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International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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1.
Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR
机译:
汽车利达的数字双胞胎开发中的热机电光耦合
作者:
M. Tavakolibasti
;
P. Meszmer
;
G. Böttger
;
M. Kettelgerdes
;
G. Elger
;
H. Erdogan
;
A. Seshaditya
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Couplings;
Laser radar;
Digital twin;
Thermomechanical processes;
Adaptive optics;
Optical coupling;
Real-time systems;
2.
Modeling and Simulation of a Low Voltage Electroosmotic Micropump for Non-Newtonian Fluids
机译:
非牛顿液体低压电渗微泵的建模与仿真
作者:
Mohamed Badran
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Measurement;
Low voltage;
Solid modeling;
Fluids;
Biological system modeling;
Micropumps;
3.
Parametric Simulation of a Packaged Thermoelectric Generator for Electrically Active Implants
机译:
用于电动植入物的封装热电发电机的参数模拟
作者:
Y. Rao
;
S. Bouhedma
;
T. Bechtold
;
D. Hohlfeld
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Geometry;
Thermal resistance;
Implants;
Generators;
Microelectronics;
Finite element analysis;
4.
Modified Norris-Landzberg Model for Reliability of Pb-free BGA Components
机译:
改进的Norris-Landzberg模型,可用于PB无BGA组件的可靠性
作者:
Weidong Xie
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Correlation;
Metals;
Predictive models;
Benchmark testing;
Reliability engineering;
Data models;
Product design;
5.
Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package
机译:
低压离散封装的热机械有限元仿真和粘塑料抵抗
作者:
Alessandro Sitta
;
Giuseppe Mauromicale
;
Gaetano Sequenzia
;
Angelo Alberto Messina
;
Marco Renna
;
Michele Calabretta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Low voltage;
Computational modeling;
Thermomechanical processes;
Predictive models;
Fatigue;
Numerical models;
Finite element analysis;
6.
Design of a PMUT array for Multifrequency Imaging
机译:
用于多频成像的PMUT阵列的设计
作者:
B. Weekers
;
M. Billen
;
R. Haouari
;
V. Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Solid modeling;
Three-dimensional displays;
Fluids;
Imaging;
Resonant frequency;
Predictive models;
Solids;
7.
On the Way to understand the Warpage in 8” Taiko Semiconductor Wafers for Power Electronics Applications (Si and SiC)
机译:
在理解8“太佳半导体晶片的翘曲的方式,用于电力电子应用(Si和SiC)
作者:
Vincenzo Vinciguerra
;
Antonio Landi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Semiconductor device modeling;
Micromechanical devices;
Correlation;
Silicon carbide;
Elasticity;
Silicon;
Power electronics;
8.
Failure Mechanism Detection Algorithm with MOSFET Body Diode
机译:
MOSFET体二极管的故障机制检测算法
作者:
Mohamad El Khatib
;
Sven Reitz
;
Jens Warmuth
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
MOSFET;
Impedance measurement;
Failure analysis;
Electronic packaging thermal management;
Thermal analysis;
Reliability;
9.
Effect of Bragg Acoustic Reflector on Thermal Processes in SMR under High Power Levels
机译:
Bragg声反射器对高功率水平在SMR中热处理的影响
作者:
A. G. Kozlov
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Heating systems;
Temperature distribution;
Analytical models;
Temperature dependence;
Resonant frequency;
Zinc oxide;
Acoustics;
10.
Failure of MEMS Microphones During Impact Tests: the Role of Anchor Imposed Motion
机译:
MEMS麦克风在冲击试验期间失败:锚固运动的作用
作者:
Aldo Ghisi
;
David Faraci
;
Silvia Adorno
;
Alberto Corigliano
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Analytical models;
Transient response;
Atmospheric modeling;
Numerical simulation;
Thermal analysis;
History;
11.
Study on FO-WLP Warpage Behavior – Influence of Process Temperature and Geometry
机译:
FO-WLP翘曲行为的研究 - 过程温度与几何的影响
作者:
Marius van Dijk
;
Saskia Huber
;
Andreas Stegmaier
;
Hans Walter
;
Olaf Wittler
;
Martin Schneider-Ramelow
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Geometry;
Thermal expansion;
Temperature dependence;
Thermomechanical processes;
Semiconductor device reliability;
Process control;
12.
Topology Optimization of Miniaturized Piezoelectric Energy Harvester
机译:
小型化压电能源收割机的拓扑优化
作者:
Siyang Hu
;
Ulrike Fitzer
;
Tamara Bechtold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Geometry;
Resonant frequency;
Piezoelectricity;
Topology;
Microelectronics;
Energy harvesting;
13.
Effects of Anisotropic Viscoplasticity on SAC305 Solder Joint Deformation: Grain-scale Modeling of Temperature Cycling
机译:
各向异性粘塑性对SAC305焊点变形的影响:温度循环晶粒规模建模
作者:
Qian Jiang
;
Abhishek Deshpande
;
Abhijit Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Analytical models;
Creep;
Loading;
Crystals;
Numerical models;
Thermal analysis;
Microstructure;
14.
