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Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09
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1.
Influence of truncated micro-pyramid cavity for LED packaging heat dissipation
机译:
截断的微金字塔腔对LED封装散热的影响
作者:
Shyu R.F.
;
Yang H.
;
Liao J.-Y.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
assembling;
cooling;
etching;
lead bonding;
light emitting diodes;
lithography;
micromachining;
semiconductor process modelling;
silicon;
thermal management (packaging);
FLOTHERM 4.2;
LED assembly;
LED packaging;
Trace Pro3.3;
heat dissipation;
light emitting diode;
lithography process;
optical simulation;
replication;
silicon anisotropic etching;
silicon bulk micromachining;
surface quality;
thermal effect;
thermo flow analysis software;
truncated micropyramid reflective cavity;
wire bonding;
2.
Broadband bandstop filters using periodic fractal EBG structures on CPW transmission line
机译:
CPW传输线上使用周期性分形EBG结构的宽带带阻滤波器
作者:
Huang J.-M.
;
Deng Z.L.
;
Zhang Y.H.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
UHF filters;
band-stop filters;
coplanar transmission lines;
coplanar waveguide components;
equivalent circuits;
fractals;
lumped parameter networks;
photonic band gap;
CPW transmission line;
EBG unit cell design;
bandwidth 2.3 GHz;
broadband bandstop filter;
coplanar waveguide transmission line;
electromagnetic bandgap structure;
equivalent lumped circuit;
pass-band insertion loss;
periodic fractal EBG structure;
3.
A bidirectional vibration powered electric energy generator based on electrostatic transduction using In-Plane Overlap Plate (IPOP) mechanism
机译:
平面内重叠板(IPOP)机制的基于静电传导的双向振动动力发电机
作者:
Paracha A.M.
;
Basset P.
;
Galayko D.
;
Marty F.
;
Bourouina T.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
capacitors;
convertors;
electric generators;
finite element analysis;
gyroscopes;
silicon;
transducers;
2D gyroscope;
2D transducers;
FEM simulations;
Si;
bidirectional vibration powered electric energy generator;
bulk silicon-based electric energy generator;
capacitance variation;
converter;
electrostatic transduction;
frequency 246 Hz;
in-plane overlap plate mechanism;
mechanical resonance frequency;
power 2.6 muW;
voltage 6 V;
4.
Wireless activity monitor using 3D itegration
机译:
使用3D集成的无线活动监控器
作者:
van Doremalen R.
;
van Engen P.
;
Jochems W.
;
Rommers A.
;
Maas G.
;
Shi Cheng
;
Rydberg A.
;
Fritzsch T.
;
Wolf J.
;
De Raedt W.
;
Jansen R.
;
Muller P.
;
Alarcon E.
;
Sanduleanu M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
accelerometers;
antenna radiation patterns;
biomedical communication;
patient monitoring;
surface mount technology;
wireless sensor networks;
3D itegration;
Si;
accelerometer;
distant patient monitoring;
processor;
rehabilitation support;
silicon substrate;
sleep management;
transmitter;
wireless activity monitor;
wireless body sensors;
5.
Experimental Study of Heat Sink Performances Using Copper Foams Fabricated by Electroforming
机译:
电铸铜泡沫散热性能的实验研究
作者:
Reiyu Chein
;
Hsiharng Yang
;
Tsung-Hsun Tsai
;
Chijay Lu
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
copper;
electroplating;
foams;
heat sinks;
heat transfer;
permeability;
polymer foams;
porosity;
porous materials;
thermal resistance;
Cu;
copper foams;
electroforming;
electroplating technique;
heat sink;
heat-sinking material;
heat-transfer area;
inertial coefficient;
pin-fin heat sink;
plate-fin heat sink;
polymer foam;
pore density;
porous media;
precoated silver film;
single-channel heat sink;
6.
Platform technology for form factor equivalent microsystems derived from COTS components
机译:
从COTS组件派生的等效形式微系统的平台技术
作者:
Jung E.
;
Minkus M.
;
Becker K.-F.
;
Koch M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
CMOS image sensors;
biomedical imaging;
equivalent circuits;
flip-chip devices;
integrated circuit packaging;
microsensors;
3D stacked systems;
CMOS sensor;
COTS components;
advanced packaging techniques;
bare die assembly;
electronic system;
flip chip system;
form factor equivalent circuits;
form factor equivalent microsystems;
medical imaging;
miniature camera system;
miniaturization approach;
platform technology;
7.
Committees
机译:
委员会
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
8.
Hydrodynamic separation of cells utilizing insulator-based dielectrophoresis
机译:
利用基于绝缘子的介电电泳法对细胞进行流体动力分离
作者:
Chun-Ping Jen
;
Ching-Te Huang
;
Hsin-Yuan Shih
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
biological techniques;
biomedical materials;
cellular biophysics;
electrophoresis;
hydrodynamics;
biological cells;
biomedical applications;
dead mammalian cells;
hydrodynamic separation;
insulating structure;
insulator-based dielectrophoresis;
viable cells;
9.
Use of a PDMS spring element for ink jet printing applications
机译:
PDMS弹簧元件在喷墨打印应用中的使用
作者:
Bargir S.
;
Allen D.M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
drops;
ink jet printing;
microfabrication;
pistons;
propulsion;
sealing materials;
springs (mechanical);
sputter etching;
DRIE-etched cavities;
PDMS spring element;
diaphragm-type silicone sealing joint;
liquid propulsion system;
propelling liquid droplets;
shear spring joints;
silicon piston;
10.
Index
机译:
指数
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
11.
Micro Thermoforming of nanostructured polymer films: A new bonding method for the integration of nanostructures in 3-dimensional cavities
机译:
纳米结构聚合物薄膜的微热成型:将纳米结构整合到3维腔体中的新结合方法
作者:
Heilig M.
;
Giselbrecht S.
;
Guber A.
;
Worgull M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
materials preparation;
nanostructured materials;
nanotechnology;
polymer films;
thermoforming;
3-dimensional cavities;
3-dimensional stretching;
micro thermoforming;
nanoimprinting;
nanostructures;
thermal bonding;
12.
Evaluation of parameters for electrostatic energy harvesters
机译:
评估静电能量收集器的参数
作者:
Cuong Phu Le
;
Halvorsen E.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
capacitors;
electrodes;
energy harvesting;
micromechanical devices;
transducers;
bias voltage;
dielectric wafers;
electrode pitch;
electrostatic energy harvesters;
electrostatic microgenerators;
in-plane overlap plate energy harvesters;
metal strip;
metal strip electrodes;
proof mass motion;
small gap-based transducer structure;
variable capacitors;
MEMS;
electrostatic transduction;
variable capacitance;
13.
