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Conference on Design-Process-Technology Co-optimization for Manufacturability

召开年：2020
召开地：San Jose(US)
出版时间：-

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1.Machine Learning using retarget data to improve accuracy of fast lithographic hotspot detection

机译：使用重定位数据的机器学习可提高快速光刻热点检测的准确性
- 作者：Aliaa Kabeel;Wael ElManhawy;Joe Kwan;Asmaa Rabie;Mohamed Ismail;Ahmed Khater;Sarah Rizk
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
2.Implementing Machine Learning OPC on Product Layouts

机译：在产品布局上实施机器学习OPC
- 作者：Hesham Abdelghany;Kevin Hooker;Marco Guajardo;Chia-Chun Lu
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DUV;
- EUV;
- OPC;
- AF;
- ML-OPC;
- TAT;
- TPG;
3.ADVANCED MEMORY CELL DESIGN OPTIMIZATION WITH INVERSE LITHOGRAPHY TECHNOLOGY

机译：逆光刻技术对高级记忆细胞设计的优化
- 作者：Jiro Higuchi;Weiting Wang;Takamasa Takaki;Hiromitsu Mashita;Shigeki Nojima;Ahmed Omran;Ken Hanafusa;Seunghee Baek;Ryan Chen;Yukio Asaka;Kyle Braam;Hironobu Taoka;Guangming Xiao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Lithography Simulation;
- Design Rule Exploration;
- DRE;
- ILT;
- Inverse Lithography;
- Computational Lithography;
- OPC;
- Memory Cell Design;
4.Standard cell architectures for N2 node: transition from FinFET to NanoSheet and to ForkSheet device

机译：N2节点的标准单元体系结构：从FinFET到NanoSheet和ForkSheet器件的过渡
- 作者：Bilal Chehab;P. Weckx;J. Ryckaert;D. Jang;D. Verkest;A. Spessot
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard Cell Design;
- Design Technology Co-Optimization (DTCO);
- Patterning options;
- buried power rail;
- Scaling boosters;
- FinFET;
- NanoSheet;
- ForkSheet;
5.Approaches for Full Coverage Physical Design Space Exploration Analysis by Synthetic Layout Generation

机译：综合布局生成的全覆盖物理设计空间探索与分析方法
- 作者：Marwah Shafee;Joe Kwan;Wael El-Manhawy;Aliaa Kabeel;Sarah Risk;Jongha Park;SeungJo Lee;Jin Hee Kim;Mostafa Alaa;Mohamed Bahnasawi;Abdelrahman Abdelrazek;Sherif Hammouda;Kareem Madkour;Nabil Sabry
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- DSE;
- Synthetic Layout Generation;
- Monte Carlo Methods;
- Hierarchical Classification;
- Genealogy Classification.;
6.An Automated System for Checking Process Friendliness and Routability of Standard Cells

机译：用于检查标准单元的工艺友好性和可布线性的自动化系统
- 作者：I-Lun Tseng;Punitha Selvam;Zhao Chuan Lee;Vikas Tripathi;Chun Ming Tommy Yip;Jonathan Yoong Seang Ong
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard cell;
- lithography hotspot;
- process hotspot;
- routability;
- pin accessibility;
- DFM;
- design for manufacturability;
- physical design;
7.Sequential 3D standard cell 4T architecture using design crenellation and self-aligned MOL for N2 technology and beyond.

机译：顺序3D标准单元4T架构，使用针对N2技术及更高版本的设计曲线和自对准MOL。
- 作者：Pieter Weckx;Bilal Chehab;Julien Ryckaert;Diederik Verkest;Alessio Spessot
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard Cell Design;
- SoC Technology Co-Optimization (STCO);
- Advanced technology node;
- Patterning options;
- buried power rail;
- Scaling boosters;
- FinFET;
- Nanosheet;
- Forksheet;
- 3D;
- Sequential 3D;
- crenellation;
8.DTCO Acceleration to Fight Scaling Stagnation

机译：DTCO加速应对结垢停滞
- 作者：Lars Liebmann;Daniel Chanemougame;Peter Churchill;Jonathan Cobb;Chia-Tung Ho;Victor Moroz;Jeffrey Smith
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
9.Dynamic Pattern Matching Flow to Enable Low Escape Rate Weak Point Detection