Optical Deformation Measurement for Validation of Thermo-Mechanical FEM Models and Material Behavior in Electronics
机译:
用于验证热机械有限元模型和电子产品的材料行为的光学变形测量
作者:
R. Schwerz
;
M. Roellig
;
G. Lautenschlaeger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Deformable models;
Heating systems;
Thermomechanical processes;
Optical variables measurement;
Inspection;
Tools;
15.
Training Convolutional Neural Networks (CNN) for Counterfeit IC Detection by the Use of Simulated X-Ray Images
机译:
培训卷积神经网络(CNN)通过使用模拟X射线图像进行假冒IC检测
作者:
Suresh dharani Parasuraman
;
Jürgen Wilde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Training;
Radiography;
Solid modeling;
Computational modeling;
Tools;
Prediction algorithms;
Classification algorithms;
16.
Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model
机译:
烧结纳米银颗粒的本构模拟:可变阶分形模型与Anand模型
作者:
Jiajie Fan
;
Tijian Gu
;
Ping Wang
;
Wei Cai
;
Xuejun Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Analytical models;
Silver;
Temperature;
Fitting;
Thermomechanical processes;
Packaging;
Thermal conductivity;
17.
Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: a Parametric Study
机译:
用于牵引反相器的电源模块中的平行碳化硅MOSFET:参数学研究
作者:
Alessandro Sitta
;
Giuseppe Mauromicale
;
Vittorio Giuffrida
;
Alessandra Manzitto
;
Marco Papaserio
;
Daniela Cavallaro
;
Gaetano Bazzano
;
Marco Renna
;
Santi Agatino Rizzo
;
Michele Calabretta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Resistance;
MOSFET;
Silicon carbide;
Multichip modules;
Tools;
Threshold voltage;
Inverters;
18.
Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications
机译:
用于汽车应用组合的循环热和弯曲载荷下的焊点测试筛选
作者:
Jonas Gleichauf
;
Youssef Maniar
;
Steffen Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Loading;
Life estimation;
Bending;
Thermal loading;
Reliability;
Soldering;
19.
Characterization of the mechanical behavior of a Printed Circuit Board (PCB)
机译:
印刷电路板(PCB)的力学行为的表征
作者:
A. Atintoh
;
W. Kpobie
;
N. Bonfoh
;
M. Fendler
;
P. Lipinski
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Inverse problems;
Printed circuits;
Numerical simulation;
Boundary conditions;
Weaving;
Software;
Mechanical factors;
20.
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
机译:
微电子聚合物包封材料中固化诱导残余应力的预测
作者:
Christian Schipfer
;
Mario Gschwandl
;
Peter Fuchs
;
Thomas Antretter
;
Michael Feuchter
;
Matthias Morak
;
Qi Tao
;
Angelika Schingale
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Encapsulation;
Vitrification;
Production;
Curing;
Numerical models;
Residual stresses;
Microelectronics;
21.
Relevance Evaluation of Solder Joints Attributes to Reduce the Variance of the Lifetime Model
机译:
焊点属性的相关性评估,以减少寿命模型的变化
作者:
Rika Berger
;
Robert Schwerz
;
Mike Röllig
;
Henning Heuer
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Geometry;
Temperature distribution;
Correlation;
Three-dimensional displays;
Shape;
Thermomechanical processes;
22.
Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
机译:
球尺寸和几何的影响对MM波系统的可靠性和RF性能:模拟方法
作者:
Seyyid Dilek
;
Ivan Ndip
;
Marco Rossi
;
Christian Tschoban
;
Simon Kuttler
;
Olaf Wittler
;
Klaus-Dieter Lang
;
Christian Goetze
;
Daniel Berger
;
Marcel Wieland
;
Martin Schneider-Ramelow
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Radio frequency;
Geometry;
Solid modeling;
Three-dimensional displays;
Sensitivity analysis;
Packaging;
Numerical simulation;
23.
Finite Element Analysis of Copper Pillar Interconnect Stress of Flip-chip Chip-Scale Package
机译:
倒装芯片芯片级封装铜柱互连应力的有限元分析
作者:
Amirul Afripin
;
Burt Carpenter
;
Torsten Hauck
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Performance evaluation;
Materials reliability;
Reliability engineering;
Electronic packaging thermal management;
Finite element analysis;
Compounds;
Flip-chip devices;
24.
Aging of the Molding Compound Identification using Piezoresistive Silicon Based Stress Sensor
机译:
使用压阻式硅基应力传感器的模塑复合鉴定老化
作者:
Alexandru Prisacaru
;
Przemyslaw Jakub Gromala
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature sensors;
Temperature measurement;
Temperature;
Aging;
Oxidation;
Silicon;
Compounds;
25.
Evaluating Local Delamination of Power Electronic Devices Through Thermal-Mechanical Analysis
机译:
通过热机械分析评估电力电子设备的局部分层
作者:
H. Huai
;
G. Laskin
;
M. Fratz
;
T. Seyler
;
T. Beckmann
;
A. Bertz
;
D. Carl
;
J. Wilde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Optical filters;
Insulated gate bipolar transistors;
Solid modeling;
Optical interferometry;
Optical variables measurement;
Optical imaging;
Adaptive optics;
26.