MEMS packaging process by film transfer using anti-sticking layer
机译:
通过使用防粘层的薄膜转移进行MEMS封装工艺
作者:
Brault S.
;
Garel O.
;
Parrain F.
;
Desgeorges M.
;
Dufour-Gergam E.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
adhesives;
copper;
electronics packaging;
metallic thin films;
micromechanical devices;
moulding;
titanium;
MEMS packaging process;
Teflon;
Ti-Cu;
adhesive material;
antisticking layer;
bonding step;
carrier wafer;
film transfer technology;
host wafer;
microcaps;
nickel micromoulding step;
protective caps;
separation step;
14.
3D integrated sensor for biomolecules by using RF-MEMS technologies
机译:
使用RF-MEMS技术的3D集成式生物分子传感器
作者:
Jui-Hung Chien
;
Yuan-Hua Chu
;
Shau-Yin Tseng
;
Cheng-Hao Yang
;
Ping-Hei Chen
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
15.
Mechanical properties study of nano-scale thin films on the novel paddle cantilever using optical interferometer with four step phase-shifting method
机译:
四步相移法用光学干涉仪研究新型桨状悬臂上纳米级薄膜的力学性能
作者:
Ming-Tzer Lin
;
Chi-Jia Tong
;
Ya-Chi Cheng
;
Kuan-Jung Chung
;
Jiong-Shiun Hsu
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
beams (structures);
cantilevers;
copper;
gold;
internal stresses;
metallic thin films;
micromechanical devices;
nanostructured materials;
phase shifting interferometry;
silver;
Ag;
Au;
Cu;
MEMS;
compressive residual stress;
copper films;
four step phase-shifting method;
gold films;
mechanical properties;
nanoscale thin films;
paddle-like cantilever beam;
silver films;
size 50 nm to 250 nm;
tensile residual stress;
uniform plane strain distribution;
damping behavior of thin films for MEMS;
mechanical behavior of thin film;
16.
Frequency response of an accelerometer based on thermal convection
机译:
基于热对流的加速度计的频率响应
作者:
Giani A.
;
Combette P.
;
Crespy N.
;
Courteaud J.
;
Garraud A.
;
Pascal-Delannoy F.
;
Charlot B.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
accelerometers;
computational fluid dynamics;
convection;
micromachining;
accelerometer sensitivity;
frequency response;
micromachined accelerometer;
pressure variation;
thermal accelerometer;
thermal convection;
17.
Fabrication and characterization of a hybrid valve for microfluidic applications
机译:
用于微流体应用的混合阀的制造与表征
作者:
Simone G.
;
Perozziello G.
;
Sardella G.
;
Disegna I.
;
Tori S.
;
Manaresi N.
;
Medoro G.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
biological techniques;
bonding processes;
lab-on-a-chip;
microfluidics;
microvalves;
polymers;
PMMA;
TMSPM;
hybrid bonding process;
hybrid valve;
lab-on-chip application;
microfluidic applications;
microvalve;
organosilane;
poly (methyl methacrylate);
pressure 14 psi;
silicon based elastomers;
thermoplastic polymer;
18.
MEMS cantilever sensor for non-destructive metrology within high-aspect-ratio micro holes
机译:
MEMS悬臂传感器,用于高纵横比微孔内的非破坏性计量
作者:
Peiner E.
;
Doering L.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
buckling;
cantilevers;
elemental semiconductors;
fracture;
microsensors;
piezoresistive devices;
silicon;
tactile sensors;
Euler beam;
MEMS cantilever sensor;
Si;
axial loading;
buckling limit;
clamped-pinned beam;
dry-etched silicon microstructure;
high-aspect-ratio microholes;
linear strain-displacement characteristics;
noise measurements;
nondestructive metrology;
nonlinearity measurements;
piezoresistive microcantilever sensors;
size 3 mm;
tactile metrology;
19.
A clover shaped silicon piezoresistive microphone for miniaturiz Photoacoustic Gas sensors
机译:
三叶草形硅压阻麦克风,用于微型光声气体传感器
作者:
Grinde C.
;
Ohlckers P.
;
Mielnik M.
;
Jensen G.U.
;
Ferber A.
;
Wang D.T.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
elemental semiconductors;
gas sensors;
microphones;
piezoresistive devices;
silicon;
DRIE etch;
Si;
miniaturized photoacoustic gas sensors;
piezoresistive microphone;
20.
Field Emission displacement gauge for microelectomechanical resonators
机译:
用于微机电谐振器的场发射位移计
作者:
Charlot B.
;
Yamashita K.
;
Sun W.
;
Fujita H.
;
Toshiyoshi H.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
displacement measurement;
electrodes;
electrostatic actuators;
field emission;
finite element analysis;
microfabrication;
micromechanical resonators;
vibrations;
MEMS resonator design;
MEMS resonator fabrication;
MEMS resonator testing;
electrostatic actuation electrodes;
field emission current;
field emission displacement gauge;
finite element modeling;
in-plane vibrating structure;
microelectomechanical resonators;
resonator movements;
vibration monitoring;
21.
Silicon-based capacitive load cell for tensile load measurement
机译:
硅基电容式称重传感器,用于拉伸载荷测量
作者:
Yunho Kim
;
Hyungchul Kim
;
Junghoon Lee
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
capacitive sensors;
finite element analysis;
mechanical variables measurement;
micromechanical devices;
transducers;
SiJkJk;
capacitive load cell;
capacitive transducer;
finite element method;
integrated electronics packaging;
tensile load measurement;
22.
3D integration technologies
机译:
3D整合技术
作者:
Ramm P.
;
Klumpp A.
;
Weber J.
;
Taklo M.M.V.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
integrated circuit bonding;
integrated circuit reliability;
silicon;
thermomechanical treatment;
3D integration technology;
ICV-SLID process;
bonding;
e-CUBES automotive application demonstrator;
interconnect performance;
post backend-of-line TSV process;
reliability;
thermo-mechanical stress;
through-silicon-via technology;
23.
Silicon carbide as a material for biomedical microsystems
机译:
碳化硅作为生物医学微系统的材料
作者:
Zorman C.A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
bioMEMS;
biomedical imaging;
biomedical measurement;
biosensors;
micromachining;
microsensors;
semiconductor device packaging;
silicon;
wide band gap semiconductors;
SiC;
bio-filtering device;
bio-microdevice packaging;
biomedical microsystems;
biosensing device;
silicon carbide material;
24.
