AMAT's DRAM fab tools for denser transistors

摘要

Applied Materials debuted three systems at SEMICON West for next-generation DRAM chip manufacturing: the Centura DPN HDTM system to improve the gate insulator scaling, the Endura HAR Cobalt PVD system for high-aspect-ratio (HAR) contact structures, and the Endura Versa XLR W PVD system for reduced gate stack resistance. (Also at SEMICON West, Applied decloaked a new Vantage Vulcan RTP tool for 2Xnm with backside wafer heating, and a new deposition and UV curing toolset for 22nm interconnects.)