Thermal management: A hot topic at the nanoscale level

摘要

Thermal management is an increasingly serious problem that could hinder the successful development and operation of next-generation electronic devices. With continued scaling, heat-transport problems will aggravate at all levels, including the individual junctions on the transistors, chip, and overall system. Emerging devices are still in their infancy and far from integration; thermal issues have been virtually unexplored. The key to addressing them is a good understanding of energy and charge transport across space scales (from nanometers to centi-meters) and time scales (from picoseconds to seconds).