Infrared thermal imaging as inline quality assessment tool
机译:
红外线热成像作为内联质量评估工具
作者:
S. Panahandeh
;
D. May
;
D.R. Wargulski
;
E. Boschman
;
R. Schacht
;
M. Abo Ras
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Scanning electron microscopy;
Microscopy;
Production;
Inspection;
Tools;
Quality assessment;
Reliability;
27.
Comparison of different models of magnetic nanoparticle aggregation in microchannels with magnetic field
机译:
磁场微通道磁纳米粒子聚集模型的比较
作者:
Péter Pálovics
;
Márton Németh
;
Márta Rencz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Solid modeling;
Torque;
Computational modeling;
Microscopy;
Magnetic nanoparticles;
Predictive models;
28.
Dynamical characterisation of a miniaturised bulge tester for use at elevated temperatures
机译:
高温下使用的小型化凸起测试仪的动力学特征
作者:
U. Zschenderlein
;
H. Zhang
;
R. Ecke
;
N. Jöhrmann
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Micromechanical devices;
Temperature;
Thermomechanical processes;
Loading;
Pressure measurement;
Microelectronics;
29.
Reliability of LED-based Systems
机译:
基于LED系统的可靠性
作者:
Willem D. van Driel
;
B. Jacobs
;
P. Watte
;
X. Zhao
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Technological innovation;
Solid state lighting;
Systematics;
System integration;
Reliability engineering;
Robustness;
Product development;
30.
Robust Package Study for A Power Package by Simulation
机译:
通过模拟对电力包装的强大包装研究
作者:
Haibo Fan
;
Civen Li
;
Noorazam bin Azman
;
Peilun Yao
;
Haibin Chen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Shape;
Lead;
Tools;
Electromagnetic compatibility;
Minimization;
Delamination;
31.
Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System
机译:
基于模拟系统的高性能车辆热机械可靠性研究
作者:
Rainer Dudek
;
Ralf Döring
;
Sven Rzepka
;
Przemyslaw Gromala
;
Jens Schindele
;
Bart Vandevelde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Program processors;
Parametric study;
Computational modeling;
Creep;
Thermomechanical processes;
Computer performance;
32.
Lifetime modelling of sintered silver interconnected power devices by FEM and experiment
机译:
FEM和实验终身建模烧结银相互连接功率器件
作者:
Anu Mathew
;
Rainer Dudek
;
Alexander Otto
;
Christina Scherf
;
Sven Rzepka
;
Nilavzhagan Subbiah
;
Kashmira Arvind Rane
;
Jürgen Wilde
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Insulated gate bipolar transistors;
Silver;
Wires;
Integrated circuit interconnections;
Lead;
Finite element analysis;
Plastics;
33.
Towards Data Driven Failure Analysis Using Infrared Thermography
机译:
使用红外热成像数据驱动失效分析
作者:
Kaushal Arun Pareek
;
Daniel May
;
Mohamad Abo Ras
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Training;
Performance evaluation;
Thermomechanical processes;
Failure analysis;
Production;
Signal reconstruction;
34.
Analysis of the stress state in QFN package during four bending experiment utilizing piezoresistive stress sensor
机译:
利用压阻应力传感器的四个弯曲实验期间QFN封装应力状态分析
作者:
Daniel Riegel
;
Przemyslaw Jakub Gromala
;
Sven Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Geometry;
Temperature sensors;
Temperature measurement;
Bending;
Predictive models;
Numerical simulation;
Silicon;
35.
Simulations for nanoindentation on thin metal films and the potential influence of creep
机译:
薄金属薄膜纳米内膜的模拟及蠕变的潜在影响
作者:
N. Jöhrmann
;
R. Ecke
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Atomic measurements;
Films;
Creep;
Simulation;
Thermomechanical processes;
Metals;
Microelectronics;
36.
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
机译:
任意电力电子电气热机械可靠性评估
作者:
Mario Gschwandl
;
Martin Pfost
;
Thomas Antretter
;
Peter Filipp Fuchs
;
Ivaylo Mitev
;
Qi Tao
;
Angelika Schingale
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Loading;
Thermomechanical processes;
Tools;
Electronic packaging thermal management;
Reliability engineering;
Power electronics;
37.
Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)
机译:
先进(金属3D印刷)直接液体喷射冲洗冷却解决方案,用于自主驾驶高性能车计算机(HPVC)
作者:
Antonio Pappaterra
;
Bart Vandevelde
;
Majid Nazemi
;
Willem Verleysen
;
Herman Oprins
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Solid modeling;
Three-dimensional displays;
Program processors;
Cooling;
Computational modeling;
Metals;
38.
A comparative study of acoustic isolation configurations for pMUT array-based applications
机译:
基于PMUT阵列应用的声学隔离配置的比较研究
作者:
Bogdan Vysotskyi
;
Rachid Haouari
;
Bart Weekers
;
Grim Keulemans
;
Guilherme Brondani Torri
;
Veronique Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Filtering;
Crosstalk;
Machining;
Acoustic arrays;
Acoustics;
Microelectronics;
39.