机译：动态模式匹配流程可实现低逃逸率弱点检测
- 作者：Uwe Paul Schroeder;Janam Bakshi;Ahmed Mounir Elsemary;Fadi Batarseh
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- pattern matching;
- in-design auto-fixing;
- machine learning;
- process window;
10.Integrating enhanced hotspot library into manufacturing OPC correction flow

机译：将增强的热点库集成到制造OPC校正流程中
- 作者：Bradley Falch;Linghui Wu;John Tsai;Elsley Tan;Jiunhau Fu;Tengyen Huang;Chuncheng Liao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- OPC;
- optical proximity correction;
- hotspot;
- pattern matching;
- semiconductor lithography;
- mask synthesis;
11.Exploring patterning limit and Enhancement techniques to improve printabilitv of 2D shapes at 3nm node

机译：探索图案限制和增强技术，以改善3nm节点处2D形状的可打印性
- 作者：Rehab Kotb;Ahmed Hamed-Fateh;James Word
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- EUV;
- 2D Block shapes;
- SAMP;
- SALELE;
- DFM;
- OPC;
- 3nm node;
- OPC Verification;
12.Foundry approach for layout risk assessment through comprehensive pattern harvesting and large-scale data analysis

机译：通过全面的模式收集和大规模数据分析来进行布局风险评估的铸造方法
- 作者：Monisa Ramesh Babu;Shenghua Song;Qian Xie;Pouya Rezaifakhr;Eric Chiu;Joo Hyun Park;Deborah Ryan;Kiruthika Murali;Praneetha Poloju;Shobhit Malik;Haizhou Yin;Sriram Madhavan;Panneerselvam Vcnkatachalam
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- semiconductor;
- manufacturing;
- big data;
- analytics;
- pattern;
- layout;
- silicon inspection;
- machine learning;
13.Process related yield risk mitigation with in-design pattern replacement for system ICs manufactured at advanced technology nodes

机译：通过在先进技术节点制造的系统IC的设计中模式替换来降低与工艺相关的良率风险
- 作者：Jaehwan Kim;Jin Kim;Byungchul Shin;Sangah Lee;Jae-Hyun Kang;Joong-Won Jeon;Piyush Pathak;Jac Condella;Frank E. Gennari;Philippe Hurat;Ya-Chieh Lai
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DFM;
- DFY;
- EUV;
- yield enhancement;
- 5nm;
- DTCO;
14.Systematic DTCO Flow for Yield Improvement at 14/12nm Technology Node

机译：系统的DTCO流程可提高14 / 12nm技术节点的良率
- 作者：Xiaojing Su;Yayi Wei;Rui Chen;Yajuan Su;Lisong Dong;Joe Kwan;Recoo Zhang;Chunshan Du;Qijian Wan;Xinyi Hu
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- DFM;
- RET;
- LFD;
- pattern match;
- CMP;
15.Co-optimizing DFM enhancements and their impact on layout-induced circuit performance for analog designs

机译：共同优化DFM增强功能及其对模拟设计的布局感应电路性能的影响
- 作者：Lynn Wang;Michael Simcoe;Vikas Mehrotra;Gail Katzman;Rais Huda;Zhao Chuan Lee;Janam Bakshi;Ahmed Abdhulghany
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DFM;
- layout fixing;
- pattern matching;
- device matching;
- analog circuits;
- variability;
- via redundancy;
- symmetry;
16.Enabling nanoimprint simulator for quality verification; Process-design co-optimization toward high volume manufacturing

机译：启用纳米压印模拟器进行质量验证;面向大批量生产的工艺设计共同优化
- 作者：Junichi Seki;Yuichiro Oguchi;Naoki Kiyohara;Koshiro Suzuki;Kohei Nagane;Shintaro Narioka;Takahiro Nakayama;Yoshihiro Shiode;Sentaro Aihara;Toshiya Asano
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- nanoimprint lithography;
- NIL;
- simulation;
- fluid structure interaction;
- computation fluid dynamics;
- CFD;
- FSI;
17.Process Variation-aware Mask Optimization with Iterative Improvement by Subgradient Method and Boundary Flipping

