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摘要

In an era when all kinds of electronic components are becoming more complex and ever smaller, conventional 2D test methods are reaching their limits because they do not cover the entire range of defects, such as an incorrect pin height,' said Dieter A Riehl, managing shareholder of Sirius Advanced Cybernetics (SAC). According to Riehl, the key factor when soldering surface-mounted devices (SMDs) is their coplanarity. 'In order to attain this coplanarity, all three spatial axes - X, Y and Z - must be measured. This is just one of many examples in which 3D machine vision test methods prove their advantages.