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IEEE International Symposium for Design and Technology in Electronic Packaging
IEEE International Symposium for Design and Technology in Electronic Packaging
召开年:
2014
召开地:
Bucharest(RO)
出版时间:
-
会议文集:
-
会议论文
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1.
Genetic algorithm for depth images in RGB-D cameras
机译:
RGB-D相机中深度图像的遗传算法
作者:
Danciu G.
;
Szekely I.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cameras;
genetic algorithms;
image segmentation;
unsupervised learning;
RGB-D cameras;
depth images;
genetic algorithm;
gray level ranges;
ground truth;
homogeneity optimization;
red-green-blue-depth cameras;
unsupervised image segmentation;
Algorithm design and analysis;
Cameras;
Cost function;
Electronics packaging;
Genetic algorithms;
Histograms;
Image segmentation;
RGB-D camera;
genetic algorithm;
segmentation;
2.
Automated platform for characterization of RFID reader antennas
机译:
用于表征RFID阅读器天线的自动化平台
作者:
Vuza D.T.
;
Vladescu M.
;
Pascu L.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
antennas;
radiofrequency identification;
transponders;
RFID reader antenna characterization;
automated platform;
transponders;
Antenna measurements;
Antennas;
Baseband;
Correlation;
Electronics packaging;
Radiofrequency identification;
Transponders;
RFID;
automated characterization;
reader antenna;
scanner;
stepper motor;
3.
Modelling, simulation and testing of an autonomous embedded system supplied by a photovoltaic panel
机译:
光伏面板提供的自主嵌入式系统的建模,仿真和测试
作者:
Drumea A.
;
Dobre R.A.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
embedded systems;
energy harvesting;
solar cells;
supercapacitors;
accumulators;
autonomous embedded system;
energy harvesting;
energy storage;
photovoltaic panel;
solar energy;
supercapacitor;
supercapacitors;
Embedded systems;
Microcontrollers;
Photovoltaic systems;
Supercapacitors;
Voltage measurement;
embedded system;
photovoltaic panel;
simulation;
4.
Quantitative analysis of Ag
3
Sn particle size in Sn3.5Ag solder alloy
机译:
Sn3.5Ag钎料合金中Ag
3 inf> Sn粒径的定量分析
作者:
Garami T.
;
Krammer O.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cooling;
curve fitting;
etching;
exponential distribution;
image processing;
polishing;
production engineering computing;
silver alloys;
silver compounds;
soldering;
solders;
specimen preparation;
suspensions;
tin alloys;
Agsub3/subSn;
OPS;
cooling phase;
etching;
exponential distribution;
fitted exponential curve;
grain size magnitude;
grain structure;
image processing technique;
intermetallic compound;
mathematical calculation;
oxide polishing suspension;
particle size;
quantitative analysis;
sample preparation;
solder alloy;
solder joint;
Atmospheric measurements;
Compounds;
Cooling;
Intermetallic;
Materials;
Soldering;
cooling rate;
image processing;
intermetallic compound;
optical microscopy;
5.
Mechanical tests regarding low-temperature lead-free solder pastes application in automotive electronics
机译:
关于低温无铅锡膏在汽车电子中的应用的机械测试
作者:
Cucu T.C.
;
Plotog I.
;
Branzei M.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
automotive electronics;
cooling;
cost reduction;
low-temperature techniques;
mechanical strength;
mechanical testing;
melting point;
solders;
Condor 70-3 XYZTECH;
LTLF solder pastes;
RoHS 2 EU Directive;
VPS processes;
automotive electronics production;
cooling rates;
energy savings;
homologous temperatures;
low melting point alloys;
low-temperature lead-free solder pastes;
manufacturing processes;
mechanical strength;
mechanical tests;
multifunctional bond tester;
production cost reduction;
resistor 1206 case type;
shear forces;
solder alloy creation processes;
solder joints;
test boards;
Electrical resistance measurement;
Metals;
Resistance;
Resistors;
Soldering;
Temperature;
Temperature measurement;
Low-temperature Lead-Free solder pastes;
homologous temperature;
shear force test;
6.
Device for multiple environment parameters measurements for agriculture use
机译:
用于农业的多种环境参数测量装置
作者:
Plotog I.
;
Varzaru G.
;
Mihailescu B.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
agriculture;
moisture measurement;
rain;
sensor fusion;
soil;
AC voltage;
agriculture use;
multiple environment parameter measurements;
multisensor device rod;
pulsed DC voltage signal;
rain water presence;
soil characterization;
soil moisture determination;
voltage reference;
water absorption;
Electrodes;
Irrigation;
Soil measurements;
Soil moisture;
Temperature measurement;
Voltage measurement;
automated irrigation;
electrode polarization;
rain detection;
soil moisture;
7.
Study regarding the optimal sensors placement on the body for human activity recognition
机译:
有关人体活动识别的最佳传感器放置位置的研究
作者:
Orha I.
;
Oniga S.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Texas Instruments computers;
accelerometers;
biomedical equipment;
data acquisition;
health care;
microcontrollers;
neural net architecture;
peripheral interfaces;
sensor placement;
sensors;
wireless LAN;
Arduino ChipKIT MAX32 microcontroller module;
Chronos devices;
Matlab model;
SD-card;
Texas Instruments;
WiFi Shield module;
artificial neural network;
body positions;
chest;
data acquisition;
human activity recognition;
human body;
intelligent watch Chronos eZ430 product;
portable equipment;
right hand;
right thigh;
smart phones;
tablets;
three-axis accelerometer sensor;
wireless IEEE 802.11 networks;
Accelerometers;
Biomedical monitoring;
Monitoring;
Sensor systems;
Software;
Wireless sensor networks;
activity recognition;
data acquisition;
neural network;
sensors;
8.