Towards design-for-testability for digital microfluidics
机译:
致力于数字微流体的可测试性设计
作者:
Tao Xu
;
Chakrabarty K.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
design for testability;
lab-on-a-chip;
microfluidics;
design-for-testability;
digital microfluidics;
microfluidic biochips;
target bioassay protocol;
25.
Analysis of material processing of sol-gel derived PZT to the performance of microaccelerometer applications
机译:
溶胶凝胶衍生的PZT的材料加工对微加速度计应用性能的分析
作者:
Jyh-Cheng Yu
;
Jun-Xiang Wu
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
annealing;
crystallisation;
fatigue;
sol-gel processing;
thermal stresses;
thin films;
LSMO oxide electrode;
PZT thin films;
crystallization resistance;
device performance;
fatigue resistance;
furnaces;
high temperature annealing;
interface quality;
lead zirconate titanate;
material processing;
microaccelerometer application;
piezoelectric characteristics;
poling condition;
rapid thermal annealing;
single-axial piezoelectric accelerometer;
sol-gel derived PZT;
spin-on precursor;
thermal stress;
26.
Design aspects of 3D integration of MEMS-based systems
机译:
基于MEMS的系统的3D集成的设计方面
作者:
Schneider P.
;
Reitz S.
;
Stolle J.
;
Martin R.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
finite element analysis;
micromechanical devices;
thermal management (packaging);
3D integration system design;
FEM model;
MEMS-based system;
PDE solvers;
abstract behavioral modeling;
thermal management;
27.
Design issues of BAW employment in 3D integrated sensor nodes
机译:
3D集成传感器节点中BAW使用的设计问题
作者:
Prainsack J.
;
Dielacher M.
;
Flatscher M.
;
Herndl T.
;
Matischek R.
;
Stolle J.
;
Weber W.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
bulk acoustic wave devices;
pressure sensors;
tyres;
3D integrated sensor nodes;
bulk acoustic wave based resonator;
direct tire pressure monitoring;
electrical efficiency;
temperature gradients;
through silicon vias;
28.
3D stacked MEMS and ICs in a miniaturized sensor node
机译:
微型传感器节点中的3D堆叠MEMS和IC
作者:
Taklo M.
;
Lietaer N.
;
Tofteberg H.
;
Seppanen T.
;
Ramm P.
;
Weber W.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
application specific integrated circuits;
microsensors;
3D integration;
3D stacked MEMS;
miniaturized sensor node;
planar integrated circuits;
stacking technology;
29.
Mechanical modelling of capacitive RF MEMS shunt switches
机译:
电容式RF MEMS并联开关的机械建模
作者:
Marcelli R.
;
Lucibello A.
;
De Angelis G.
;
Proietti E.
;
Comastri D.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
coplanar waveguide components;
finite element analysis;
microswitches;
microwave switches;
semiconductor device models;
FEM simulations;
MATHCAD program;
capacitive RF MEMS shunt switch;
coplanar waveguide;
mechanical modelling;
unidimensional equation;
30.
Thermal management integration for microfluidics applications
机译:
微流控应用的热管理集成
作者:
Camps T.
;
Marty B.
;
Tasselli J.
;
Marty A.
;
Lagrange D.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
microfluidics;
semiconductor diodes;
temperature measurement;
temperature sensors;
thermal management (packaging);
MEMS applications;
integrated thermal sensors;
microchannels;
polysilicon diodes;
temperature variation measurement;
thermal management integration;
thermal sensitivities;
thermal sources;
31.
Capacitive vibration energy harvesting with resonance tuning
机译:
通过共振调谐来收集电容振动能量
作者:
De Pasquale G.
;
Brusa E.
;
Soma A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
capacitive sensors;
circuit resonance;
energy harvesting;
micromechanical devices;
vibrations;
wireless sensor networks;
MEMS resonance frequency;
bimorph piezoelectric transducers;
capacitive microscavenger;
capacitive vibration energy harvesting;
electrical energy scavenger configuration;
electromechanical conversion;
electrostatic benders;
electrostatic coupling;
energy harvesting strategy;
exciting vibration;
in-plane motion;
industrial application;
mechanical vibration;
mechatronic design;
microsystems;
paramet;
32.
Investigation of key technologies for System-in-Package integration of inertial MEMS
机译:
惯性MEMS系统集成的关键技术研究
作者:
Marenco N.
;
Reinert W.
;
Warnat S.
;
Lange P.
;
Gruenzig S.
;
Allegato G.
;
Hillmann G.
;
Kostner H.
;
Gal W.
;
Guadagnuolo S.
;
Conte A.
;
Malecki K.
;
Friedel K.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
microsensors;
moulding;
system-in-package;
fine patterning;
full-wafer transfer molding;
functional devices;
gyroscopes:;
hermetic chip-to-wafer bonding;
inertial sensor MEMS packaging;
resonant devices;
system-in-package integration;
vacuum packaging;
wafer-to-wafer bonding;
33.
Replica molding of polymeric components for microsystems
机译:
用于微系统的聚合物组件的复制模制
作者:
Obreja P.
;
Cristea D.
;
Dinescu A.
;
Gavrila R.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
microfabrication;
micromechanical devices;
moulding;
nanofabrication;
polymer films;
replica techniques;
epoxy resin;
microsystems;
polydimethylsiloxane;
polymer coating;
polymeric components;
polymethylmethacrylate;
replica molding;
34.
Effect of dimensional and material property uncertainties on thermal microactuator response using probabilistic methods
机译:
尺寸和材料性能不确定性对热微执行器响应的影响
作者:
Safaie B.K.
;
Shamshirsaz M.
;
Bahrami M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
Monte Carlo methods;
linearisation techniques;
microactuators;
probability;
Box-Behnken design;
Monte Carlo simulation;
direct linearization method;
electrothermal microactuator;
probabilistic method;
second-order metamodel;
tip deflection;
uncertainty analysis;
35.
Mean stress effect on mechanical fatigue of MEMS under alternate loads
机译:
交替负载下平均应力对MEMS机械疲劳的影响
作者:
De Pasquale G.
;
Ballestra A.
;
Soma A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
electrostatic actuators;
fatigue;
finite element analysis;
gold;
micromechanical devices;
stress effects;
tensile testing;
FEM models;
Goodman-Smith diagram;
MEMS;
device design;
electrostatic actuation;
gold components;
mean stress effect;
mechanical fatigue;
stress conditions;
tensile variable load test;
36.
Reliability aspects of mechanical interlocking bond interfaces with nanostructured silicon grass
机译:
机械联锁键界面与纳米结构硅草的可靠性方面
作者:
Stubenrauch M.
;
Schwandt M.
;
Hecht S.
