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Junction formation in chalcopyrite solar cells by sputtered wide gap compound semiconductors

机译:溅射宽间隙化合物半导体在黄铜矿太阳能电池中形成结

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摘要

In an effort to eliminate the CdS buffer layer and its costly preparation process we are considering sputtered buffer layers. In particular, we report in this contribution on the reactive sputtering of wide gap Zn(O,S) compound semiconductors and their application in solar cells with different types of chalcopyrite absorbers. While we were able to freely adjust the composition through the oxygen partial pressure, the structural and optical properties are superior when the composition is close to the ternary endpoints. Open circuit voltage and short circuit current density as a function of Sulphur content in the buffer show opposite trends. Working cells were achieved with low band gap as well as wide band gap absorbers, however, their performance is so far inferior to that of the standard stacks.
机译:为了消除CdS缓冲层及其昂贵的制备过程,我们正在考虑溅射溅射缓冲层。特别是,我们报告了这种对宽间隙Zn(O,S)化合物半导体的反应溅射及其在具有不同类型黄铜矿吸收剂的太阳能电池中的应用的贡献。尽管我们能够通过氧分压自由调节组成,但当组成接近三元终点时,其结构和光学性能会更好。开路电压和短路电流密度与缓冲器中硫含量的关系显示出相反的趋势。用低带隙吸收器和宽带隙吸收器实现了工作单元,但是,到目前为止,它们的性能均不如标准电池组。

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  • 来源
    《Thin Solid Films》 |2011年第4期|p.1330-1333|共4页
  • 作者单位

    Helmholtz-Zentrum Berlin fur Materialien und Energie GmbH, Hahn-Meitner-Platz 1, D14109 Berlin, Germany;

    Helmholtz-Zentrum Berlin fur Materialien und Energie GmbH, Hahn-Meitner-Platz 1, D14109 Berlin, Germany;

    Helmholtz-Zentrum Berlin fur Materialien und Energie GmbH, Hahn-Meitner-Platz 1, D14109 Berlin, Germany;

    Helmholtz-Zentrum Berlin fur Materialien und Energie GmbH, Hahn-Meitner-Platz 1, D14109 Berlin, Germany;

    SULFURCELL Solartechnik GmbH, Gross-Berliner Damm 149, D12487 Berlin, Germany;

    AVANC1S GmbH & Co. KG, Otto-Halm Ring 6, D81739 Munchen, Germany;

    AVANC1S GmbH & Co. KG, Otto-Halm Ring 6, D81739 Munchen, Germany;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    chalcopyrite thin-film solar cells; heterojunction; cd-free buffer; sputtering; TCO;

    机译:黄铜矿薄膜太阳能电池;异质结免CD缓冲区;溅射总拥有成本;

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