High temperature SiC-sensors
机译:
高温SiC传感器
作者:
Pristavu G.
;
Draghici F.
;
Badila M.
;
Brezeanu G.
;
Pascu R.
;
Craciunoiu F.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
MOS capacitors;
Schottky diodes;
gas sensors;
silicon compounds;
temperature sensors;
wide band gap semiconductors;
MOS capacitor;
Schottky diode;
SiC;
high temperature silicon carbide sensors;
hydrogen sensor;
temperature 300 degC;
temperature 400 degC;
temperature sensor;
MOS capacitors;
Schottky diodes;
Silicon carbide;
Temperature;
Temperature measurement;
Temperature sensors;
MOS capacitor;
Schottky barrier diode;
Silicon carbide;
high temperature devices;
sensors;
9.
Aperiodic control method on the reflow soldering-machine for electronic board production
机译:
电子板生产用回流焊机的非周期性控制方法
作者:
Tulbure A.
;
Hutanu C.
;
Borsan F.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
heating elements;
printed circuit manufacture;
reflow soldering;
soldering equipment;
RSM;
aperiodic control method;
electronic board production;
functional laboratory prototype;
reflow soldering-machine;
repetition rate;
resistive heating elements;
resistors;
sigma-delta converter;
Electronics packaging;
Modulation;
Production;
Prototypes;
Semiconductor device measurement;
Synchronization;
Thyristors;
Optimal energy consumption;
Power control;
Reflow Soldering Machine;
10.
Smart diagnose procedure for data acquisition systems inside dams
机译:
大坝内部数据采集系统的智能诊断程序
作者:
Bande V.
;
Pop S.
;
Pitica D.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
dams;
data acquisition;
data loggers;
field buses;
microcontrollers;
protocols;
signal processing;
structural engineering computing;
RS485 communication protocol standard;
communication bus;
dam monitoring;
data acquisition system;
data logger;
data transmission;
differential signal;
microcontroller;
open-circuit;
short-circuit;
signal processing;
smart diagnose procedure;
Central Processing Unit;
Electronics packaging;
Protocols;
Temperature measurement;
Testing;
Transducers;
Voltage measurement;
dam;
diagnose;
protocol;
sensor;
system;
11.
Examination of voiding at the drain pad of high-power FETs
机译:
检查大功率FET的漏极焊盘处的空隙
作者:
Batorfi R.
;
Ruszinko M.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
power field effect transistors;
printed circuits;
soldering;
voids (solid);
aluminium-FR4 printed circuit boards;
drain pad;
field effect transistors;
high power FETs;
insulated metal substrate;
vapour phase soldering;
void distribution;
Apertures;
Field effect transistors;
Heat transfer;
Heating;
Layout;
Soldering;
aluminium core clad PCB;
drain pad;
vapour phase soldering;
voiding;
12.
The design of an ADC on a FPGA used for the control of a switched mode power supply
机译:
FPGA上用于开关电源控制的ADC设计
作者:
Orian C.
;
Patarau T.
;
Petreus D.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Accuracy;
Clocks;
Delays;
Field programmable gate arrays;
Logic gates;
Radiation detectors;
Table lookup;
FPGA;
analog to digital converter;
dc-dc converter;
digital control;
13.
Development of a non-contact angular transducer
机译:
开发非接触式角度传感器
作者:
Farcas C.
;
Cosma A.
;
Palaghita N.
;
Grama A.
;
Gabor M.S.
;
Tiusan C.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
angular measurement;
ferromagnetic materials;
giant magnetoresistance;
magnetic moments;
magnetic sensors;
spin valves;
transducers;
GMR-based angular sensor;
ferromagnetic material;
giant magnetoresistance;
magnetic field;
magnetic moments;
noncontact angular transducer;
spin-valves;
Magnetic fields;
Magnetic multilayers;
Metals;
Perpendicular magnetic anisotropy;
Resistance;
Transducers;
GMR angular sensor;
design of electronic circuits;
non-contact transducer;
spin-valves;
14.
Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates
机译:
嵌入柔性箔基片中的薄硅芯片的断裂强度研究
作者:
Palavesam N.
;
Landesberger C.
;
Bock K.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
elemental semiconductors;
finite element analysis;
flexible electronics;
foils;
fracture toughness;
integrated circuit testing;
mechanical testing;
silicon;
3-point-bending test;
Si;
biaxial bending test;
finite element analysis;
flexible foil substrates;
fracture strength;
ringball test;
size 30 mum to 130 mum;
thin silicon dies;
uniaxial bending test;
Analytical models;
Electronics packaging;
Finite element analysis;
Reliability;
Silicon;
Stress;
Substrates;
breaking strength;
chip embedding in foils;
high curvature mechanical bending;
ultra-thin silicon;
15.
Study of electrical ageing of polypropylene film capacitors using third harmonics measurement
机译:
利用三次谐波测量研究聚丙烯薄膜电容器的电老化
作者:
Horak M.
;
Mach P.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Aging;
Capacitors;
Current measurement;
Electrodes;
Films;
Harmonic analysis;
Voltage measurement;
Polypropylene film capacitors;
VA characteristic nonlinearity;
self-healing process;
third harmonics measurement;
16.
