SST editors interviewed dozens of executives and analysts about a wide variety of topics and technologies at SEMICON West/Intersolar.rnGlobalFoundries and Brewer Science describe how developer-soluble gap-fill materials offer several advantages when implemented in the via-first, trench-last OPL integration flow including an increased photolithography process window.
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机译：SST编辑在SEMICON West / Intersolar上就数十种主题和技术采访了数十位高管和分析师。rnGlobalFoundries和Brewer Science描述了可溶于显影剂的间隙填充材料如何在先行，后沟槽的OPL中实施时具有多种优势集成流程，包括增加的光刻工艺窗口。
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