To Void or Not to Void?

摘要

During its three-year, multi-million-dollar reliability study on lead-free solder, the IPC Solder Products Value Council (SPVC) found that solder voiding has no impact on solder joint reliability. This article highlights results of the study. The IPC Solder Products Value Council (SPVC) conducted a reliability study to determine if the tin/silver/copper (SAC) alloy family of lead-free alloys had equivalent performance in assembly, metallographic analysis and baseline characterization, thermal shock, and temperature cycling. The SPVC concluded that all three SAC alloys had comparable performance, and the council recommended SAC 305 as the default lead-free alloy for use by the electronics industry.