机译：基于次梯度法和边界翻转的迭代改进过程感知掩模优化
- 作者：Rina Azuma;Yukihide Kohira;Tomomi Matsui;Atsushi Takahashi;Chikaaki Kodama
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Lithography;
- Optical Proximity Correction (OPC);
- Design for Manufacturability (DfM);
18.Efficient design of guard rings and antenna diodes to improve manufacturability of FDSOI circuits

机译：保护环和天线二极管的有效设计可提高FDSOI电路的可制造性
- 作者：Chi-Min Yuan;Dave Tipple
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- FDSOI;
- guard ring;
- antenna diode;
- design for manufacturing;
- DTCO;
19.Cost-performance optimization of fine-pitch W2W bonding: functional system partitioning with heterogeneous FEOL/BEOL configurations

机译：细间距W2W粘结的成本性能优化：具有异构FEOL / BEOL配置的功能系统分区
- 作者：Dragomir Milojevic;Eric Beyne;Geert Van der Plas;Jane Wang;Peter Debacker
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
20.How utilizing curvilinear design enables better manufacturing process window

机译：如何利用曲线设计实现更好的制造工艺窗口
- 作者：Ryan Pearman;Don ORiordan;Jeff Ungar;Mairusz Niewczas;Leo Pang;Aki Fujimura
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
21.Holistic method for reducing overlay error at the 5nm node and beyond

机译：减少5nm及以上节点的重叠误差的整体方法
- 作者：Robert Socha
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Holistic;
- lithography;
- overlay;
- edge placement error;
22.New approaches to physical verification closure and cloud computing come to the rescue in the EUV era

机译：物理验证关闭和云计算的新方法在EUV时代应运而生
- 作者：John Ferguson
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- IC verification;
- ???;
23.Multi-varied implementations with common underpinnings in Design Technology Co-Optimization

机译：设计技术协同优化中具有共同基础的多变量实施
- 作者：Kevin Lucas;Victor Moroz;John Kim;Soo-Han Choi;Tim Tsuei
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- TCAD;
- process models;
- circuit simulation;
- PDK;
- design fix;
- yield exploration;
24.An Advanced and Efficient Methodology for Process Setup and Monitoring by Using Process Stability Diagnosis in Computational Lithography

机译：在计算光刻中使用过程稳定性诊断进行过程设置和监控的先进高效方法
- 作者：Lijun Chen;Jun Zhu;Xuedong Fan;Haichang Zheng;Xiaolong Wang;Yancong Ge;YuZhang;Abhishek Vikram;Guojie Cheng;Hui Wang;Qing Zhang;Wenkui Liao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Process Stability Diagnosis;
- After Develop Inspection (ADI);
- SEM Review;
- CDSEM;
- pattern centric;
- process window;
25.Via Optimization Methodology for Enhancing Robustness of Design at 14/12nm Technology Node

机译：通过优化方法论提高14 / 12nm技术节点的设计稳健性
- 作者：Xiaojing Su;Libin Zhang;Yayi Wei;Rui Chen;Yajuan Su;Lisong Dong;Chunshan Du;Qijian Wan;Xinyi Hu
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- via optimization;
- metal coverage;
- yield killer;
- design optimization;
- DRC.;
26.Explore Process Weak Patterns for Manufacturing Friendly Design

机译：探索用于制造友好设计的过程弱模式
- 作者：Jet Jiang;Frank Hou;Gavin Li;Marfe Ma;Kuan Hu;Chunshan Du;Qijian Wan;Zhengfang Liu;Xinyi Hu;Elven Huang;Wael ElManhawy
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- weak pattern;
- machine learning;
- pattern matching;
- yield;
- data analysis;
27.VIA Design Optimization for Fast Yield Ramping in Advanced Nodes

机译：用于高级节点的快速收益提升的VIA设计优化
- 作者：Min Wang;Yizhong Zhang;Shirui Yu;Xinyi Hu;Qijian Wan;Zhengfang Liu;Zhixi Chen;Chunshan Du
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Yield;
- DFM;
- VIA Shifting;
- Redundant VIA;
28.Early Detection of Cu Pooling with Advanced CMP Modeling

