Elpida Memory, the Tokyo-based joint venture of NEC and Hitachi, plans to construct a 300mm DRAM plant at NEC Hiroshima Ltd., in Hiroshima. Construction of the new fab was set to begin in January, with volume production of 256Mb DRAM devices using 0.13μm technologies slated to begin in the first half of 2002. Maximum capacity of the new fab is expected to reach 20,000 300mm wafers/month, the equivalent of 48,000, 200mm wafers/month. The new plant will have total floor space of 22,000 m~2, with cleanroom floor space of 17,700 m~2.
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