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首页> 外文期刊>Transactions of Nonferrous Metals Society of China >Preparation of salt-based colloid palladium of high concentration
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Preparation of salt-based colloid palladium of high concentration

机译:高浓度盐基胶体钯的制备

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A kind of salt-based colloid palladium of high concentration was prepared, with concentration up to 3. 6 g/L on amount of PdCl_2. The optimal preparation conditions of the salt-based colloid palladium were that the PdCl_2 and NaCl concentrations were respectively 3. 6 g/L and 175 g/L, mole ratio of Sn to Pd was 50:1, reaction temperature was 20 -35 deg C, with urea, ascorbic acid and vanillin added in a proper amount. The test results of optimal condition show that the time of starting hydrogen-deposition is 9 s, the time of completely coating copper on a test substrate is 2 min, the stability time of colloid palladium is 98 h after it is diluted into 0. 1 g/L(on amount of PdCl_2) when the solution temperature is 20 deg C , the backlight lever of electroless copper plating layer is 10th grade of 10-grade system, the adhesion force of the copper layer is up to GB5270-85 of China, and the average particle size of the colloid palladium is 81 nm measured by Master Sizer.
机译:制备了一种高浓度的盐基胶体钯,其相对于PdCl_2的浓度最高为3. 6 g / L。盐基胶体钯的最佳制备条件为:PdCl_2和NaCl的浓度分别为3. 6 g / L和175 g / L,Sn与Pd的摩尔比为50:1,反应温度为20 -35 deg C,以适量添加尿素,抗坏血酸和香草醛。最佳条件的测试结果表明,开始氢沉积的时间为9 s,将铜完全涂覆在测试基板上的时间为2 min,稀释至0后的胶体钯的稳定时间为98 h。1溶液温度为20℃时,g / L(以PdCl_2计),化学镀铜层的背光杆为10级10级体系,铜层的附着力达到GB5270-85 ,并且通过Master Sizer测量的胶体钯的平均粒径为81 nm。

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