New alternatives in the academic engineering instruction “RAeL” and „CmL-plus”, e-learning academic networks
机译:
学术工程指导“ RAeL”和“ CmL-plus”的新替代方案,电子学习学术网络
作者:
Constantin H.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
authoring systems;
courseware;
educational courses;
educational institutions;
engineering education;
public domain software;
teaching;
utility programs;
CmL-plus;
CourseLab;
Internet-based courses;
POSCCE program;
RAeL project;
Romania;
University of Alba Iulia;
academic education;
academic engineering instruction;
authoring tools;
broadband connection;
complex process;
download-and-play method;
e-learning academic network;
e-learning courses;
educational service diversification;
educational service improvement;
free software;
learning activity monitoring;
online testing;
over-the-Web-just-in-time method;
studying encouragement policy;
teaching methodology;
technology usage;
utility software;
Collaboration;
Educational institutions;
Electronic learning;
Employment;
Instruments;
Software;
e-Learning;
engineering tutorials;
m-Tech forum;
virtual learning;
17.
Magnetic sensors in inertial navigation system
机译:
惯性导航系统中的磁传感器
作者:
Sabou Sebastian
;
Oniga Stefan
;
Lung Claudiu
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Acceleration;
Calibration;
Gyroscopes;
Kalman filters;
Magnetic sensors;
Navigation;
Arduino;
IMU;
MARG;
magnetic sensor;
18.
Cryptographic key generator candidates based on smartphone built-in sensors
机译:
基于智能手机内置传感器的加密密钥生成器候选
作者:
Marghescu A.
;
Teseleanu G.
;
Svasta P.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Android (operating system);
cryptography;
random number generation;
smart phones;
Android-based smartphones;
RNG;
cryptographic key generator candidates;
cryptographic system;
random number generators;
smartphone built-in sensors;
Ciphers;
Encryption;
Generators;
Random sequences;
Sensors;
Cryptography;
RNG;
Random Number Generators;
Sensors;
Smartphone;
19.
MATLAB-based module for encryption and decryption using bifid ciphers applied in cryptosystems
机译:
基于MATLAB的模块,使用加密系统中应用的双密码进行加密和解密
作者:
Borodzhieva A.N.
;
Manoilov P.K.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
computer aided instruction;
cryptography;
educational courses;
further education;
text analysis;
Bulgarian text;
MATLAB based module;
Romanian text;
Russian text;
University of Ruse;
bifid ciphers;
cryptosystems;
decryption;
electronic learning;
encryption;
graphical window;
interactive e-learning;
telecommunications security course;
text decryption;
text encryption;
Algorithms;
Ciphers;
Educational institutions;
Electronics packaging;
Encryption;
MATLAB;
MATLAB;
bifid ciphers;
cryptography;
cryptosystems;
e-learning;
20.
Network management and monitoring using M2M sensor systems
机译:
使用M2M传感器系统进行网络管理和监视
作者:
Suciu G.
;
Suciu V.
;
Butca C.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
data acquisition;
digital subscriber lines;
file servers;
quality of service;
telecommunication network management;
DSL;
M2M sensor systems;
Web server solution;
communication network;
data acquisition;
digital subscriber lines;
innovative low-cost sensor;
integrated M2M interface;
machine-to-machine sensor systems;
management monitoring;
network management;
network monitoring;
quality of service;
workforce management system;
DSL;
Data visualization;
Hardware;
Kernel;
Monitoring;
Protocols;
Sensor systems;
DSL;
M2M;
network management;
network monitoring;
sensor systems;
21.
A VLSI implementation of a frequency synthesizer based on a charge pump PLL
机译:
基于电荷泵PLL的频率合成器的VLSI实现
作者:
Bozomitu Radu Gabriel
;
Cehan Vlad
;
Barabasa Constantin
;
Cojan Neculai
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Charge pumps;
Frequency conversion;
Frequency synthesizers;
Integrated circuit modeling;
Phase frequency detector;
Phase locked loops;
Voltage-controlled oscillators;
CMOS;
PLL;
SRD;
charge-pump;
frequency synthesizer;
22.
FPGA-based single precision iterative floating point multiplier for educational use
机译:
基于FPGA的教育用单精度迭代浮点乘法器
作者:
Opritoiu F.
;
Carapencea S.
;
Vladutiu M.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
field programmable gate arrays;
floating point arithmetic;
hardware description languages;
iterative methods;
logic design;
FPGA based single precision iterative floating point multiplier;
Verilog description language;
educational use;
sequential binary multiplication procedures;
shift and add multiplication;
Adders;
Algorithm design and analysis;
Central Processing Unit;
Computer architecture;
Computers;
Education;
Field programmable gate arrays;
Educational Design;
Floating Point Multiplier;
Iterative Implementation;
Single Precision IEEE 754;
23.
Low cost, rigid to flex interposer using a spray coated intrinsically conductive polymer in a roll to-roll process
机译:
低成本,在卷对卷工艺中使用喷涂的本征导电聚合物对弯曲内衬进行刚性固定
作者:
Bose I.
;
Bonfert D.
;
Heim S.
;
Bock K.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
adhesives;
conducting polymers;
cooling;
masks;
organic semiconductors;
silver;
solid lasers;
spray coatings;
Ag;
PEDOT;
PEN foil;
PEN substrate;
PSS;
R2R process;
adhesive foil;
anisotropic conductive polymer;
complete roll-to-roll process;
contact stencil mask;
current 100 mA;
current 50 mA;
ethylene glycol;
heat dissipation;
interposer structures;
line-space finger geometry;
masking;
plastic polyethylene naphtalate substrate;
poly(3,4-ethylenedioxythiophene);
poly(styrenesulfonate);
primary substrate foil;
rigid-to-flex interposer;
sheet resistance;
silver conductive paste;
single-sided adhesive;
solid state R2R integrated laser;
spray coating;
temperature 150 degC;
temperature 293 K to 298 K;
temperature 65 degC;
wavelength 355 nm;
Electrical resistance measurement;
Heating;
Polymers;
Resistance;
Substrates;
Surface treatment;
Temperature measurement;
PEDOT;
PSS;
R2R processing;
intrinsically conductive polymer;
rigid-to-flex printed interposer;
24.