机译：使用高级CMP建模及早发现铜池
- 作者：Single Hsu;Ethan Wang;Eason Lin;Tamba Gbondo-Tugbawa;Aaron Gower-Hall;Brian Lee;Jansen Chee;Ya-Chieh Lai
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Chemical Mechanical Polishing (CMP);
- Copper Interconnect;
- Copper Pooling;
- Neighborhood Effect;
- CMP Modeling;
29.CMP Simulation-Based Dummy Fill Optimization

机译：基于CMP仿真的虚拟填充优化
- 作者：Liwei Jiang;Yun Cao;Jiao Zhang;Fang Wei;Zhengfang Liu;Chunshan Du;Ruben Ghulghazaryan;Davit Piliposyan;Jeff Wilson;Qijian Wan;XinyiHu;Zhixi Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- CMP;
- modeling;
- SmartFill;
- dummy fill;
- hotspots;
30.An Efficient Way to Accelerate Litho Hotspot Checking

机译：加快光刻热点检查的有效方法
- 作者：Jet Jiang;Gavin Li;Frank Hou;Qijian Wan;Xinyi Hu;Zhengfang Liu;Zhixi Chen;Chunshan Du
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Litho Hotspot;
- Yield;
- Pattern Matching;
- LFD;
31.Kissing corner handling in advanced nodes

机译：高级节点中的接吻处理
- 作者：Harold Mendoza;Gazi Huda
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- kissing corners;
- lithography;
- density;
- Fill;
- OPC;
- GR;
- DRC;
- MRC;
- ORC;
- MDP;
32.DFM: 'Design for Manufacturing' or 'Design Friendly Manufacturing'? How to convert extra EPE budget into design freedom by SMO

机译：DFM：“为制造而设计”还是“对设计友好的制造”？如何通过SMO将额外的EPE预算转换为设计自由
- 作者：Wenzhan Zhou;Hung-Wen Chao;Yu Zhang;Chan-Yuan Hu;QiXin Xu;Quan Gan;Ao Chen;Gen-Sheng Gao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
33.Fast OPC Repair Flow Based on Machine Learning

机译：基于机器学习的OPC快速修复流程
- 作者：Bailing Shi;Rock deng;Zhongli Shu;Yu Zhu;Yuanying Tu;Sun Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Tape-out;
- OPC;
- Repair flow;
- ORC;
- Machine Learning;
34.A Comprehensive Standard Cell Library Qualification to Prevent Lithographic Challenges

机译：全面的标准单元库认证，可防止光刻挑战
- 作者：Xinyi Hu;Qijian Wan;Zhengfang Liu;Zhixi Chen;Chunshan Du
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard Cell Library;
- Lithographic;
- Optical;
- Qualify;
35.Implementing machine learning for OPC retargeting

机译：为OPC重新定位实施机器学习
- 作者：Kevin Hooker;Marco Guajardo;Nai-Chia Cheng;Guangming Xiao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Inverse Lithography Technology;
- ILT;
- machine learning;
- Retargeting;
- Optical Lithography;
- DTCO;
- Design Technology Co-Optimization;
36.A Feature Selection Method for Weak Classifier based Hotspot Detection

机译：基于弱分类器的热点检测特征选择方法
- 作者：Hidekazu Takahashi;Hiroki Ogura;Shimpei Sato;Atsushi Takahashi;Chikaaki Kodama
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Lithography;
- Hotspot detection;
- Machine Learning;
37.Unsupervised Machine Learning based CD-SEM image segregator for OPC and Process Window Estimation

机译：基于无监督机器学习的用于OPC的CD-SEM图像分离器和过程窗口估计
- 作者：Bappaditya Dey;Dorin Cerbu;Kasem Khalil;Sandip Haider;Philippe Leray;Sayantan Das;Yasser Sherazi;Magdy A. Bayoumi;Ryoung Han Kim
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- machine learning;
- autoencoder;
- process window;
- defect;
- unsupervised;
- deep learning;
- similarity index;
- generative-adversarial-network;
- OPC;
- CD-SEM;
38.VIA Design Optimization for Fast Yield Ramping in Advanced Nodes