;
Hoffmann M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
adhesion;
adhesives;
elemental semiconductors;
interface phenomena;
nanostructured materials;
silicon;
surface structure;
Si;
Velcro strap;
black silicon;
mechanical bond interface;
mechanical interlocking bond interfaces;
nanostructured silicon grass;
pulsating load;
37.
Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
机译:
开发用于集成锂微电池的近乎密封的硅/玻璃腔
作者:
Hahn R.
;
Marquardt K.
;
Blechert M.
;
Topper M.
;
Wilke M.
;
Semionyk P.
;
Reichl H.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
curing;
electrical contacts;
electronics packaging;
elemental semiconductors;
hermetic seals;
lithium;
polymers;
secondary cells;
silicon;
3D chip stacks;
Li;
MEMS devices;
Si;
UV curable epoxy sealing;
bonding parameters;
chip-sized lithium secondary microbatteries;
contact pads;
electrical contact;
electrical tests;
energy density;
glass substrate;
hermetic packaging;
hermetic silicon-glass cavity;
integrated lithium microbattery;
shear force;
silicon chips;
size 200 mum;
wafer level processing;
water permeation;
38.
Heat-based recovery mechanism to counteract stiction of RF-MEMS switches
机译:
基于热量的恢复机制可抵消RF-MEMS开关的粘滞
作者:
Repchankova A.
;
Iannacci J.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
finite element analysis;
membranes;
microswitches;
microwave switches;
stiction;
thermal stresses;
FEM-simulation;
RF-MEMS switches;
heat-based recovery mechanism;
high resistivity polysilicon serpentine;
microelectromechanical system;
radio frequency applications;
stuck membrane;
suspended switch;
thermal stress;
RF-MEMS switch;
self-recovery mechanism;
39.
RF MEMS front-end resonator, filters, varactors and a switch using a CMOS-MEMS process
机译:
使用CMOS-MEMS工艺的RF MEMS前端谐振器,滤波器,变容二极管和开关
作者:
Ramstad J.E.
;
Kjelgaard K.G.
;
Nordboe B.E.
;
Soeraasen O.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
CMOS integrated circuits;
etching;
micromechanical resonators;
microswitches;
resonator filters;
varactors;
CMOS-MEMS process;
CoverntorWare FEM software;
RF MEMS front-end resonator;
electrothermally operated varactors;
multilayer structures;
post-CMOS release-etching step;
resonating filters;
switching;
transceivers;
40.
Heat dissipation performance for the application of light emitting diode
机译:
发光二极管的散热性能
作者:
Ming-Tzer Lin
;
Chao-Chi Chang
;
Ray-Hua Horng
;
De-Shau Huang
;
Chi-Ming Lai
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
cooling;
finite element analysis;
heat pipes;
heat sinks;
light emitting diodes;
thermal diffusion;
3D finite element method;
LED packaging materials;
heat dissipation;
heat sink;
heat transfer;
layers assembly;
power 0.75 W;
power 1 W;
power 3 W;
temperature 50 degC;
thermal diffusion efficiency;
Heat Dissipate of LED;
Heat Pipe for LED;
41.
Design and simulation of lightweight mirror for space application
机译:
轻型太空镜的设计与仿真
作者:
Lin Y.C.
;
Lee L.J.
;
Chang S.T.
;
Huang T.M.
;
Hwang C.H.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
Zernike polynomials;
aerospace materials;
mirrors;
remote sensing;
Zernike polynomial fitting;
gravity effects;
high-resolution remote sensing instrument;
lightweight mirror;
mirror surface deformation;
natural frequency;
regular geometry;
space application;
42.
Offset compensation of integrated thermal flow sensors by means of split heater microstructures
机译:
通过分体式加热器微结构对集成热流量传感器的失调补偿
作者:
Bruschi P.
;
Dei M.
;
Piotto M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
CMOS integrated circuits;
compensation;
flow sensors;
probes;
temperature sensors;
CMOS process;
integrated thermal flow sensor;
offset compensation;
post-processing technique;
split heater microstructure;
temperature drift;
temperature probe design;
43.
U-shaped fiber optics fabricated with a femtosecond laser and integrated into a localized plasmon resonance biosensor
机译:
用飞秒激光制造并集成到局部等离振子共振生物传感器中的U型光纤
作者:
Wei-Te Wu
;
Chun-Ping Jen
;
Tzu-Chien Tsao
;
Wei-Chih Shen
;
Chung-Wei Cheng
;
Chien-Hsing Chen
;
Jaw-Luen Tang
;
Wan-Yun Li
;
Lai-Kwan Chau
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
annealing;
atomic force microscopy;
biosensors;
colloids;
fibre optic sensors;
gold;
integrated optics;
optical fibre fabrication;
polymers;
self-assembly;
surface plasmon resonance;
surface roughness;
AFM;
Au;
FO-LPR;
U-shaped fiber optic fabrication;
femtosecond laser micromachining system;
fiber-optic localized plasmon resonance biosensor;
polymer jacket layer;
self-assembled gold colloids;
transmission power interrogation;
44.
Fabrication of internal driven micro centrifugal force pump based on synchronous micro motors with polymer magnet rotors
机译:
基于带有聚合物磁体转子的同步微型电动机的内驱动微型离心力泵的制造
作者:
Waldschik A.
;
Buttgenbach S.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
electroplating;
magnets;
microassembling;
microfabrication;
micromotors;
micropumps;
rotors;
ultraviolet lithography;
UV-depth lithography;
electromagnetic drive unit;
gear pumps;
impeller pumps;
microcentrifugal force pump;
microfabrication technology;
microrotary pumps;
polymer magnet rotors;
polymer magnets;
spiral pumps;
synchronous micromotors;
toothed rotor;
45.
“Design of CWDM multiplexers based on series coupled ring resonators: Analysis and potential of MEMS technologies“
机译:
“基于串联耦合环形谐振器的CWDM多路复用器的设计:MEMS技术的分析和潜力”
作者:
Malak M.
;
Morshed A.H.
;
Hassan K.
;
Bourouina T.
;
Anis H.
;
Khalil D.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
micro-optomechanical devices;
micromechanical resonators;
multiplexing equipment;
optical crosstalk;
optical design techniques;
optical fibre communication;
optical fibre losses;
optical resonators;
optical tuning;
silicon-on-insulator;
wavelength division multiplexing;
CWDM multiplexer design;
MEMS tunability;
SOI technology;
crosstalk level reduction;
insertion loss;
loss 4 dB;
passband ripples;
series coupled ring resonators;
46.
The development of the high performance parallel-stacked RF spiral inductor
机译:
高性能并联射频螺旋电感器的开发
作者:
Jair D.K.
;
Hsieh M.C.
;
Lin C.S.
;
Chen S.M.