FPGA-based system for data acquisition and remote communication
机译:
基于FPGA的数据采集和远程通信系统
作者:
Mazare A.
;
Ionescu L.
;
Serban G.
;
Lita I.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
IP networks;
client-server systems;
computerised instrumentation;
data acquisition;
field programmable gate arrays;
local area networks;
reduced instruction set computing;
sensors;
transport protocols;
AD converter;
AD sensor;
Ethernet interface;
IP core module;
RISC processor;
TCP server;
TCPIP communication;
Xilinx Spartan 6 FPGA circuit;
client-server session;
data acquisition;
data processing;
remote data communication;
remote transmission;
running library;
Computer architecture;
Field programmable gate arrays;
IP networks;
Ports (Computers);
Reduced instruction set computing;
Registers;
Sensors;
Ethernet;
FPGA;
multi-channel acquisition system;
25.
Rocket data logger
机译:
火箭数据记录仪
作者:
Hapenciuc A.
;
Lita A.
;
Busu I.
;
Bostan A.
;
Radoi F.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Global Positioning System;
acceleration measurement;
atmospheric pressure;
data loggers;
data recording;
graphical user interfaces;
peripheral interfaces;
pressure measurement;
rocket engines;
velocity measurement;
CSV format;
GPS;
PC GUI;
USB;
acceleration measurement;
atmospheric pressure measurement;
data recording;
data retrieval;
data storage;
data transfer;
height measurement;
parachute ejection;
rocket;
rocket data logger;
rocket engine pressure measurement;
speed measurement;
Acceleration;
Accelerometers;
EPROM;
Engines;
Global Positioning System;
Rockets;
Sensors;
Data Logger;
Embedded;
PIC;
Rocket;
Sensors;
26.
A numerical analysis of thermal management schemes of a LED array in TFT TV
机译:
TFT TV LED阵列热管理方案的数值分析
作者:
Mermer O.
;
Nil M.
;
Akgul M.B.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
LED displays;
ceramic packaging;
cooling;
natural convection;
numerical analysis;
printed circuits;
television displays;
temperature distribution;
thermal conductivity;
thermal engineering;
thermal management (packaging);
thin film transistors;
LED backlight TFT TV array system;
LED packaging;
ceramic based PCB material;
natural convective cooling;
numerical analysis;
printed circuit board;
television;
temperature distribution;
thermal conductivity;
thermal management scheme;
Arrays;
Electronic packaging thermal management;
Light emitting diodes;
Materials;
Temperature distribution;
Thermal analysis;
Thin film transistors;
LED;
TFT TV;
Thermal management;
27.
Robotic arm detection in the 2D space
机译:
二维空间中的机械手臂检测
作者:
Szabo R.
;
Gontean A.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
humanoid robots;
image recognition;
2D space;
colored spots;
computer game;
human movement;
image detection algorithm;
movement detection method;
moving robotic arm;
robot movement;
robotic arm detection;
robotic arm recognition;
Computer vision;
Image color analysis;
Joints;
Robot kinematics;
Service robots;
Webcams;
Cameras;
character recognition;
color;
computer vision;
manipulators;
robot control;
28.
Vapour phase soldering on flexible printed circuit boards
机译:
柔性印刷电路板上的气相焊接
作者:
Geczy A.
;
Batorfi R.
;
Szeles G.
;
Luhaly A.
;
Ruszinko M.
;
Berenyi R.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
X-ray microscopy;
flexible electronics;
printed circuit manufacture;
printed circuit testing;
reflow soldering;
surface mount technology;
FR4 type printed circuit boards;
IMC tests;
X-ray microscopy;
chip size surface mounted resistors;
cross-section optical inspection;
flexible polyimide substrates;
flexible printed circuit boards;
heat-level vapour phase method;
lead-free SAC305 paste;
reflow method;
shear tests;
surface mounted technology;
test assembly;
test boards;
vapour phase soldering;
Fixtures;
Flexible printed circuits;
Heat transfer;
Heating;
Joints;
Materials;
Soldering;
Flexible;
Printed Circuit Board;
Vapour Phase Soldering;
polyimide;
29.
An experimental monitoring system for thermoelectric modules
机译:
用于热电模块的实验监控系统
作者:
Sfirat A.
;
Gontean A.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cooling;
flow control;
power engineering computing;
power system control;
power system measurement;
temperature measurement;
thermoelectric conversion;
Raspberry Pi controller board;
active cooling solution;
data logging;
electrical power;
experimental monitoring system;
monitoring parameters;
thermoelectric generator devices;
thermoelectric generator modules;
work flow control;
Cooling;
Generators;
Heating;
Materials;
Monitoring;
Temperature measurement;
Temperature sensors;
Experimental module;
fresnel lens;
solar power;
temperature measurement;
thermoelectric generator;
30.
Training module with graphical user interface for encryption and decryption using affine ciphers applied in cryptosystems
机译:
具有图形用户界面的培训模块,可使用应用于密码系统的仿射密码进行加密和解密
作者:
Borodzhieva A.N.