机译：通过设计优化在高级节点中快速屈服斜坡
- 作者：Min Wang;Yizhong Zhang;Shirui Yu;Xinyi Hu;Qijian Wan;Zhengfang Liu;Zhixi Chen;Chunshan Du
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Yield;
- DFM;
- VIA Shifting;
- Redundant VIA;
39.Multi-varied implementations with common underpinnings in Design Technology Co-Optimization

机译：具有普通内衬在设计技术协同优化中的多种实现
- 作者：Kevin Lucas;Victor Moroz;John Kim;Soo-Han Choi;Tim Tsuei
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- TCAD;
- process models;
- circuit simulation;
- PDK;
- design fix;
- yield exploration;
40.Via Optimization Methodology for Enhancing Robustness of Design at 14/12nm Technology Node

机译：通过优化方法，以在14 / 12nm技术节点上提高设计的鲁棒性
- 作者：Xiaojing Su;Libin Zhang;Yayi Wei;Rui Chen;Yajuan Su;Lisong Dong;Chunshan Du;Qijian Wan;Xinyi Hu
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- via optimization;
- metal coverage;
- yield killer;
- design optimization;
- DRC.;
41.An Advanced and Efficient Methodology for Process Setup and Monitoring by Using Process Stability Diagnosis in Computational Lithography

机译：通过在计算光刻中使用过程稳定性诊断，通过过程稳定性诊断进行进程和高效的方法
- 作者：Lijun Chen;Jun Zhu;Xuedong Fan;Haichang Zheng;Xiaolong Wang;Yancong Ge;YuZhang;Abhishek Vikram;Guojie Cheng;Hui Wang;Qing Zhang;Wenkui Liao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Process Stability Diagnosis;
- After Develop Inspection (ADI);
- SEM Review;
- CDSEM;
- pattern centric;
- process window;
42.Co-optimizing DFM enhancements and their impact on layout-induced circuit performance for analog designs

机译：共同优化DFM增强功能及其对模拟设计的布局诱导电路性能的影响
- 作者：Lynn Wang;Michael Simcoe;Vikas Mehrotra;Gail Katzman;Rais Huda;Zhao Chuan Lee;Janam Bakshi;Ahmed Abdhulghany
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DFM;
- layout fixing;
- pattern matching;
- device matching;
- analog circuits;
- variability;
- via redundancy;
- symmetry;
43.Kissing corner handling in advanced nodes

机译：在高级节点中接吻角落处理
- 作者：Harold Mendoza;Gazi Huda
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- kissing corners;
- lithography;
- density;
- Fill;
- OPC;
- GR;
- DRC;
- MRC;
- ORC;
- MDP;
44.DTCO Acceleration to Fight Scaling Stagnation

机译：DTCO加速，以战斗扩展停滞
- 作者：Lars Liebmann;Daniel Chanemougame;Peter Churchill;Jonathan Cobb;Chia-Tung Ho;Victor Moroz;Jeffrey Smith
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
45.Enabling nanoimprint simulator for quality verification; Process-design co-optimization toward high volume manufacturing

机译：启用纳米模拟模拟器以进行质量验证;流程设计共同优化高批量生产
- 作者：Junichi Seki;Yuichiro Oguchi;Naoki Kiyohara;Koshiro Suzuki;Kohei Nagane;Shintaro Narioka;Takahiro Nakayama;Yoshihiro Shiode;Sentaro Aihara;Toshiya Asano
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- nanoimprint lithography;
- NIL;
- simulation;
- fluid structure interaction;
- computation fluid dynamics;
- CFD;
- FSI;
46.Unsupervised Machine Learning based CD-SEM image segregator for OPC and Process Window Estimation

机译：基于无监督的机器学习的CD-SEM图像隔离器OPC和过程窗口估计
- 作者：Bappaditya Dey;Dorin Cerbu;Kasem Khalil;Sandip Haider;Philippe Leray;Sayantan Das;Yasser Sherazi;Magdy A. Bayoumi;Ryoung Han Kim
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- machine learning;
- autoencoder;
- process window;
- defect;
- unsupervised;
- deep learning;
- similarity index;
- generative-adversarial-network;
- OPC;
- CD-SEM;
47.Dynamic Pattern Matching Flow to Enable Low Escape Rate Weak Point Detection