;
Chen Y.H.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
CMOS integrated circuits;
Q-factor;
finite element analysis;
inductors;
mechanical strength;
air-gap structure;
electromagnetic solver SONNET;
finite element program ANSYS;
high Q-on-chip spiral inductors;
parallel-stacked RF spiral inductor;
size 0.18 mum;
size 15 mum;
submicron CMOS process;
47.
Silicon microfluidic channels and microstructures in single photolithography step
机译:
单个光刻步骤中的硅微流体通道和微结构
作者:
Pal P.
;
Sato K.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
CMOS integrated circuits;
elemental semiconductors;
etching;
microfabrication;
microfluidics;
organic compounds;
oxidation;
photolithography;
silicon;
silicon compounds;
surfactants;
wafer bonding;
(100)-silicon wafers;
Si-Sisub3/subNsub4/sub;
complementary metal oxide semiconductor process;
intermediate layer;
local oxidation;
microstructures;
nonionic surfactant Triton-X-100;
photolithography step;
silicon microfluidic channels;
silicon nitride;
tetramethyl ammonium hydroxide solutions;
wet anisotropic etchi;
48.
Effects of gap error on the capacitive micro accelerometer
机译:
间隙误差对电容式微加速度计的影响
作者:
Wu Zhou
;
Xiao-Ping He
;
Wei Su
;
Bai-Lin Li
;
Li-Li Chen
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
accelerometers;
capacitive sensors;
capacitors;
micromechanical devices;
MEMS structure design;
capacitive microaccelerometer;
dimension uncertainty;
force balance equation;
gap error effects;
structure error;
structure parameter;
unsymmetrical gaps;
49.
Through-silicon via technologies for interconnects in RF MEMS
机译:
硅直通技术,用于RF MEMS互连
作者:
Jian Zhu
;
Yuanwei Yu
;
Fang Hou
;
Chen Chen
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
band-pass filters;
elemental semiconductors;
integrated circuit interconnections;
micromachining;
micromechanical devices;
microwave filters;
millimetre wave integrated circuits;
silicon;
3D millimeter-wave integrated circuits;
Ku band miniature bandpass filter;
RF MEMS;
Si;
grounding connections;
inductively coupled plasma process;
loss 1.9 dB;
silicon micromachined vertical transition;
through-silicon via technologies;
50.
Gas damping effect on thin vibrating gold plates: Experiments and modeling
机译:
减振对薄金箔的气体阻尼作用:实验和模型
作者:
De Pasquale G.
;
Veijola T.
;
Soma A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
damping;
electroplating;
gold;
micromachining;
micromechanical devices;
vibrations;
Au;
damping coefficient;
fundamental oscillation mode;
gas damping effect;
half power method;
micromachining technique;
squeeze film damping;
vibrating plate;
51.
NanoElectroMechanicalSystems (NEMS): The challenge of combining microsystems and nanotechnology for new market opportunities
机译:
NanoElectroMechanicalSystems(NEMS):将微系统和纳米技术相结合以寻求新的市场机遇的挑战
作者:
Brillouet M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
energy consumption;
integrated circuits;
micromechanical devices;
nanoelectromechanical devices;
MEMS;
NEMS;
market opportunities;
microelectromechanical systems;
microelectronic industry;
microsystems;
nanoelectromechanical systems;
nanotechnology;
52.
Design and development of a latching micro optical switch
机译:
闩锁微光开关的设计与开发
作者:
Garcia E.J.
;
Polosky M.A.
;
Swiler T.P.
;
Shul R.J.
;
Luck D.L.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
flip-flops;
micro-optomechanical devices;
microswitches;
optical fibres;
optical switches;
silicon-on-insulator;
sputter etching;
SOI;
Si;
deep reactive ion etching;
latching;
microoptical switch;
optical fibers;
silicon-on-insulator material;
thermal actuation;
53.
Temperature dependent fracture toughness of glass frit bonding layers
机译:
玻璃粉粘结层的温度相关断裂韧性
作者:
Notzold K.
;
Dresbach C.
;
Graf J.
;
Bottge B.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
adhesive bonding;
cracks;
finite element analysis;
fracture toughness;
glass;
hermetic seals;
interface phenomena;
internal stresses;
SiOsub2/sub;
finite element simulations;
glass frit bonding layers;
hermetical encapsulation;
interfacial crack;
microsensors;
residual stresses;
shear loading;
temperature dependent fracture toughness;
tensile loading;
wafer bonding process;
54.
Ambient hot embossing of polycarbonate, poly-methyl methacrylate and cyclic olefin copolymer for microfluidic applications
机译:
用于微流体应用的聚碳酸酯,聚甲基丙烯酸甲酯和环烯烃共聚物的环境热压花
作者:
Toh A.G.G.
;
Wang Z.F.
;
Wang Z.P.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
embossing;
lab-on-a-chip;
microfluidics;
polymers;
COC substrate;
PC substrates;
PMMA substrate;
Taguchi analysis;
ambient hot embossing;
cyclic olefin copolymer;
lab-on-chip application;
microfluidic applications;
mold-to-substrate feature fidelity;
poly-methyl methacrylate;
polycarbonate;
polymer dynamic viscosity;
polymer viscoelasticity;
55.
Reliability of RF MEMS switches due to charging effects and their circuital modelling
机译:
由于充电效应及其电路建模,RF MEMS开关的可靠性
作者:
Marcelli R.
;
Bartolucci G.
;
Papaioannu G.
;
De Angelis G.
;
Lucibello A.
;
Proietti E.
;
Margesin B.
;
Giacomozzi F.
;
Deborgies F.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
dielectric devices;
equivalent circuits;
microswitches;
microwave switches;
semiconductor device models;
semiconductor device reliability;
RF MEMS switches;
charging effects;
dielectrics;
equivalent circuit model;
reliability;
56.
Rapid thermal bonding of polymer microfluidic devices assisted by corona discharge
机译:
电晕放电辅助聚合物微流体装置的快速热键合
作者:
Ng S.H.
;
Wu Y.X.
;
Wang Z.F.
;
Wang Z.P.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
contact angle;
corona;
diffusion bonding;
embossing;
microfluidics;
plasma materials processing;
polymers;
rapid thermal processing;
surface treatment;
PMMA wafers;
bonding pressure;
bonding strength;
corona discharge surface treatment;
diffusion mechanism;
hot embossing;
hydrophilic surface;
internal gauge pressure;
microchannel;
microfluidic chips;
optimized bonding;
polymer microfluidic device;
polymethyl methacrylate wafers;
pressure 3.1 MPa;
pressure 7 bar;
rapid thermal bonding;
size 100 mm;
temperature 108 degC;
th;
57.
