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机译:通过Al沉积控制缺陷,并随后对具有不同Ge分数的绝缘体上SiGe衬底进行后退火
Art, Science and Technology Center/or Cooperative Research, Kyushu University, 6-1 Kasuga-koen, Kasuga, Fukuoka 816-8580, Japan;
Art, Science and Technology Center/or Cooperative Research, Kyushu University, 6-1 Kasuga-koen, Kasuga, Fukuoka 816-8580, Japan;
Art, Science and Technology Center/or Cooperative Research, Kyushu University, 6-1 Kasuga-koen, Kasuga, Fukuoka 816-8580, Japan;
Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, 6-1 Kasuga-koen, Kasuga, Fukuoka 816-8580, Japan;
Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, 6-1 Kasuga-koen, Kasuga, Fukuoka 816-8580, Japan;
Interdisciplinary Graduate School of Engineering Sciences, Kyushu University, 6-1 Kasuga-koen, Kasuga, Fukuoka 816-8580, Japan;
SiGe-on-insulator; Ge condensation; defect passivation; acceptor concentration; interface-trap density;
机译:通过Al_2O_3沉积和随后的后退火,有效地钝化了富Ge的绝缘体上SiGe衬底中的缺陷
机译:Al_2O_3沉积和随后的沉积后退火钝化Ge-rich SiGe-on-绝缘体中的电活性缺陷
机译:绝缘体上SiGe虚拟衬底制造过程中产生的缺陷的光致发光评估:温度上升过程
机译:通过MBE生长和热退火制备高Ge分数的弛豫绝缘体上SiGe虚拟衬底
机译:非淀粉直链淀粉含量的无壳大麦碾磨部分中非淀粉多糖的分布和结构变化,以及随后的烘焙程序,以将高膳食纤维的大麦碾磨部分掺入面包中。
机译:基于WO3前驱体滴铸底材的化学气相沉积法方便可控制地合成大面积单层WS2薄片
机译:Al2O3沉积和后续退火后富含富含GE富含SiGe-on-Insululator基材的缺陷的钝化
机译:使用晶片键合技术创建无缺陷高Ge含量(25%)siGe-on-Insulator(sGOI)衬底的方法。