Using a single-wafer spin system to prevent dielectric film peeling

摘要

The challenges associated with modern wafer processing in semiconductor manufacturing are being driven by an increase in the number of processing steps, increasing complexity of device technologies, process integration flows, and new materials incorporation. An increase in the number and variation of toolsets necessary in high-volume manufacturing also increases the risk of cross-contamination with subsequent loss of yield and device performance. Of particular concern are the wafer backside and bevel edge, which can be sites for contamination due to handling and unintentional processing. A process optimization is presented for bevel edge removal of low-k films using a spin processor to prevent peeling of the film material from the wafer bevel edge during subsequent anneal and deposition steps.