;
Manoilov P.K.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
computer aided instruction;
cryptography;
graphical user interfaces;
mathematics computing;
telecommunication security;
Bulgarian;
English;
GUIDE;
MATLAB;
Romanian;
Russian;
University of Ruse;
affine ciphers;
bachelor educational qualification degree;
cryptosystems;
graphical user interface development environment;
telecommunications security;
text decryption;
text encryption;
training module;
Ciphers;
Electronics packaging;
Encryption;
Graphical user interfaces;
Pressing;
Training;
GUIDE;
MATLAB;
affine ciphers;
cryptography;
cryptosystems;
31.
Testing method and platform for power device radiant flux emitters in DC and in impulse
机译:
直流和脉冲中功率器件辐射通量发射器的测试方法和平台
作者:
Bacis I.
;
Marghescu C.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
optical beam splitters;
optical fibre couplers;
optical fibre losses;
optical receivers;
optical testing;
semiconductor lasers;
laser diodes;
optical device coupling;
optical fiber alignment;
optical losses;
power device radiant flux emitters;
single-mode fiber;
splitters;
testing method;
Optical fiber cables;
Optical fiber communication;
Optical fiber devices;
Optical fibers;
Optical receivers;
Optical transmitters;
communication system;
laser diode;
test platform;
32.
Electrochemical migration behaviour of surface finishes after vapour phase reflow soldering
机译:
气相回流焊接后表面处理的电化学迁移行为
作者:
Illes B.
;
Medgyes B.
;
Horvath A.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
copper alloys;
dendrites;
glass fibres;
reflow soldering;
scanning electron microscopy;
silver alloys;
solders;
surface finishing;
tin alloys;
FR4;
SnAgCu;
bare copper;
dendrite morphologies;
distilled water;
electrical characteristics;
electrochemical migration behaviour;
glass fibre epoxy board;
immersion silver;
immersion tin;
infrared reflow process;
lead-free solder profile;
scanning electron microscope;
solder mask layer;
statistical evaluation;
surface finishes;
vapour phase reflow soldering;
water drop tests;
Electric variables;
Electronic countermeasures;
Metals;
Reliability;
Surface finishing;
Surface morphology;
Electrochemical migration;
Surface finish;
VPS;
Vapour phase soldering;
33.
Offline self-test architecture for the inversion operation of advanced encryption standard
机译:
离线自检架构,用于高级加密标准的反演操作
作者:
Opritoiu F.
;
Vladutiu M.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cryptography;
digital signatures;
AES inversion units;
AES state matrix;
advanced encryption standard;
conventional test pattern generation methods;
finite field inversion operation;
offline fault detection strategy;
offline self-test architecture;
signature analysis;
Built-in self-test;
Circuit faults;
Computer architecture;
Encryption;
Galois fields;
Inverters;
Vectors;
Advanced Encryption Standard;
Built-In Self-Test;
Galois Field Inversion;
Signature Analysis;
34.
An implementation of a 13.56 MHz RFID reader
机译:
13.56 MHz RFID阅读器的实现
作者:
Cernatescu Victor
;
Vladescu Marian
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Directive antennas;
Electronics packaging;
IEC standards;
ISO standards;
Integrated circuits;
Radiofrequency identification;
RFID antenna design;
RFID reader;
RFID reader PCB design;
35.
The effect of NaCl on water condensation and electrochemical migration
机译:
NaCl对水冷凝和电化学迁移的影响
作者:
Medgyes B.
;
Gal L.
;
Szivos D.
会议名称:
《》
|
2014年
关键词:
condensation;
failure analysis;
sodium compounds;
solders;
ECM;
FR4 substrate;
NaCl crystal effect;
THB test;
condensation cores;
condensation intensity;
dew point test;
electrochemical migration processes;
failure phenomena;
lead bearing;
lead-free solder alloys;
locally water bridges;
thermal-humidity bias;
water condensation process;
water droplets;
Conductors;
Crystals;
Electronic countermeasures;
Ions;
Lead;
Reliability;
dew point test;
electrochemical migration;
water condensation;
36.
Cooling with Mentor Graphics HyperLynx Thermal
机译:
使用Mentor Graphics HyperLynx Thermal散热
作者:
Hnatiuc M.
;
Iov C.J.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cooling;
power consumption;
printed circuit design;
temperature control;
thermal analysis;
HyperLynx Thermal;
Mentor Graphics Company;
board temperature control;
cooling;
electronics designing process;
generated temperature;
metal mounting holes;
power consumption;
power integrity analysis;
printed circuit boards;
signal integrity analysis;
thermal analysis solution;
thermal transfer solutions;
virtual prototypes;
virtual world;
Atmospheric modeling;
Copper;
Fasteners;
Heat transfer;
Temperature;
Thermal analysis;
Thermal resistance;
heat transfer techniques;
temperature constraints;
thermal analysis;
virtual prototyping;
what if scenario;
37.
Power LEDs operating temperature measurement using the protection reverse diode
机译:
使用保护反向二极管测量功率LED的工作温度
作者:
Vladescu M.
;
Mihailescu B.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
diodes;
heat sinks;
intelligent sensors;
light emitting diodes;
power semiconductor devices;
printed circuits;
temperature measurement;
temperature sensors;
thermal resistance;
thermocouples;
PCB;
heatsink;
junction temperature;
operating temperature measurement;
power LED structures;
protection reverse diode;
temperature sensor;
thermal resistances;
thermocouples;
Contacts;
Junctions;
Light emitting diodes;
Semiconductor diodes;
Soldering;
Temperature measurement;
Temperature sensors;
LED junction temperature;
LED temperature measurement;
38.