Reliability Analysis of a RF Product with Improved Quality for the Prediction of Failure Probabilities
机译:
具有改进质量的RF产品的可靠性分析,以预测失效概率
作者:
Philippe Leduc
;
Peter Krenz
;
Roland Niemeier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Radio frequency;
Micromechanical devices;
Manufacturing processes;
Stochastic processes;
Production;
Probability;
Predictive models;
40.
Geometrically Parametrized Reduced Order Model of a Miniaturized Thermoelectric Generator for Electrically Active Implants
机译:
用于电活性植入物的小型热电发电机的几何参数化减少阶模型
作者:
Chengdong Yuan
;
Tamara Bechtold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Geometry;
Micromechanical devices;
Parametric study;
Reduced order systems;
Generators;
Software;
Parametric statistics;
41.
A Parametric Simulative Study for Lifetime Prediction of Sintered Silver Die Attach Under Different Accelerated Testing Conditions
机译:
不同加速试验条件下烧结银模具的寿命预测的参数模拟研究
作者:
Freerik Forndran
;
Jens Heilmann
;
Martin Metzler
;
Markus Leicht
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Silver;
Power system measurements;
Temperature;
Silicon carbide;
Semiconductor materials;
Thermomechanical processes;
Predictive models;
42.
Numerical and Experimental Study on Determination Method of Elastoplastic Properties for Indentation Testing
机译:
压痕试验弹塑性性能测定方法的数值实验研究
作者:
Kento Kariya
;
Noriyuki Masago
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Deformable models;
Instruments;
Mechanical variables measurement;
Microelectronics;
Finite element analysis;
Stress;
43.
Concept of a Mechanical Test Setup for Packaging Materials Using Digital Image Correlation Methods
机译:
使用数字图像相关方法包装材料的机械测试设置的概念
作者:
E. Wiss
;
D. Barth
;
S. Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature sensors;
Temperature measurement;
Micromechanical devices;
Modular construction;
Correlation;
Digital images;
Packaging;
44.
Tilt- and warpage measurement of bonded dies as an inline quality assessment tool
机译:
绑定模具的倾斜和翘曲测量作为内联质量评估工具
作者:
D. May
;
J. Heilmann
;
E. Boschman
;
M. Abo Ras
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Insulated gate bipolar transistors;
Semiconductor device measurement;
Production;
Thermal sensors;
Vibration measurement;
Tools;
45.
Vibration of Roadway Luminaires
机译:
道路灯具的振动
作者:
G. Charlston
;
M. Shiue
;
Willem D. van Driel
;
B. Jacobs
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Vibrations;
Micromechanical devices;
Computational modeling;
Computational fluid dynamics;
Microelectronics;
Acceleration;
Stress;
46.
Variability of Mechanical Cycling Durability of SAC305 Solder Joints: Model-Based Assessment using Grain-scale Modeling of Cyclic Shear Loading
机译:
SAC305焊点机械循环耐久性的可变性:使用循环剪切载荷的晶粒尺度建模基于模型的评估
作者:
Abhishek Deshpande
;
Qian Jiang
;
Abhijit Dasgupta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Uncertainty;
Loading;
Stochastic processes;
Fatigue;
Finite element analysis;
Thermal loading;
Soldering;
47.
Using AFM Measurements for Failure Indication During High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers
机译:
在MEMS悬臂上的薄金属薄膜的高循环疲劳试验期间使用AFM测量
作者:
V. Osipova
;
N. Jöhrmann
;
J. Heilmann
;
D. May
;
J. Arnold
;
T. Bieniek
;
R. Pufall
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Temperature measurement;
Films;
Surface resistance;
Metals;
Resonant frequency;
Fatigue;
48.
Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates
机译:
硅氮化硅芯片与铜基材焊接和烧结互连中应力现象的仿真和实验
作者:
E Liu
;
Fosca Conti
;
Sri Krishna Bhogaraju
;
Gordon Elger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Performance evaluation;
Analytical models;
Compressive stress;
Thermomechanical processes;
Data models;
Microelectronics;
Finite element analysis;
49.
Time-based Reliability Analysis of Electrolytic Capacitors for Automotive Applications Using Multi-Domain Simulation
机译:
多域模拟汽车应用的电解电容基于时间的可靠性分析
作者:
Philipp Adler
;
Regine Mallwitz
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Viscosity;
Analytical models;
Capacitors;
Aging;
Batteries;
Reliability;
Thermal loading;
50.
Characterization of prepreg shrinkage and investigation of its influence on warpage simulation
机译:
预浸料坯收缩特征及其对翘曲模拟影响的研究
作者:
J. Zündel
;
M. Sagerer
;
M. Frewein
;
T. Krivec
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Temperature measurement;
Transmission line matrix methods;
Temperature;
Simulation;
Thermomechanical processes;
Production;
Curing;
51.
The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts
机译:
逼真布局互连堆栈寿命时间性能估计的改进
作者:
Verena Hein
;
Kirsten Weide-Zaage
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Layout;
Integrated circuit interconnections;
Predictive models;
Tools;
Integrated circuit reliability;
Integrated circuit modeling;
52.
