Commercializing a WLCSP passivation layer solution

摘要

Russell Stapleton, senior staff scientist at Lord Corp., gave SST a summary of his Aug. 26 presentation at the Arizona chapter of IMAPS (International Microelectronics and Packaging Society) concerning the company's first-generation passivation layer solution for wafer-level chipscale packaging (WLCSP), expected to be commercialized in 1Q10.rnBecause WLCSP is often used for mobile devices and consumer products, cost is arnmajor driver.