Robotic arm movement using color detection with FPGA vision
机译:
利用FPGA视觉的颜色检测实现机械臂运动
作者:
Szabo R.
;
Gontean A.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
dexterous manipulators;
field programmable gate arrays;
image colour analysis;
object detection;
robot vision;
ATLYS development board;
FPGA vision;
Spartan-6 FPGA;
VmodCAM camera;
color detection;
robotic arm movement;
robotic arm position;
Cameras;
Field programmable gate arrays;
Image color analysis;
Monitoring;
Robot kinematics;
Robot vision systems;
Camera;
color;
computer vision;
field programmable gate arrays;
manipulators;
robot programming;
39.
Nanofluids for electronics cooling
机译:
电子冷却用纳米流体
作者:
Turgut A.
;
Elbasan E.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cooling;
nanofluidics;
temperature measurement;
thermal management (packaging);
thermocouples;
CPU;
K-type thermocouples;
central processing unit;
electronics cooling;
power 60 W;
power 70 W;
temperature measurement;
thermal performance;
time 2 min;
water-based alumina nanofluid;
Aluminum oxide;
Central Processing Unit;
Cooling;
Electronics cooling;
Fluids;
Nanofluidics;
Temperature measurement;
central processing unit (CPU);
electronics cooling;
nanofluids;
nanoparticles;
40.
Optimizing optical power loss in optical coupling elements
机译:
优化光耦合元件中的光功率损耗
作者:
Bacis I.
;
Marghescu C.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
optical fibre couplers;
optical fibre losses;
Snell-Descartes refraction;
mono mode;
multimode fibers;
optical coupling elements;
optical fiber;
optical fibre attenuation;
optical power loss;
signal transmission;
waveguide;
Optical attenuators;
Optical fiber cables;
Optical fiber communication;
Optical fibers;
Optical reflection;
Optical transmitters;
attenuation;
coupling elements;
fibre optic;
power loss;
41.
Elastic modulus and energy dissipation measurements with AFM on chalcogenide thin films
机译:
硫族化物薄膜上的原子力显微镜测量弹性模量和能量耗散
作者:
Bonyar A.
;
Kaman J.
;
Csarnovics I.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Young's modulus;
amorphous semiconductors;
arsenic compounds;
atomic force microscopy;
elasticity;
semiconductor thin films;
vacuum deposition;
AFM;
Assub20/subSesub80/sub;
Young's modulus;
amorphous chalcogenide thin films;
contact-mode point spectroscopy;
elastic modulus;
elasticity;
energy dissipation measurements;
holographic grating;
tapping-mode imaging atomic force microscopy;
thermal evaporation;
tip-surface energy dissipation;
Energy dissipation;
Energy measurement;
Force;
Gratings;
Spectroscopy;
Surface topography;
Young's modulus;
AFM;
Young's Modulus;
chalcogenide;
energy dissipation;
42.
Minilab for evaluating the influence of electromagnetic field over “in vitro cultures”
机译:
用于评估电磁场对“体外培养”的影响的迷你实验室
作者:
Velcea M.N.
;
Mihailescu B.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
biological effects of fields;
biological effects of optical radiation;
biological techniques;
biotechnology;
botany;
zoology;
Biofeedback/Biophoton concept;
EMF;
Minilab;
animal culture;
biofeedback effects;
diseases;
electrical body;
electromagnetic field;
electronic equipment;
health state;
human stress level;
in vitro cultures;
plants;
space;
standard technology;
vegetal culture;
Biotechnology;
Coils;
Electromagnetic fields;
Generators;
Geometry;
In vitro;
Magnetic fields;
Biofeedback;
Electromagnetic Field;
In Vitro Cultures;
Minilab;
43.
System for the testing of LEDs colour and intensity
机译:
用于测试LED颜色和强度的系统
作者:
Tomse M.T.
;
Gordan C.E.
;
Filip R.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
brightness;
colour;
light emitting diodes;
optical testing;
ICT;
LED colour;
LED intensity;
LED test;
chrominance;
colour detector;
graphical interface;
luminance;
Frequency measurement;
Image color analysis;
Light emitting diodes;
Microcontrollers;
Registers;
Software;
Universal Serial Bus;
LED Tester;
colour detector;
colour sensor;
44.
Finite volume modelling of stencil printing process
机译:
模版印刷工艺的有限体积建模
作者:
Krammer O.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
finite volume methods;
reflow soldering;
solders;
FVM model;
Newtonian properties;
attack angle;
finite volume method;
geometrical model;
nonNewtonian liquids;
nonNewtonian solder paste properties;
pressure distribution;
reflow soldering technology;
stencil printing process;
stencil surface;
Accuracy;
Analytical models;
Numerical models;
Printing;
Semiconductor device modeling;
Surface treatment;
Viscosity;
Finite Volume Method;
non-Newtonian properties;
reflow soldering;
solder paste;
stencil printing;
45.
Application of assembly and manufacturing technology in the field of biomedical engineering: Three dimensional solid modeling of prosthetic knee joint
机译:
装配和制造技术在生物医学工程领域的应用:人工膝关节的三维实体建模
作者:
Khan M.A.
;
Mumtaz T.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
CAD;
assembling;
gait analysis;
mechanical stability;
patient rehabilitation;
prosthetics;
solid modelling;
3D solid modeling;
CAD software;
PTC Simulate simulation software;
Pro Engineer Wildfire;
assembly;
biomedical engineering;
computer aided designed;
gait pattern;
heel strike phase;
manufacturing technology;
prosthesis;
rehabilitation engineering;
single axis prosthetic knee joint;
stability;
stress analysis;
transfemoral amputation;
Analytical models;
Assembly;
Joints;
Knee;
Prosthetics;
Solid modeling;
Stress;
Transfemoral amputation;
prosthetic knee joint;
rehabilitation engineering;
reverse engineering;
stress analysis;
46.
