating system
机译:
机电一体化致力于开发全自动弯月面涂层系统
作者:
Bhatevara S.
;
Bhattacharya S.K.
;
May G.S.
;
Kamen E.W.
;
Sutter D.
;
Tummala R.R.
;
Harrington S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
coating techniques;
materials handling equipment;
polymer films;
dielectric thin films;
drying;
unloading;
loading;
fully automated meniscus coating system;
mechatronics;
material deposition techniques;
large area polymer deposition;
process optimization;
polymer photoresists;
polymer dielectrics;
thick film coating;
glass substrate;
PWB substrate;
automated coating workcell;
robotic material handling;
convection drying;
automated loading/unloading capability;
coating uniformity;
coating throughput;
coater heads;
substrate holder;
liquid polymers;
12 in;
24 in;
91.
Mirror coating and packaging for a horizontal MEMS optical switch array
机译:
用于水平MEMS光开关阵列的镜面涂层和封装
作者:
Li M.
;
Chung P.S.
;
Yeung M.T.
;
Chan P.S.
;
Liang T.K.
;
Shu C.
;
Lai K.W.C.
;
Li W.J.
;
Tong F.
;
Tsang H.K.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
electro-optical switches;
micromirrors;
optical films;
micromachining;
optical fibres;
electronics packaging;
optical switch array packaging;
mirror coating;
horizontal MEMS optical switch array;
ON-OFF switch;
horizontal surface micromachined mirror chip;
3D PolyMUMP mirror;
optical fibers;
optical micro-bench;
packaging auto-alignment system;
multilayer dielectric optical coating;
Au-Si;
92.
Time-domain analysis of the signal integrity of a 1-Gbps 4-module memory bus with a broadband ceramic directional coupler designed in the frequency domain
机译:
使用频域设计的宽带陶瓷定向耦合器对1 Gbps 4模块内存总线的信号完整性进行时域分析
作者:
Uematsu Y.
;
Osaka H.
;
Ikeda H.
;
Sakisaka Y.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
DRAM chips;
S-parameters;
SPICE;
crosstalk;
directional couplers;
equivalent circuits;
multiport networks;
transient analysis;
time-domain analysis;
frequency-domain analysis;
time-domain analysis;
signal integrity;
four-module memory bus;
broadband ceramic directional coupler;
frequency domain design;
S-parameters;
design validity;
bus performance;
crosstalk transfer logic interface;
DRAM memory bus;
SPICE;
equivalent circuit;
4-port network;
transient analysis;
1 Gbit/s;
93.
Components' emissivity in reflow soldering process
机译:
回流焊接过程中组件的发射率
作者:
Svasta P.
;
Simion-Zanescu D.
;
Ionescu R.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
reflow soldering;
surface mount technology;
emissivity;
blackbody radiation;
heat transfer;
Boltzmann equation;
component emissivity;
reflow soldering process;
surface mount assembly;
assembly modeling;
IR heat transfer;
black body;
Stefan Boltzman equation;
surface emission;
94.
Evaluation of frequency-dependent transmission line model extraction methods based on laboratory measurements
机译:
基于实验室测量的频率相关传输线模型提取方法的评估
作者:
Syverson S.L.
;
Heckmann D.L.
;
Timpane T.J.
;
Dahlen P.E.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
transmission lines;
time-domain reflectometry;
strip lines;
circuit simulation;
SPICE;
interconnections;
printed circuit design;
time domain reflectometer measurements;
stripline transmission line;
HSPICE;
frequency-dependent transmission line model extraction methods;
transmission line modeling;
high-speed interconnects;
circuit simulation;
PCB interconnect geometries;
95.
Applied FEM techniques in ceramic feedthru package design
机译:
有限元技术在陶瓷穿通包装设计中的应用
作者:
Eblen M.D.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
ceramic packaging;
integrated circuit packaging;
finite element analysis;
integrated circuit reliability;
MMIC;
heat sinks;
thermal management (packaging);
thermal stresses;
internal stresses;
thermal expansion;
hermetic seals;
brazing;
electronic engineering computing;
applied FEM techniques;
ceramic feedthrough package design;
hermetic packages;
thermal expansion mismatch;
brazing;
high residual stresses;
alumina feedthrough;
ANSYS software;
CARES software;
failure probability design software;
package reliability;
high power MMIC;
dispersed composite heat sink;
96.