3D field focusing and defocusing geometries for cell trapping on a chip
机译:
用于芯片上细胞捕获的3D场聚焦和散焦几何
作者:
Francais O.
;
Mottet G.
;
Ayina A.
;
Le Pioufle B.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
bioMEMS;
electromagnetic fields;
electrophoresis;
3D field focusing;
cell handling operations;
cell trapping;
defocusing geometries;
dielectrophoresis;
electromagnetic field;
Cells trapping;
Dielectrophoresis Forces;
Microfluidic;
58.
Digital concentration gradient generators on a microfluidic chip
机译:
微流控芯片上的数字浓度梯度发生器
作者:
Francais O.
;
Mahe B.
;
Dimitracopoulos A.
;
Julien M.C.
;
Lefevre J.P.
;
Le Pioufle B.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
bioMEMS;
diffusion;
microfluidics;
1D chamber array;
2D chamber array;
Fick's Law;
Reynolds number;
chemical diffusion;
digital concentration gradient generator;
microfluidic chip;
miniaturisation;
pharmacology;
2D gradient;
microarray;
microfluidic;
59.
Compressible squeeze-films in vibrating MEMS structures at high frequencies
机译:
高频振动MEMS结构中的可压缩挤压膜
作者:
Veijola T.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
Knudsen flow;
compressibility;
damping;
finite element analysis;
micromechanical devices;
rarefied fluid dynamics;
1-dimensional solution;
FEM simulations;
Knudsen number;
Reynolds equation;
accelerometer structures;
compressible force;
compressible squeeze-films;
damper borders;
damper surface geometry;
nonidealistic border conditions;
nonzero-pressure boundary condition;
rarefied gas;
surface dimension;
vibrating MEMS structures;
60.
Optimal design analysis of electrothermal microactuators
机译:
电热微致动器的优化设计分析
作者:
Karbasi S.M.
;
Shamshirsaz M.
;
Naraghi M.
;
Maroufi M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
genetic algorithms;
microactuators;
thermoelectric devices;
electrothermal microactuators;
genetic algorithm;
optimal design analysis;
61.
Electromechanical and adhesion issues in contact-mode MEMS devices
机译:
接触式MEMS器件中的机电和粘合问题
作者:
Komvopoulos K.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
adhesion;
electromechanical effects;
mechanical contact;
micromechanical devices;
reliability;
seizure;
silicon;
surface topography;
wear;
MEMS devices;
breakdown;
contact interface;
contact-mode microdevices;
electrical contact;
electromechanical properties;
impact;
oxide layer stressing;
polycrystalline silicon;
sliding contact;
62.
Design optimization and stamper fabrication of light guiding plates using silicon based micro-features
机译:
使用硅基微特征的导光板的设计优化和压模制造
作者:
Jyh-Cheng Yu
;
Pei-Kai Hsu
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
electroforming;
etching;
light emitting diodes;
micromechanical devices;
moulding;
optimisation;
silicon-on-insulator;
LED edge-lit LGP;
LED light source;
TracePro;
anisotropic wet etching;
brightness;
design optimization;
diffusive sheets;
fuzzy optimization;
light guiding plates;
luminance performance;
molding stamper;
optical software;
prisms;
silicon based microfeatures;
silicon-on-insulator wafers;
size 3.5 inch;
spacing modulation amplitude;
stamper fabrication;
trapezoidal grooves;
63.
Role of nonlinearity and chaos on RF-MEMS structural dynamics
机译:
非线性和混沌在RF-MEMS结构动力学中的作用
作者:
Brusa E.
;
Munteanu M.G.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
microactuators;
RF-MEMS structural dynamics;
amplitude jumping effects;
electromechanical nonlinearity;
fatigue prediction;
frequency shifting effects;
non-symmetric microactuators;
static behaviour;
FEM coupled-field analysis;
RF-MEMS;
chaos;
geometrical nonlinearity;
64.
Design and characterization of temperature-robust piezoresistive micro-pressure sensor with double-Wheatstone-bridge structure
机译:
双惠斯通电桥结构的稳健压阻微压传感器的设计与表征
作者:
Hsun-Heng Tsai
;
Chi-Chang Hsieh
;
Cheng-Wen Fan
;
Young-Chang Chen
;
Wei-Te Wu
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
finite element analysis;
microfabrication;
microsensors;
piezoresistive devices;
pressure sensors;
resistors;
silicon;
ANSYS simulations;
Si;
double-Wheatstone-bridge structure;
microelectromechanical systems;
piezoresistive patches;
piezoresistors;
polysilicon membrane;
silicon-based micropressure sensor;
temperature -10 degC to 75 degC;
temperature-robust piezoresistive micropressure sensor;
pressure sensor;
temperature compensation;
65.
Properties of M-AFM probe affected by nanostructural metal coatings
机译:
纳米结构金属涂层对M-AFM探针性能的影响
作者:
Hosoi A.
;
Hamada M.
;
Fujimoto A.
;
Ju Y.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
atomic force microscopy;
cantilevers;
coatings;
electron probes;
evaporation;
focused ion beam technology;
microwave devices;
sputtering;
surface topography;
waveguides;
AFM topography;
GaAs;
atomic force microscope probe;
cantilever;
electron beam evaporation;
focused ion beam fabrication;
microwave probe;
microwave signal propagation;
nanostructural metal coatings;
66.
Electro-thermal modeling of large-surface OLED
机译:
大表面OLED的电热建模
作者:
Kollar E.
;
Zolomy I.
;
Poppe A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
organic light emitting diodes;
I-V characteristics;
OLED;
circuit-level simulation;
electro-thermal modeling;
forward bias;
reverse bias;
temperature 5 degC to 50 degC;
67.
Complex optical microstructure fabricated using inclined immersion lithography
机译:
使用倾斜浸没光刻技术制造的复杂光学微结构
作者:
Chang T.-Y.
;
Yang H.
;
Wu C.-H.
;
Chao C.-K.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
brightness;
immersion lithography;
micro-optics;
optical arrays;
optical fabrication;
optical films;
refractive index;
transparency;
Snell law;
UV lithography;
backlighting module;
complex optical microstructure;
inclined immersion lithography;
light deflection;
liquid crystal display;
microridge array film;
optical brightness;
optical simulation;
optically transparent material;
refraction index;
substrate inclination;
transmission medium;
68.
Identification of mechanical defects in MEMS using dynamic measurements for application in the production monitoring
机译:
使用动态测量识别MEMS中的机械缺陷,以用于生产监控
作者:
Gerbach R.
;
Ebert M.
;
Brokmann G.
;
Hein T.