Programmable pulsed current driver for high power LEDs applications
机译:
适用于大功率LED应用的可编程脉冲电流驱动器
作者:
Vidrascu M.
;
Vladescu M.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
driver circuits;
light emitting diodes;
constant current;
current pulse;
high-power LED application;
maximum continuous current;
optical flux;
package thermal characteristics;
peak currents;
programmable-pulsed current driver;
Capacitors;
Connectors;
Current control;
Light emitting diodes;
MOSFET;
Power supplies;
Switches;
LED driver;
high power LED;
pulsed current;
47.
Test module of a software system for simulation study of convolutional encoders and decoders using MATLAB
机译:
使用MATLAB仿真研究卷积编码器和解码器的软件系统的测试模块
作者:
Borodzhieva A.N.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
computer aided instruction;
computer science education;
educational courses;
educational institutions;
program testing;
software engineering;
telecommunication computing;
Bachelor educational degree;
Matlab;
University of Ruse;
Windows;
cascaded convolutional encoder simulation study module;
coding-in-telecommunication systems course;
convolutional decoders;
convolutional encoder performance determination module;
convolutional encoding-and-decoding module;
divide-and-search module;
educational-assessment system;
software system test module;
Computers;
Convolutional codes;
Decoding;
Encoding;
MATLAB;
Software systems;
Telecommunications;
MATLAB;
convolutional codes;
test module;
48.
New assistive technology for communicating with and telemonitoring disabled people
机译:
与残疾人沟通和远程监控的新辅助技术
作者:
Bozomitu R.G.
;
Cehan V.
;
Lupu R.G.
;
Rotariu C.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
handicapped aids;
neurophysiology;
telemedicine;
assistive technology;
disabled people;
neuromotor disability;
physiological parameters;
telemonitoring;
Biomedical monitoring;
Monitoring;
Portable computers;
Servers;
Temperature sensors;
communication;
people with neuromotor disabilities;
telemonitoring;
49.
Monitoring system with applications in road transport
机译:
监控系统及其在公路运输中的应用
作者:
Costea I.M.
;
Nemtanu F.C.
;
Dumitrescu C.
;
Banu C.V.
;
Banu G.S.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
data acquisition;
optimisation;
road safety;
road traffic;
traffic engineering computing;
virtual instrumentation;
LabVIEW programming;
access;
congestions;
data collection;
data processing;
environmental protection regulation;
information organization;
information transmission;
innovative system;
mobility;
modern traffic monitoring system;
pollution;
real-time information collection;
road traffic flow optimization;
road transport;
road travel;
security issues;
traffic conditions;
urban land;
urban road traffic;
weather conditions;
Electronics packaging;
Europe;
Monitoring;
Roads;
Temperature measurement;
Temperature sensors;
Vehicles;
LabVIEW simulation;
Road traffic monitoring;
traffic data collection;
traffic flow;
50.
Test and measurement procedures for RFID systems
机译:
RFID系统的测试和测量程序
作者:
Vuza Dan Tudor
;
Frosch Reinhold
;
Gugganig Michael
;
Vladescu Marian
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Antenna measurements;
Antennas;
Baseband;
Decoding;
Radiofrequency identification;
Reliability;
Transponders;
2D scanner;
RFID;
antenna;
baseband signal;
measurement;
reader;
simulator;
transponder;
51.
Adapting a ring oscillator-based true random number generator for Zynq system on chip embedded platform
机译:
将基于环形振荡器的真随机数发生器改编为Zynq系统片上嵌入式平台
作者:
Marghescu A.
;
Maimut D.-S.
;
Teşeleanu G.
;
Neacşa T.
;
Svasta P.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cryptography;
field programmable gate arrays;
oscillators;
random number generation;
FPGA implementation;
Zynq system;
chip embedded platform;
cryptography;
ring oscillator-based true random number generator;
statistical tests;
Cryptography;
Electronics packaging;
Entropy;
Field programmable gate arrays;
Generators;
Ring oscillators;
System-on-chip;
FPGA;
RNG;
Random Number Generators;
Ring Oscillators;
Zynq;
52.
Bi-dimensional radially-salphasic (standing wave) clock distribution
机译:
二维径向α(驻波)时钟分布
作者:
Pasca A.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
CMOS integrated circuits;
clock distribution networks;
clocks;
2D integrated circuits;
bidimensional clock distribution;
bidimensional structure;
clock distribution network;
cylindrical waves;
multidimensional salphasic geometries;
phase saltation distribution;
plane wave;
pseudo-unidimensional behavior;
radial bidimensional waveguide;
radially-salphasic clock distribution;
standing wave clock distribution;
standing wave pattern;
transmission line model;
Clocks;
Generators;
Inductance;
Load modeling;
Mathematical model;
Power transmission lines;
Surface waves;
Salphasic disc;
bi-dimensional clock distribution;
standing wave;
53.
Flow simulations for ccomponent spacing optimization on PCB boards
机译:
用于在PCB板上优化组件间距的流程模拟
作者:
Alexandra F.
;
Rajmond J.
;
Dan P.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
cooling;
optimisation;
printed circuit manufacture;
thermal management (packaging);
DPACK components;
PCB boards;
SolidWorks simulations;
air flow;
component placement;
component spacing optimization;
cooling;
electronic components;
flow simulations;
temperature 40 C;
Aerodynamics;
Atmospheric modeling;
Computational fluid dynamics;
Cooling;
Heating;
Mathematical model;
Shape;
CFD;
Solidworks;
air flow;
thermal modelling;
54.