机译：动态模式匹配流使低逃生率弱点检测
- 作者：Uwe Paul Schroeder;Janam Bakshi;Ahmed Mounir Elsemary;Fadi Batarseh
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- pattern matching;
- in-design auto-fixing;
- machine learning;
- process window;
48.Process Variation-aware Mask Optimization with Iterative Improvement by Subgradient Method and Boundary Flipping

机译：通过子射泽方法和边界翻转的迭代改进处理变异变异感知掩模优化
- 作者：Rina Azuma;Yukihide Kohira;Tomomi Matsui;Atsushi Takahashi;Chikaaki Kodama
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Lithography;
- Optical Proximity Correction (OPC);
- Design for Manufacturability (DfM);
49.Explore Process Weak Patterns for Manufacturing Friendly Design

机译：探索工艺友好设计的弱模式
- 作者：Jet Jiang;Frank Hou;Gavin Li;Marfe Ma;Kuan Hu;Chunshan Du;Qijian Wan;Zhengfang Liu;Xinyi Hu;Elven Huang;Wael ElManhawy
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- weak pattern;
- machine learning;
- pattern matching;
- yield;
- data analysis;
50.Implementing machine learning for OPC retargeting

机译：实施机器学习OPC retargeting
- 作者：Kevin Hooker;Marco Guajardo;Nai-Chia Cheng;Guangming Xiao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Inverse Lithography Technology;
- ILT;
- machine learning;
- Retargeting;
- Optical Lithography;
- DTCO;
- Design Technology Co-Optimization;
51.Cost-performance optimization of fine-pitch W2W bonding: functional system partitioning with heterogeneous FEOL/BEOL configurations

机译：细距W2W键合的成本性能优化：具有异构FEOL / BEOL配置的功能系统分区
- 作者：Dragomir Milojevic;Eric Beyne;Geert Van der Plas;Jane Wang;Peter Debacker
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
52.Implementing Machine Learning OPC on Product Layouts

机译：在产品布局上实现机器学习OPC
- 作者：Hesham Abdelghany;Kevin Hooker;Marco Guajardo;Chia-Chun Lu
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DUV;
- EUV;
- OPC;
- AF;
- ML-OPC;
- TAT;
- TPG;
53.Efficient design of guard rings and antenna diodes to improve manufacturability of FDSOI circuits

机译：保护圈和天线二极管的高效设计，提高FDSOI电路的可制造性
- 作者：Chi-Min Yuan;Dave Tipple
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- FDSOI;
- guard ring;
- antenna diode;
- design for manufacturing;
- DTCO;
54.Exploring patterning limit and Enhancement techniques to improve printabilitv of 2D shapes at 3nm node

机译：探索Patterning限制和增强技术，以改善3nm节点的2D形状的Printabilitv
- 作者：Rehab Kotb;Ahmed Hamed-Fateh;James Word
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- EUV;
- 2D Block shapes;
- SAMP;
- SALELE;
- DFM;
- OPC;
- 3nm node;
- OPC Verification;
55.Foundry approach for layout risk assessment through comprehensive pattern harvesting and large-scale data analysis

机译：通过综合模式收获和大规模数据分析，铸造铸造方法进行布局风险评估
- 作者：Monisa Ramesh Babu;Shenghua Song;Qian Xie;Pouya Rezaifakhr;Eric Chiu;Joo Hyun Park;Deborah Ryan;Kiruthika Murali;Praneetha Poloju;Shobhit Malik;Haizhou Yin;Sriram Madhavan;Panneerselvam Vcnkatachalam
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- semiconductor;
- manufacturing;
- big data;
- analytics;
- pattern;
- layout;
- silicon inspection;
- machine learning;
56.DFM: 'Design for Manufacturing' or 'Design Friendly Manufacturing'? How to convert extra EPE budget into design freedom by SMO