Finite element-based lifetime modelling of SAC solder joints in LED applications
机译:
基于有限元的LED应用中SAC焊接接头的寿命建模
作者:
M. Shaygi
;
M. Li
;
K.J. Lang
;
H. Laux
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Uncertainty;
Thermomechanical processes;
Light emitting diodes;
Thermal management;
Microelectronics;
Finite element analysis;
53.
IC package related stress effects on the characteristics of ring oscillator circuits
机译:
IC封装相关应力对环形振荡电路特性的影响
作者:
S. Schlipf
;
C. Sander
;
A. Clausner
;
J. Paul
;
S. Capecchi
;
L. Wambera
;
K. Meier
;
E. Zschech
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Ring oscillators;
Thermomechanical processes;
Silicon-on-insulator;
Bending;
Transistors;
Integrated circuit modeling;
Stress;
54.
Thermal Analysis of Microfluidic cooling in Processing-in-3D-Stacked Memory
机译:
加工3D堆叠记忆中微流体冷却的热分析
作者:
Jun-Han Han
;
Karina Torres-Castro
;
Robert E. West
;
Nathan Swami
;
Mircea Stan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Power system measurements;
Solid modeling;
Three-dimensional displays;
Power demand;
Density measurement;
Coolants;
Thermal analysis;
55.
A Piezoelectric MEMS Loudspeaker Lumped and FEM models
机译:
压电MEMS扬声器集体和有限元模型
作者:
Romain Liechti
;
Stéphane Durand
;
Thierry Hilt
;
Fabrice Casset
;
Christel Dieppedale
;
Thierry Verdot
;
Mikaël Colin
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Loudspeakers;
Simulation;
Piezoelectric actuators;
Bandwidth;
Bending;
Acoustics;
56.
Transient pull-in simulation of electrostatic microvalve with physics-based contact function
机译:
基于物理的接触功能的静电微仪模拟
作者:
Grim Keulemans
;
Boshen Liang
;
Alexey Podkovskiy
;
Shruti Jambaldinni
;
Dominika Wysocka
;
Lei Zhang
;
Tim Stakenborg
;
David Cheyns
;
Paul Heremans
;
Veronique Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Microvalves;
Stability analysis;
Sensors;
Microelectronics;
Mathematical model;
Transient analysis;
57.
Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test
机译:
通过3 PB测试,4H-SIC模具的失效力量分析
作者:
Antonio Landi
;
Aye Aye Mon
;
Laura Liaci
;
Alessandro Sitta
;
Michele Calabretta
;
Antonella Sciuto
;
Giuseppe D’Arrigo
;
Marco Renna
;
Vincenzo Vinciguerra
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Young's modulus;
Silicon carbide;
Atmospheric measurements;
Gain measurement;
Particle measurements;
Surface roughness;
Rough surfaces;
58.
Deep Learning of the SSL Luminaire Spectral Power Distribution under Multiple Degradation Mechanisms by Hybrid kNN algorithm
机译:
用混合核对算法在多重降解机制下SSL灯具光谱配电的深度学习
作者:
Cadmus Yuan
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Degradation;
Training;
Neural networks;
Thermal engineering;
Power distribution;
Predictive models;
Logic gates;
59.
Comparison of cooling performance of manifold and straight microchannel heat sinks using CFD simulation
机译:
使用CFD仿真比较歧管和直微通道散热器的冷却性能
作者:
Piotr Zając
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Manifolds;
Micromechanical devices;
Manufacturing processes;
Fluid flow;
Thermal management;
Microelectronics;
Heat sinks;
60.
Invited Talk: Simulation-Based Design and Optimization for Future Mobility Electronics Systems
机译:
邀请谈话:对未来移动电子系统的基于仿真的设计和优化
作者:
Ercan M. Dede
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2021年
关键词:
Micromechanical devices;
Power system measurements;
Electronic components;
Topology;
Numerical models;
Microelectronics;
Electromagnetics;
61.
Analysis of SiC Schottky diodes after thermal vacuum test by means of lock-in infrared thermography
机译:
通过锁定红外热成像通过锁定热真空测试后SiC肖特基二极管分析
作者:
M. Vellvehi
;
X. Perpi?à
;
O. Avi?ó
;
C. Ferrer
;
N. Fusté
;
D. Sánchez
;
X. Jordà
;
P. Godignon
;
S. Massetti
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Silicon carbide;
Schottky diodes;
Semiconductor device measurement;
Space vehicles;
Mercury (planets);
Modulation;
Thermal analysis;
62.
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
机译:
超声波粘结工艺优化MATLAB和ANSYS的共模
作者:
Reinhard Schemmel
;
Viktor Krieger
;
Tobias Hemsel
;
Walter Sextro
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Xenon;
63.
Simulation-Based Analysis of Thermo-Mechanical Constraints in Packages for Diamond Power Devices
机译:
仿真基于钻石电源封装热机械约束的分析
作者:
N. Fusté
;
O. Avi?ó
;
M. Vellvehi
;
X. Perpi?à
;
P. Godignon
;
R. Seddon
;
I. Obieta
;
J. Maudes
;
X. Jordà
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Strain;
Diamond;
Stress;
Mathematical model;
Finite element analysis;
Multichip modules;
Thermomechanical processes;
64.