Embedded optical interconnections on printed wiring boards
机译:
印刷线路板上的嵌入式光学互连
作者:
Suzuki T.
;
Nonaka T.
;
Ogawa N.
;
Sang-Yeon Cho
;
Sang-Woo Seo
;
Jokerst N.M.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
printed circuits;
integrated optoelectronics;
optical interconnections;
metal-semiconductor-metal structures;
photodetectors;
optical receivers;
dark conductivity;
photoconductivity;
transient response;
embedded optical interconnections;
embedded optoelectronic components;
printed wiring board electrical interconnection systems integration;
PWB;
embedded thin film metal-semiconductor-metal photodetector;
fabrication steps;
process conditions;
photocurrent to dark current ratio;
impulse response;
embedded MSM photodetector;
22 ps;
97.
Nano metal particles for low temperature interconnect technology
机译:
用于低温互连技术的纳米金属颗粒
作者:
Kyoung-sik Moon
;
Hai Dong
;
Pothukuchi S.
;
Yi Li
;
Wong C.P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
silver;
nanoparticles;
sintering;
shrinkage;
differential scanning calorimetry;
particle size;
heat treatment;
melting point;
X-ray diffraction;
densification;
scanning electron microscopy;
contact resistance;
Fourier transform spectra;
infrared spectra;
X-ray photoelectron spectra;
powder metallurgy;
filled polymers;
adhesives;
conducting polymers;
nanocomposites;
metal nanoparticles;
low temperature interconnect;
melting point depression;
sintering behavior;
particle surface;
XPS;
TGA;
DSC;
FTIR spectra;
crystal structure;
XRD;
shrinkage;
conductive polymer-metal composite;
contact resistance;
heat treatment;
scanning electron microscopy;
densification;
lattice diffusion;
Ag;
98.
Optimization of RF/microwave multichip module performance based on neural models of passives and interconnects
机译:
基于无源和互连的神经模型优化RF /微波多芯片模块的性能
作者:
Yagoub M.C.E.
;
Sharma P.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
multichip modules;
circuit optimisation;
microwave circuits;
neural nets;
resistors;
capacitors;
inductors;
integrated circuit interconnections;
computational electromagnetics;
circuit simulation;
RF MCM optimization;
microwave multichip module;
neural networks;
passive components;
interconnects;
distributed passive devices;
neural models;
high-frequency electromagnetic effects;
optimum passive geometrical parameters;
chip layout optimum location;
circuit simulators;
99.
Multi-level education curriculum of electronic manufacturing engineering in GUET
机译:
GUET电子制造工程多层次教育课程
作者:
Yang D.G.
;
Sun N.
;
Ma X.S.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
further education;
continuing education;
electronics packaging;
educational courses;
educational institutions;
electronic engineering education;
electronics industry;
industrial engineering;
multilevel education curriculum;
electronic manufacturing engineering;
electronics industry challenges;
conventional university education;
China university;
Guilin University of Electronic Technology;
electronics assembly;
electronics packaging;
microelectronics manufacturing engineering;
undergraduate level;
continuing education;
graduate level;
100.
Active devices and wiring under chip bond pads: stress simulations and modeling methodology
机译:
有源器件和芯片焊盘下的布线:应力模拟和建模方法
作者:
Awad E.
会议名称:
《Electronic Components and Technology Conference, 2004. Proceedings. 54th》
|
2004年
关键词:
lead bonding;
integrated circuit packaging;
integrated circuit bonding;
stress analysis;
integrated circuit metallisation;
finite element analysis;
integrated circuit reliability;
integrated circuit layout;
circuit simulation;
active devices;
active wiring;
chip bond pads;
modeling methodology;
stress simulations;
structures under pads;
wire-bonded chips;
layout strategy;
finite element analysis;
time savings;
cost savings;
stress distribution;
simulation matrix;
varying metal density;
ball bond size;
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