机译：DFM：'制造设计'或“设计友好的制造”？如何通过SMO将额外的EPE预算转换为设计自由
- 作者：Wenzhan Zhou;Hung-Wen Chao;Yu Zhang;Chan-Yuan Hu;QiXin Xu;Quan Gan;Ao Chen;Gen-Sheng Gao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
57.Holistic method for reducing overlay error at the 5nm node and beyond

机译：用于减少5nm节点及更短的覆盖误差的整体方法
- 作者：Robert Socha
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Holistic;
- lithography;
- overlay;
- edge placement error;
58.Early Detection of Cu Pooling with Advanced CMP Modeling

机译：高级CMP建模的CU合并的早期检测
- 作者：Single Hsu;Ethan Wang;Eason Lin;Tamba Gbondo-Tugbawa;Aaron Gower-Hall;Brian Lee;Jansen Chee;Ya-Chieh Lai
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Chemical Mechanical Polishing (CMP);
- Copper Interconnect;
- Copper Pooling;
- Neighborhood Effect;
- CMP Modeling;
59.Process related yield risk mitigation with in-design pattern replacement for system ICs manufactured at advanced technology nodes

机译：过程相关屈服风险减缓与先进技术节点制造的系统IC的设计模式更换
- 作者：Jaehwan Kim;Jin Kim;Byungchul Shin;Sangah Lee;Jae-Hyun Kang;Joong-Won Jeon;Piyush Pathak;Jac Condella;Frank E. Gennari;Philippe Hurat;Ya-Chieh Lai
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DFM;
- DFY;
- EUV;
- yield enhancement;
- 5nm;
- DTCO;
60.Sequential 3D standard cell 4T architecture using design crenellation and self-aligned MOL for N2 technology and beyond.

机译：顺序3D标准单元4T架构使用设计塞列妥灭菌和用于N2技术及更短的自对准摩尔。
- 作者：Pieter Weckx;Bilal Chehab;Julien Ryckaert;Diederik Verkest;Alessio Spessot
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard Cell Design;
- SoC Technology Co-Optimization (STCO);
- Advanced technology node;
- Patterning options;
- buried power rail;
- Scaling boosters;
- FinFET;
- Nanosheet;
- Forksheet;
- 3D;
- Sequential 3D;
- crenellation;
61.Machine Learning using retarget data to improve accuracy of fast lithographic hotspot detection

机译：机器学习使用retarget数据来提高快速平版热点检测的准确性
- 作者：Aliaa Kabeel;Wael ElManhawy;Joe Kwan;Asmaa Rabie;Mohamed Ismail;Ahmed Khater;Sarah Rizk
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
62.A Comprehensive Standard Cell Library Qualification to Prevent Lithographic Challenges

机译：全面的标准细胞库资格，以防止光刻挑战
- 作者：Xinyi Hu;Qijian Wan;Zhengfang Liu;Zhixi Chen;Chunshan Du
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard Cell Library;
- Lithographic;
- Optical;
- Qualify;
63.CMP Simulation-Based Dummy Fill Optimization

机译：基于CMP仿真的虚拟填充优化
- 作者：Liwei Jiang;Yun Cao;Jiao Zhang;Fang Wei;Zhengfang Liu;Chunshan Du;Ruben Ghulghazaryan;Davit Piliposyan;Jeff Wilson;Qijian Wan;XinyiHu;Zhixi Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- CMP;
- modeling;
- SmartFill;
- dummy fill;
- hotspots;
64.Systematic DTCO Flow for Yield Improvement at 14/12nm Technology Node

机译：系统的DTCO流量在14 / 12nm技术节点处产生提高
- 作者：Xiaojing Su;Yayi Wei;Rui Chen;Yajuan Su;Lisong Dong;Joe Kwan;Recoo Zhang;Chunshan Du;Qijian Wan;Xinyi Hu
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- DFM;
- RET;
- LFD;
- pattern match;
- CMP;
65.Fast OPC Repair Flow Based on Machine Learning

机译：基于机器学习的快速OPC修复流
- 作者：Bailing Shi;Rock deng;Zhongli Shu;Yu Zhu;Yuanying Tu;Sun Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Tape-out;
- OPC;
- Repair flow;
- ORC;
- Machine Learning;
66.Approaches for Full Coverage Physical Design Space Exploration Analysis by Synthetic Layout Generation

