Using existing production tools for low-cost thin wafer handling

摘要

In 2003, NXP CAEN opened a new pilot line dedicated to innovative solutions in sys-tem-in-a-package (SIP) on 150mm wafers. For metallization, the challenge was to enable the front- and backside metallization on silicon wafers thinned to 200um without expensive modifications to the existing standard wafer processing equipment. Handling and processing of thin, fragile silicon wafers was demonstrated on a four-chamber MRC Eclipse Mark II sputtering system using a mobile electrostatic chuck technology [1, 2] by ProTec Process Systems GmbH. No modification to the Eclipse system was necessary to enable thin wafer handling.