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The technical considerations of extending optical lithography

机译:扩展光学光刻的技术考虑

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It is commonly accepted that optical lithography, including 157nm wavelength exposure, will enable manufacturing at the 70nm node. Translating the industry's official roadmap to an exposure tool roadmap, it is obvious that new wavelengths and optics with extremely high numerical aperture will be necessary. With the advance of the latter, depth of focus decreases and focus control becomes more critical. Polarization effects on both the reticle and the resist film must be critically reviewed for numerical apertures exceeding 0.8. Nevertheless, optical extension should preferably be supported by reduced field and large magnification scanners and is expected to take next-generation lithography to at least the 70nm node. Beyond this, next-generation lithography must be both technically feasible and cost-effective.
机译:公认的是,包括157nm波长曝光在内的光刻技术都可以在70nm节点上制造。将行业的官方路线图转换为曝光工具路线图,很明显,将需要具有极高数值孔径的新波长和光学器件。随着后者的发展,聚焦深度减小并且聚焦控制变得更加关键。对于超过0.8的数值孔径,必须严格审查标线片和抗蚀剂膜上的偏振效应。尽管如此,光学扩展最好应由缩小的视野和大倍率的扫描仪来支持,并有望将下一代光刻技术至少带到70nm节点。除此之外,下一代光刻技术必须在技术上可行且具有成本效益。

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