;
Bagdahn J.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
Doppler measurement;
electrical faults;
elemental semiconductors;
laser velocimetry;
membranes;
micromechanical devices;
nondestructive testing;
silicon;
Si;
artificial faults;
laser-Doppler vibrometry;
mechanical defects;
microelectro-mechanical systems;
production monitoring;
resonant frequency;
silicon membrane structures;
69.
Novel design of a RF-MEMS tuneable capacitor based on electrostatically induced torsion
机译:
基于静电感应扭转的RF-MEMS可调电容器的新颖设计
作者:
Savadkoohi P.T.
;
Colpo S.
;
Margesin B.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
capacitors;
electromechanical effects;
electrostatic devices;
microswitches;
microwave switches;
RF switches;
RF-MEMS tuneable capacitor design;
complex RF circuits;
electromechanical design;
electrostatically induced torsion;
in-plane force;
microelectromechanical system;
parallel plate capacitor;
partially overlapping plates;
Electeromechanics;
RF MEMS;
Varactors;
70.
MEMS three-axis accelerometer: Design, fabrication and application of measuring heart wall motion
机译:
MEMS三轴加速度计:测量心脏壁运动的设计,制造和应用
作者:
Lowrie C.
;
Desmulliez M.P.Y.
;
Hoff L.
;
Elle O.J.
;
Fosse E.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
accelerometers;
bioMEMS;
electric sensing devices;
piezoresistive devices;
prosthetics;
MEMS three-axis accelerometer;
SOI micromachined three-axis accelerometer;
cardiac ischemia;
coronary artery bypass surgery;
heart wall motion;
implant;
piezoresistive effect;
post-surgical risks;
sensor;
71.
A reliability test on PBGA packaging through piezoresistive stress sensor
机译:
通过压阻应力传感器对PBGA包装进行可靠性测试
作者:
Liu C.H.
;
Chung H.
;
Yang D.W.
;
Tseng K.F.
;
Lwo B.J.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
Weibull distribution;
ball grid arrays;
circuit reliability;
electric sensing devices;
micromechanical devices;
piezoresistive devices;
plastic packaging;
swelling;
MEMS-MOEMS packaging;
PBGA packaging;
Weibull reliability;
hygroscopic swelling mismatch stress;
microelectronic packaging technology;
piezoresistive stress sensor;
plastic ball-grid-array;
reliability test;
stress monitoring methodology;
72.
Effects of channel surface finish on blood flow in microfluidic devices
机译:
通道表面光洁度对微流控设备中血流的影响
作者:
Prentner S.
;
Allen D.M.
;
Larcombe L.
;
Marson S.
;
Jenkins K.
;
Saumer M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
haemodynamics;
microchannel flow;
polymers;
surface finishing;
surface roughness;
viscosity;
blood flow;
channel surface finish;
horse blood;
microfluidic devices;
polycarbonate;
pressure 200 Pa to 5000 Pa;
size 10 mm;
size 100 mum;
size 50 mum;
73.
Investigations on micro-displacement based techniques for resonance frequency control of miniature monolithic resonators dedicated to Magnetic Resonance Imaging
机译:
基于微位移的磁共振成像专用单片谐振器谐振频率控制技术研究
作者:
Guisiano J.-C.
;
Lambert S.
;
Megherbi S.
;
Darrasse L.
;
Ginefri J.-C.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
magnetic resonance imaging;
micromechanical resonators;
transmission lines;
tuning;
Larmor frequency;
coil winding;
decoupling technique;
dielectric coupling;
microdevices;
microdisplacement-based techniques;
miniature monolithic multiturn transmission line resonator;
resonance frequency control;
spatial resolution images;
tuning technique;
74.
Evaluation of a microfluidic sensor fabricated on polymeric material
机译:
在聚合物材料上制造的微流体传感器的评估
作者:
Petropoulos A.
;
Kontakis K.
;
Kaltsas G.
;
Gogolides E.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
calorimetry;
fluidic devices;
microchannel flow;
microsensors;
polymers;
PCB;
microchannel cross-section;
microfluidic sensor;
polymeric material;
polymeric microchannel;
sensitivity;
thermal isolation;
75.
3D FEM simulations of perforated MEMS gas dampers
机译:
穿孔MEMS气体阻尼器的3D FEM仿真
作者:
Veijola T.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
Navier-Stokes equations;
boundary layers;
damping;
finite element analysis;
flow simulation;
microfluidics;
slip flow;
3D FEM simulations;
3D Navier-Stokes FEM solver;
damping forces;
incompressible flow;
inertialess flow;
micromechanical devices;
perforated MEMS gas dampers;
rarefied gas flow;
slip velocity boundary conditions;
translational motion;
76.
A MEMS-based multi-sensor system for attitude determination
机译:
用于姿态确定的基于MEMS的多传感器系统
作者:
Alandry B.
;
Dumas N.
;
Latorre L.
;
Mailly F.
;
Nouet P.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
attitude measurement;
etching;
microsensors;
piezoresistive devices;
resistors;
sensor fusion;
3D orientation determination;
MEMS-based multisensor system;
TMAH front side wet etching;
attitude determination;
electronic architecture;
piezoresistor design;
77.
Wireless control of microchip capillary electrophoresis with a mobile platform
机译:
通过移动平台无线控制微芯片毛细管电泳
作者:
Valdez D.C.
;
Berg C.
;
Bergeron P.
;
Mora M.F.
;
Garcia C.D.
;
Ayon A.A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
Global Positioning System;
decoding;
digital-analogue conversion;
electrochemical sensors;
electrophoresis;
field programmable gate arrays;
microcontrollers;
microprocessor chips;
micropumps;
mobile communication;
3-channel high-voltage power supply;
GPS sensor;
chemical analysis;
data acquisition;
digital system;
digital-to-analog converters;
embedded processor;
field programmable gate array;
interfacing electrochemical detector;
interfacing hardware;
microchip capillary electrophoresis;
micropump;
mobile platform;
m;
78.
Patterning of porous alumina for integrated humidity sensors
机译:
用于集成湿度传感器的多孔氧化铝的图案
作者:
Juhasz L.
;
Olah L.
;
Mizsei J.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
alumina;
anodisation;
humidity sensors;
nanopatterning;
photoresists;
porous materials;
thin films;
Alsub2/subOsub3/sub;
anodization;
barrier layer;
electrical connection;
integrated humidity sensors;
photolithography;
photoresist;
porous alumina;
thin film porous alumina sensing layer;
wafer surface;
wet etching;
79.
Lumped modeling of a novel RF MEMS double-disk resonator system
机译:
新型RF MEMS双盘谐振器系统的总模型
作者:
Grinde C.
