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Strain relaxation processes in strained-Si layer on SiGe-on-insulator substrates

机译:绝缘体上硅锗衬底上的应变硅层中的应变松弛过程

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Misfit defects in strained Si layers on SiGe-on-insulator (SGOI) substrates were studied by transmission electron microscopy. With increasing the strained layer thickness, stacking faults, extending from the Si surface to the strained-Si/SiGe interface, with 90 degrees Shockley partial dislocations at the interfaces were found to be increasingly formed in the strained Si layers. This fact indicates that the cumulative tensile strain in strained Si layers on SGOI substrates causes generation and glide on {111} planes of the 90 degrees partial dislocations, leading to the relaxation of the strained Si layers. A density of Shockley partial dislocations at the Si/SiGe interface was found to depend on surface cleaning of SiGe layers prier to the epitaxial growth of strained Si layers. An interfacial nucleation of Shockley partial dislocations is discussed. (c) 2005 Elsevier BX All tights reserved.
机译:通过透射电子显微镜研究了绝缘体上硅锗(SGOI)衬底上应变硅层中的失配缺陷。随着应变层厚度的增加,发现从硅表面延伸到应变Si / SiGe界面的堆叠缺陷,在界面处具有90度Shockley部分位错,在应变Si层中越来越多地形成。该事实表明,在SGOI衬底上的应变Si层中的累积拉伸应变引起90度部分位错的{111}平面上的产生和滑动,从而导致应变Si层的弛豫。发现在Si / SiGe界面处Shockley部分位错的密度取决于对应变Si层的外延生长更有利的SiGe层的表面清洁。讨论了肖克利局部位错的界面成核。 (c)2005 Elsevier BX版权所有。

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