Ultralow-k CMP

摘要

Introduction of porous ultralow-k (ULK) materials poses challenges, such as poor mechanical properties due to porosity, that affect all unit processes, including CMP. Minimizing and eliminating low-k damage are the primary concerns. CMP-induced ULK damage on blanket, single-level, and multilevel metal stacks was studied using surface, spec-troscopic, and electrical characterization techniques.