;
Nygaard K.H.
;
Due-Hansen J.
;
Fjeldly T.A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
equivalent circuits;
finite element analysis;
lumped parameter networks;
micromechanical resonators;
RF MEMS double-disk resonator system;
frequency separation;
lumped modeling;
80.
What happens turning a 250µm thin piezo-stack sideways? An experimental and analytical approach to one-side-actuated piezoelectric micro drives, regarding electrode layouts and directions of deflection
机译:
将250µm的薄压电堆栈横向转动会发生什么?关于电极驱动和偏转方向的单侧压电微型驱动器的实验和分析方法
作者:
Zahringer S.
;
Schwesinger N.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
electrodes;
membranes;
micromechanical devices;
piezoelectric actuators;
bimorph structures;
electrode layouts;
forward bias;
one-side-actuated piezoelectric membrane;
one-side-actuated piezoelectric membranes;
one-side-actuated piezoelectric micro drives;
piezoelectric substrate functions;
upward deflection;
81.
MEMS multi-physics approach design and fabrication for electrical metrology applications
机译:
电气计量应用的MEMS多物理场方法设计和制造
作者:
Blard F.
;
Bounouh A.
;
Camon H.
;
Belieres D.
;
Ziade F.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
finite element analysis;
microfabrication;
micromachining;
micromechanical devices;
readout electronics;
silicon-on-insulator;
AC voltage references;
Comsol finite elements software;
Coventor finite elements software;
MEMS;
electrical metrology applications;
high-precision instrumentation;
mechanical-electrical coupling;
read-out electronics;
silicon-on-insulator surface micromachining process;
voltage 5 V to 100 V;
82.
The active bridge: An alternative to the Wheatstone bridge for efficient conditioning of resistive MEMS sensors
机译:
有源桥:惠斯通电桥的替代品,可有效调节电阻MEMS传感器
作者:
Boujamaa E.-M.
;
Dumas N.
;
Latorre L.
;
Mailly F.
;
Nouet P.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
bridge circuits;
microsensors;
power consumption;
readout electronics;
AMS technology;
Wheatstone bridge;
active bridge;
electrical simulations;
power consumption reduction;
read-out interface;
resistive MEMS sensors;
size 0.35 mum;
83.
Modeling of an electrostatic torsional micromirror for laser projection system
机译:
激光投影系统静电扭转微镜的建模
作者:
Marchetti E.
;
Volpi E.
;
Battini F.
;
Bacciarelli L.
;
Fanucci L.
;
De Marinis M.
;
Hofmann U.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
integrated optoelectronics;
micro-optomechanical devices;
micromirrors;
2D torsional scanning micromirrors;
Simulinktrade model;
electrostatic torsional micromirror;
laser projection system;
microopto-electro-mechanical-system;
84.
Fabrication of patterned array of alumina-metal coaxial nanorods
机译:
氧化铝-金属同轴纳米棒的图案阵列的制备
作者:
Chi-Wei Hsu
;
Gou-Jen Wang
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
alumina;
electrodeposition;
etching;
evaporation;
nanofabrication;
nanostructured materials;
nickel;
photolithography;
Alsub2/subOsub3/sub-Ni;
alumina-metal coaxial nanorods;
anodic aluminum oxide membrane;
barrier-layer thickness;
patterned array;
phosphoric acid etching;
85.
Hot punching on an 8 inch substrate as an alternative technology to produced holes on a large scale
机译:
在8英寸基板上进行热冲压,作为大规模生产孔的替代技术
作者:
Rapp B.E.
;
Schneider M.
;
Worgull M.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
embossing;
microfluidics;
micromachining;
polymers;
punching;
holes;
hot embossing;
hot punching;
microfluidic components;
polymer substrate;
size 8 inch;
86.
New fabrication method of micro-pyramidal vertical probe array for probe cards
机译:
探针卡微金字塔垂直探针阵列的新制造方法
作者:
Tsung-Hung Lin
;
Hsiharng Yang
;
Ching-Kong Chao
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
electroforming;
micro-optomechanical devices;
probes;
refractive index;
ultraviolet lithography;
Snell law;
contact lithography;
light path deflection;
micro-pyramidal vertical probe array;
probe cards;
workpiece inclination;
87.
Characterization and modeling of 3-D vibration modes of a micromachined U-shaped cantilever
机译:
微加工U型悬臂梁的3-D振动模式的表征和建模
作者:
Dennis J.O.
;
Talha W.A.
;
Hamid N.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
CMOS integrated circuits;
aluminium;
cantilevers;
micromachining;
vibrational modes;
3-D vector magnetic field measurements;
3-D vibration modes;
Al;
CMOS fabrication technology;
CoventorWare simulation environment;
Lorentz force;
bulk micromachining;
micromachined U-shaped cantilever device;
88.
High permittivity ferroelectric actuators for radar applications
机译:
高介电常数铁电致动器,用于雷达应用
作者:
Ficklen J.
;
Weaver J.
;
Chen C.
;
Ayon A.A.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
barium compounds;
cantilevers;
ferroelectric thin films;
microactuators;
microfabrication;
micromechanical devices;
permittivity;
radar applications;
BaTiOsub3/sub;
MEMS structure;
RF applications;
RF transmitted power;
barium titanate;
capacitance ratio;
high-permittivity ferroelectric actuators;
thermal bimorph actuators;
thermal cantilever actuator;
89.
Design and Optimisation of a Microgripper: Demonstration of Biomedical Applications Using the Manipulation of Oocytes
机译:
设计和优化的微抓手:卵母细胞操纵生物医学应用的演示。
作者:
Solano B.P.
;
Gallant A.J.
;
Wood D.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
bioMEMS;
cellular biophysics;
clamps;
grippers;
micromanipulators;
bidirectional electrothermal microgripper;
biological fluid;
biological micromanipulation station;
biomedical applications;
clamping mechanism;
electrofusion;
mice oocytes;
90.
Active components embedded into organic boards - Accelerated design by means of finite element simulation and micro deformation measurements
机译:
有源元件嵌入有机板中-通过有限元模拟和微变形测量来加速设计
作者:
Sommer J.-P.
;
Michel B.
;
Noack E.
;
Seiler B.
会议名称:
《Design, Test, Integration amp; Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09》
|
2009年
关键词:
deformation;
finite element analysis;
integrated circuit interconnections;
integrated circuit reliability;
printed circuit design;
thermomechanical treatment;
accelerated design;
active components;
advanced electronics;
electrical properties;
microdeformation measurements;
microtechnology;
organic boards;
passive components;
printed circuit boards;
reliability;
thermo-mechanical design;
very short interconnects;
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