Analytical multi-step homogenization methodology for a stack of thin films in microelectronics
机译:
微电子中薄膜薄膜的分析多步均质方法
作者:
H. F. Miled
;
F. Roqueta
;
J. C. Craveur
;
E. Le Bourhis
;
P. Gardes
;
A. Tougui
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Stress;
Semiconductor device modeling;
Substrates;
Computational modeling;
Analytical models;
Mathematical model;
Strain;
65.
3-D FEM Investigation on Electrical Ruggedness of Double-Sided Cooled Power Modules
机译:
三维双面冷却电源模块电气坚固性的有限元调查
作者:
C. Scognamillo
;
A. P. Catalano
;
R. Trani
;
V. d’Alessandro
;
A. Castellazzi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Finite element analysis;
Silicon carbide;
Reliability;
Multichip modules;
Substrates;
Electric fields;
Insulators;
66.
Optimization of thermal load distribution in accelerated temperature cycling tests for solder joint lifetime qualification tests
机译:
焊接寿命验证试验加速温度循环试验中热负荷分布的优化
作者:
Jonas Gleichauf
;
Youssef Maniar
;
Roumen Ratchev
;
Sebastian Spring
;
Steffen Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Soldering;
Temperature distribution;
Heat transfer;
Thermal loading;
Iron;
Load modeling;
Testing;
67.
Predicting of luminous flux for a LED array using artificial neural network
机译:
使用人工神经网络预测LED阵列的光通量
作者:
Yixing Cao
;
Weiyi Yuan
;
Wei Chen
;
Min Li
;
Jiajie Fan
;
Guoqi Zhang
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Light emitting diodes;
Artificial neural networks;
Temperature measurement;
Lighting;
Couplings;
Training;
68.
Chip Package Interaction (CPI) Stress Modeling
机译:
芯片包交互(CPI)应力建模
作者:
Kashi Vishwanath Machani
;
Frank Kuechenmeister
;
Dirk Breuer
;
Jens Paul
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Semiconductor device modeling;
Load modeling;
Data models;
Copper;
Finite element analysis;
Silicon;
Substrates;
69.
Residual Stress Characterisation of Thin Sputtered Copper Films on Silicon Exploiting Membrane Resonance within a Specimen Centred Approach
机译:
硅剥削膜共振薄溅射铜膜的残余应力表征在标本居中方法中
作者:
B. Wunderle
;
P. Meszmer
;
A. Mohnot
;
M. Tavakolibasti
;
N. J?hrmann
;
U. Zschenderlein
;
J. Arnold
;
S. Voigt
;
J. Mehner
;
R. Ecke
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
70.
Vibrational fatigue calculation-process for solder joints with FEMFAT spectral
机译:
具有Femfat光谱的焊接接头的振动疲劳计算过程
作者:
Harald Ziegelwanger
;
Walter Hinterberger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Pins;
Soldering;
Fatigue;
Static analysis;
Solid modeling;
Databases;
71.
Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics
机译:
AG烧结接头的可靠性评估使用SIC半导体和电力电子领域的故障机制测定
作者:
Marco Schaal
;
Markus Klingler
;
Benjamin Metais
;
Ralph Grüninger
;
Stefan Hoffmann
;
Bernhard Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Failure analysis;
Silicon carbide;
Strain;
Plastics;
Temperature distribution;
Microassembly;
72.
System Software Reliability
机译:
系统软件可靠性
作者:
Willem D. Van Driel
;
J.W. Bikker
;
M. Tijink
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Software;
Software reliability;
Computer bugs;
Mathematical model;
Software testing;
73.
Comparing prediction methods for LED failure measured with Transient Thermal Analysis
机译:
用瞬态热分析测量LED故障预测方法
作者:
Andreas Zippelius
;
Alexander Han?
;
E Liu
;
Maximilian Schmid
;
Judith Pérez-Velázquez
;
Gordon Elger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Temperature measurement;
Artificial neural networks;
Light emitting diodes;
Aging;
Current measurement;
Training;
Heating systems;
74.
CFD Simulations of Reactive Multi-Layer Usage in Joining Processes
机译:
加入过程中反应多层使用的CFD模拟
作者:
A. Yuile
;
S. Wiese
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Heating systems;
Temperature measurement;
Nonhomogeneous media;
Solid modeling;
Probes;
Microelectronics;
Substrates;
75.
Solder joint reliability risk estimation by AI modeling
机译:
AI建模的焊接联合可靠性风险估算
作者:
Cadmus Yuan
;
Chang-Chi Lee
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Soldering;
Computer architecture;
Finite element analysis;
Neurons;
Load modeling;
Artificial neural networks;
Reliability;
76.
Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations
机译:
印刷电路板中铜的弹性塑料和疲劳性能:从实验表征到数值模拟
作者:
Gautier Girard
;
Marion Martiny
;
Sébastien Mercier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Copper;
Strain;
Fatigue;
Loading;
Substrates;
Load modeling;
Plastics;
77.
