Going Cooler With Timing-Constrained TeSHoP: A Temperature Sensing-Based Hotspot-Driven Placement Technique for FPGAs

摘要

The continuous shrinking of the feature size in CMOS technology has significantly increased the power densities of integrated circuits, leading to severe temperature issues. However, the previous offline simulation-based thermal optimization works cast large deviations with the reality, while online sensing-based thermal managements usually incur significant performance overhead. Therefore, it is crucial to propose a method that could achieve fine-grained optimization with accurate temperature profiles. In this paper, we propose a timing-constraint temperature sensing-based hotspot-driven placement technique for field-programmable gate arrays (FPGAs). The hotspot optimization issue is modeled as a hyper minimum bipartite matching problem and is solved by a place adjustment with the input of an online sensed temperature profile. We propose an open-source/commercial hybrid design flow to implement the whole optimization in Xilinx Virtex-6 FPGA. Experimental results demonstrate a significant reduction in peak temperature and a great improvement on thermal uniformity, with slight performance overhead under timing constraints.