Emergency radio communication network controller implemented in FPGA
机译:
用FPGA实现的应急无线电通信网络控制器
作者:
Lung C.
;
Sabou S.
;
Buchman A.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Computers;
Educational institutions;
Field programmable gate arrays;
Lungs;
Microprocessors;
Radio communication;
Robots;
APRS;
FPGA;
PicoBlaze;
55.
Indoor localisation method based on existing WLAN infrastructure: A correlation based approach
机译:
基于现有WLAN基础设施的室内定位方法:一种基于相关性的方法
作者:
Buchman A.
;
Erdei A.
;
Lung C.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Android (operating system);
Java;
correlation methods;
indoor radio;
radio direction-finding;
wireless LAN;
Android operating system;
Indoor localisation method;
Java;
Linux;
WLAN infrastructure;
correlation based method;
mobile agent;
office building;
portability;
room level accuracy localization;
university;
wireless access point;
wireless local area network infrastructure;
Accuracy;
Buildings;
Correlation;
Indexes;
Mobile handsets;
Testing;
Wireless communication;
Acces point (AP) Received signal strength (RSS);
Received signal strength index (RSSI);
correlation;
covariance;
56.
Studies on thermal properties of substrates for electronics using IR thermography
机译:
红外热成像技术研究电子基板的热性能
作者:
Ionescu Ciprian
;
Branzei Mihai
;
Mihailescu Bogdan
;
Bonfert Detlef
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
Electronics packaging;
Heating;
III-V semiconductor materials;
Probes;
Substrates;
Temperature measurement;
IR thermography;
Thermophysical properties;
electronic substrates;
thermal diffusivity;
57.
A fundamental study of supercapacitive cells
机译:
超级电容电池的基础研究
作者:
Rizoiu A.
;
Enache S.
;
Varlam M.
;
Svasta P.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
leakage currents;
supercapacitors;
voltammetry (chemical analysis);
ESR;
Suntan supercapacitor;
chronoamperometry;
chronovoltametry;
cyclic voltammetry measurements;
energy storage capability;
equivalent series resistance;
leakage currents;
open circuit voltages;
supercapacitive cells;
Current measurement;
Electric potential;
Electrodes;
Resistance;
Supercapacitors;
Time measurement;
Voltage measurement;
electrochemical impedance spectroscopy;
high-power rechargeable batteries;
supercapacitors;
58.
Examination of influence of electrical stress on parameters of PP film capacitors
机译:
检验电应力对PP薄膜电容器参数的影响
作者:
Mach P.
;
Horak M.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
ageing;
capacitors;
power electronics;
AC voltage;
PP film capacitors;
capacitance 10 nF;
electrical loading;
electrical stress;
frequency 15 MHz to 20 MHz;
frequency 300 Hz to 1 MHz;
frequency 50 Hz;
loss factor;
polypropylene film capacitors;
power electronics equipment;
self-healing process;
voltage 300 V;
voltage 630 V;
Aging;
Capacitance;
Capacitors;
Degradation;
Electrodes;
Films;
Impedance;
Polypropylene film capacitors;
VA characteristic nonlinearity;
self-healing process;
third harmonics measurement;
59.
Simulink test bench for a hybrid battery-supercapacitor power system
机译:
用于混合电池-超级电容器电源系统的Simulink测试台
作者:
Grama A.
;
Patarau T.
;
Etz R.
;
Petreus D.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
lithium compounds;
secondary cells;
supercapacitors;
Simulink test bench;
battery storage;
charge-discharge efficiency;
hybrid battery-supercapacitor power system;
lithium-ion rechargeable battery;
power surges;
Batteries;
Discharges (electric);
Hybrid power systems;
Integrated circuit modeling;
Mathematical model;
Software packages;
Supercapacitors;
battery;
hybrid power system;
storage energy;
supercapacitor;
60.
PSpice models of resistive transduscers used in building management
机译:
用于建筑物管理的电阻式变送器的PSpice模型
作者:
Pop S.
;
Bande V.
;
Pitica D.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
building management systems;
network topology;
reference circuits;
resistors;
temperature sensors;
transducers;
DC measurement circuits;
PSpice modelling;
building management;
differential referenced circuit topology;
ground referenced circuit topology;
resistive transducers;
strain transducer;
temperature transducer;
voltage controlled resistors;
Integrated circuit modeling;
Mathematical model;
Resistance;
SPICE;
Strain;
Temperature measurement;
Transducers;
PSpice model;
resistive transducer;
strain;
temperature;
61.
A new high frequency ultrasonic SONAR head for airborne applications
机译:
适用于机载应用的新型高频超声波SONAR头
作者:
Aiordachioaie D.
;
Epure S.
;
Dumitrascu B.
会议名称:
《IEEE International Symposium for Design and Technology in Electronic Packaging》
|
2014年
关键词:
aircraft instrumentation;
image fusion;
sonar detection;
ultrasonic transducers;
virtual instrumentation;
ROVIBAT sonar head;
Romanian virtual bat sonar head;
airborne applications;
airborne transducer module;
high frequency ultrasonic sonar head;
multispectral image fusion techniques;
ultrasonic image generation;
ultrasonic transducers;
Acoustics;
Head;
Resonant frequency;
Sonar;
Sonar navigation;
Transducers;
Ultrasonic transducers;
Ultrasonic transducers;
biomimetic;
electronic circuits;
sonar;
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