Simulation of Fatigue Damage in Clusters of DMOS Cells Subjected to Non-Uniform Transient Thermo-Mechnical Loading
机译:
非均匀瞬时热机械负荷对DMOS细胞簇簇抗疲劳损伤的模拟
作者:
Paul Hoffmann
;
Michael Nelhiebel
;
Balamurugan Karunamurthy
;
Heinz E. Pettermann
;
Melanie Todt
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Fatigue;
Transient analysis;
Loading;
Temperature;
Finite element analysis;
Thermal loading;
Thermal analysis;
78.
Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
机译:
热循环载荷下安装试验组件上的焊料疲劳分析
作者:
R. Dudek
;
M. Hildebrandt
;
K. Krey?ig
;
S. Rzepka
;
R. D?ring
;
L. Scheiter
;
M. Zhang
;
R. W. Ortmann
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Temperature measurement;
Strain;
Transient analysis;
Loading;
Stress;
Fasteners;
Load modeling;
79.
Stress-induced Vertical Deformations in state-of-the-art Power Modules: an Improved Electro-thermo-mechanical Approach
机译:
最先进的电力模块中应力诱导的垂直变形:改进的电热 - 热机械方法
作者:
A. P. Catalano
;
O. Olanrewaju
;
C. Scognamillo
;
V. d’Alessandro
;
A. Castellazzi
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Stress;
Strain;
Multichip modules;
Silicon carbide;
Reliability;
Tools;
Power electronics;
80.
Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling
机译:
热载板光谱:使用FEM和热建模的热阻抗模拟
作者:
Mohamad El Khatib
;
Sven Reitz
;
Jens Warmuth
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Temperature measurement;
Semiconductor device measurement;
Electronic packaging thermal management;
Solid modeling;
Heating systems;
Thermal sensors;
Adaptation models;
81.
Thermal Aspects of Silicon Photonic Interposer Packages
机译:
硅光子插入器包装的热方面
作者:
Herman Oprins
;
Yoojin Ban
;
Vladimir Cherman
;
Joris Van Campenhout
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Silicon;
Photonics;
Integrated optics;
Integrated circuits;
Thermal analysis;
Modulation;
Heating systems;
82.
Identification of influencing PCB design parameters on thermal performance of a QFN package
机译:
影响PCB设计参数对QFN封装热性能的识别
作者:
Kai Hollstein
;
Lintao Yang
;
Yuan Gao
;
Kirsten Weide-Zaage
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Heating systems;
Temperature distribution;
Thermal analysis;
Electronic packaging thermal management;
Thermal conductivity;
Copper;
Microelectronics;
83.
Determining adhesion of critical interfaces in microelectronics – a reverse Finite Element Modelling approach based on nanoindentation – Part I
机译:
测定微电子临界界面的粘附 - 一种基于纳米凸缘的反向有限元建模方法 - 第I部分
作者:
G.M. Reuther
;
J. Albrecht
;
R. Pufall
;
R. Dudek
;
S. Rzepka
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Load modeling;
Stress;
Delamination;
Finite element analysis;
Silicon;
Silicon compounds;
Adhesives;
84.
An integrated approach to optimize solder joint reliability
机译:
优化焊点可靠性的综合方法
作者:
Alessandro Sitta
;
Sebastiano Russo
;
Marco Torrisi
;
Angelo Alberto Messina
;
Giuseppe D’Arrigo
;
Gaetano Sequenzia
;
Marco Renna
;
Michele Calabretta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Reliability;
Soldering;
Stress;
Lead;
Finite element analysis;
Scanning electron microscopy;
Optical imaging;
85.
Lateral charge partitioning across the internal base resistance for modelling distributed dynamic lateral effect in SiGe HBTs during large signal switching
机译:
在大信号切换期间,横跨内部基电阻划过内部底座电阻,用于在SiGe Hbts中建模分布式动态横向效应
作者:
R. Salvato
;
M. Krattenmacher
;
C. Rubino
;
V. d’Alessandro
;
M. Schr?ter
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Integrated circuit modeling;
Computational modeling;
Transistors;
Resistance;
Switches;
Solid modeling;
86.
Loading and Healing method to study liquid-assisted healing properties of cyclic failed bulk solder
机译:
加载和愈合方法研究循环失败散装焊料的液体辅助愈合特性
作者:
David Melinc
;
Julien Magnien
;
Georg Siroky
;
Dietmar Kieslinger
;
Ernst Kozeschnik
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Manganese;
87.
Mechanical Characterization of Polysilicon MEMS Devices: a Stochastic, Deep Learning-based Approach
机译:
多晶硅MEMS装置的机械表征:一种随机,深基于学习的方法
作者:
José Pablo Quesada Molina
;
Luca Rosafalco
;
Stefano Mariani
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Training;
Data models;
Microstructure;
Micromechanical devices;
Aggregates;
Task analysis;
Scattering;
88.
Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
机译:
虚拟原型设计,可靠性设计,以及FOWLP线的完整SIP产品组合的资格
作者:
Ghanshyam Gadhiya
;
Heikki Kuisma
;
André Cardoso
;
Birgit Br?mer
;
Sven Rzepka
;
Thomas Otto
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Strain;
Finite element analysis;
Reliability engineering;
Creep;
Automotive engineering;
Load modeling;
89.
