Understanding shape-dependent mask CD uniformity

摘要

As process technologies approach 20nm-and-below nodes, the application of new mask manufacturing technologies such as MB-MDP, MPC, dose modulation and circular shots can have critical influence on shape-dependent mask CDU, which in turn impacts design rules and/or wafer quality. More than ever before, the mask manufacturing techniques used for any given design can now have far-reaching impact on the output of the entire design-to -manufacturing chain.