Next-generation abrasive particles for CMP

摘要

As IC device structures become more complex and more CMP steps are added to manufacturing these devices, CMP process yield comes under greater scrutiny. Abrasive particles are critical to achieving controlled material removal without sacrificing planarity and can offer both mechanical and chemical functionality to the polishing slurry. Along with their benefits, however, abrasive particles are a contributor to yield-affecting defects. Though nanoscale particles have long been utilized as CMP abrasives, a new generation of nanoparticle abrasives are being explored and developed to meet the demands of more advanced technology nodes.