Nanoindentation as part of material characterization of thin metal films
机译:
作为薄金属膜的材料表征的一部分作为纳米indentation
作者:
N. J?hrmann
;
R. Ecke
;
B. Wunderle
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Nickel;
Substrates;
Load modeling;
Young's modulus;
Microelectronics;
Pollution measurement;
90.
FEM-study for Solder Model Comparison on Solder Joints Stress-Strain Effects
机译:
对焊点应力效应的焊点模型比较的有限元研究
作者:
R. Schwerz
;
R. Metasch
;
M. Roellig
;
K. Meier
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Strain;
Creep;
Stress;
Temperature measurement;
Numerical models;
Mathematical model;
Load modeling;
91.
Design of a micro-opto-mechanical ultrasound sensor for photoacoustic imaging
机译:
光声成像微光机械超声波传感器的设计
作者:
Maja Zunic
;
Wouter J. Westerveld
;
Pieter Gijsenbergh
;
Yongbin Jeong
;
Alessio Miranda
;
John O’Callaghan
;
Hamideh Jafarpoorchekab
;
Emmanuel Vander Poorten
;
Xavier Rottenberg
;
Roelof Jansen
;
Veronique Rochus
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Resonant frequency;
Ultrasonic imaging;
Analytical models;
Frequency measurement;
Optical waveguides;
Sensitivity;
Method of moments;
92.
The Effect of Low Temperature Conditions on Vibration Durability of SAC105 Interconnects
机译:
低温条件对SAC105互连振动耐久性的影响
作者:
Maximilian Ochmann
;
David Leslie
;
Karsten Meier
;
Abhijit Dasgupta
;
Karlheinz Bock
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Vibrations;
Strain;
Soldering;
Isothermal processes;
Temperature measurement;
Fatigue;
Temperature;
93.
Mechanical characterization and modeling of different pad structures
机译:
不同垫结构的机械表征和建模
作者:
Michele Calabretta
;
Daniele Guarnera
;
Alessandro Sitta
;
Marco Renna
;
Antonella Sciuto
;
Giuseppe D’Arrigo
;
Salvatore Massimo Oliveri
;
Gaetano Sequenzia
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Stress;
Tungsten;
Dielectrics;
Manganese;
Load modeling;
Layout;
94.
Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras
机译:
有限元分析:汽车摄像机锐度变化的工具
作者:
Amit Pandey
;
Stephan Kühn
;
Hüseyin Erdogan
;
Klaus Schneider
;
Gordon Elger
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Solid modeling;
Creep;
Load modeling;
Lenses;
Optical imaging;
Optical sensors;
Cameras;
95.
Solder Crack Improvement For A Power Package During TCT And PTC By Simulation
机译:
通过模拟在TCT和PTC期间电源包装的焊接裂纹改进
作者:
Haibo Fan
;
Tim Boettcher
;
Civen Li
;
Eric Cheam
;
Jun Yang
;
Haibin Chen
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
96.
Thermal measurement and numerical analysis for automotive power modules
机译:
汽车电源模块的热测量和数值分析
作者:
Alessandro Sitta
;
Marco Renna
;
Angelo Alberto Messina
;
Gaetano Sequenzia
;
Giuseppe D’Arrigo
;
Michele Calabretta
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Temperature measurement;
Multichip modules;
Reliability;
Silicon carbide;
MOSFET;
Temperature sensors;
Microassembly;
97.
Design Optimization of a Miniaturized Thermoelectric Generator
机译:
小型热电发电机的设计优化
作者:
Chengdong Yuan
;
Dennis Hohlfeld
;
Tamara Bechtold
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Mathematical model;
Computational modeling;
Heating systems;
Legged locomotion;
Heat transfer;
Skin;
98.
Thermal resistance characterization of GaN power HEMTs on Si, SOI, and poly-AlN substrates
机译:
Si,SOI和Poly-Aln基板上GaN功率HEMTS的热阻表征
作者:
Alessandro Magnani
;
Thibault Cosnier
;
Nooshin Amirifar
;
Ming Zhao
;
Xiangdong Li
;
Karen Geens
;
Stefaan Decoutere
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Temperature measurement;
Substrates;
Thermal resistance;
Electrical resistance measurement;
Silicon;
Fingers;
99.
Modelling and Simulating the Effect of the Different Geometric Parameters on Voltage-Current Characteristics for Wire-Plate Electrostatic Precipitator with Different Collector Configurations
机译:
不同几何参数对不同收集器配置的电压电流特性的建模与模拟效果
作者:
Abdallah Mansour
;
Mohamed Badran
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Wires;
Discharges (electric);
Electric fields;
Electrodes;
Mathematical model;
Electric potential;
Corona;
100.
Wavy Cantilever RF-MEMS Switch based on Bidirectional Control of Intrinsic Stress
机译:
基于内在应力的双向控制的波浪悬臂RF-MEMS开关
作者:
Heba Saleh
;
Rayan Bajwa
;
Ibrahim Tekin
;
Murat Kaya Yapici
会议名称:
《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》
|
2020年
关键词:
Radio frequency;
Stress;
Insertion loss;
Microswitches;
Finite element analysis;
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