机译：完全覆盖物理设计空间探索与合成布局生成的方法
- 作者：Marwah Shafee;Joe Kwan;Wael El-Manhawy;Aliaa Kabeel;Sarah Risk;Jongha Park;SeungJo Lee;Jin Hee Kim;Mostafa Alaa;Mohamed Bahnasawi;Abdelrahman Abdelrazek;Sherif Hammouda;Kareem Madkour;Nabil Sabry
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- DTCO;
- DSE;
- Synthetic Layout Generation;
- Monte Carlo Methods;
- Hierarchical Classification;
- Genealogy Classification.;
67.Integrating enhanced hotspot library into manufacturing OPC correction flow

机译：将增强的热点库集成到制造OPC校正流中
- 作者：Bradley Falch;Linghui Wu;John Tsai;Elsley Tan;Jiunhau Fu;Tengyen Huang;Chuncheng Liao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- OPC;
- optical proximity correction;
- hotspot;
- pattern matching;
- semiconductor lithography;
- mask synthesis;
68.An Automated System for Checking Process Friendliness and Routability of Standard Cells

机译：一种用于检查过程友好性和标准单元可排卵的自动化系统
- 作者：I-Lun Tseng;Punitha Selvam;Zhao Chuan Lee;Vikas Tripathi;Chun Ming Tommy Yip;Jonathan Yoong Seang Ong
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard cell;
- lithography hotspot;
- process hotspot;
- routability;
- pin accessibility;
- DFM;
- design for manufacturability;
- physical design;
69.An Efficient Way to Accelerate Litho Hotspot Checking

机译：加速Litho Hotspot检查的有效方法
- 作者：Jet Jiang;Gavin Li;Frank Hou;Qijian Wan;Xinyi Hu;Zhengfang Liu;Zhixi Chen;Chunshan Du
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Litho Hotspot;
- Yield;
- Pattern Matching;
- LFD;
70.How utilizing curvilinear design enables better manufacturing process window

机译：如何利用Curvilinear设计使得更好的制造过程窗口
- 作者：Ryan Pearman;Don ORiordan;Jeff Ungar;Mairusz Niewczas;Leo Pang;Aki Fujimura
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
71.Standard cell architectures for N2 node: transition from FinFET to NanoSheet and to ForkSheet device

机译：N2节点的标准单元架构：从FINFET转换到NANOSHEET和FORKSHEET设备
- 作者：Bilal Chehab;P. Weckx;J. Ryckaert;D. Jang;D. Verkest;A. Spessot
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Standard Cell Design;
- Design Technology Co-Optimization (DTCO);
- Patterning options;
- buried power rail;
- Scaling boosters;
- FinFET;
- NanoSheet;
- ForkSheet;
72.New approaches to physical verification closure and cloud computing come to the rescue in the EUV era

机译：物理验证封闭和云计算的新方法来到EUV时代的救援
- 作者：John Ferguson
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- IC verification;
- ???;
73.ADVANCED MEMORY CELL DESIGN OPTIMIZATION WITH INVERSE LITHOGRAPHY TECHNOLOGY

机译：具有逆光刻技术的高级存储器单元设计优化
- 作者：Jiro Higuchi;Weiting Wang;Takamasa Takaki;Hiromitsu Mashita;Shigeki Nojima;Ahmed Omran;Ken Hanafusa;Seunghee Baek;Ryan Chen;Yukio Asaka;Kyle Braam;Hironobu Taoka;Guangming Xiao
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Lithography Simulation;
- Design Rule Exploration;
- DRE;
- ILT;
- Inverse Lithography;
- Computational Lithography;
- OPC;
- Memory Cell Design;
74.A Feature Selection Method for Weak Classifier based Hotspot Detection

机译：基于弱分类器热点检测的特征选择方法
- 作者：Hidekazu Takahashi;Hiroki Ogura;Shimpei Sato;Atsushi Takahashi;Chikaaki Kodama
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability》 | 2020年
- Lithography;
- Hotspot detection;
- Machine Learning;