A single-wafer cleaning solution for 3D-IC/TSVs, advanced packaging, MEMS and compound semiconductor applications

摘要

EV Group and Dynaloy, LLC introduced CoatsClean-an single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, MEMS and compound semiconductor markets. The CoatsClean process and chemical formulation are engineered to perform at higher temperatures, resulting in faster stripping rates and cycle times. This enables CoatsClean to operate as a single-wafer process for thick resist films and difficult-to-remove resists-resulting in improved performance, consistency, reproducibility and repeatability. The engineered formulation also enables selective stripping of the resist.