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High frequency BJT: modeling, and parameter extraction from simple measurements on encapsulated devices

机译:高频BJT:从封装设备的简单测量中建模和参数提取

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摘要

This paper develops measurement procedures for extracting the critical structural parameters of an encapsulated high frequency bipolar transistor from simple measurements. Encapsulated devices can be readily handled and included in a test set up, and the present work obviates the need to fabricate and measure separate simpler test structures for parameter extraction. The parameters extracted are: emitter stripe width and area, epitaxial collector doping, resistivity and width, emitter and collector junction depths, peak base doping, impurity gradient of the emitter junction, oxide thickness and fixed charge, and package parasitic capacitances. The material parameters and the readily observable planar dimensions such as emitter stripe length and metal pad areas are used as input parameters in the extraction procedure. The work re-inforces recent insights into the nature of current flow across the epitaxial collector width of a real device at the onset of base widening effects, as the terminal collector-base voltage is varied.
机译:本文开发了一种测量程序,可从简单的测量中提取封装的高频双极晶体管的关键结构参数。封装的设备可以很容易地处理并包含在测试装置中,并且本发明消除了制造和测量用于参数提取的单独的更简单测试结构的需要。提取的参数为:发射极条纹宽度和面积,外延集电极掺杂,电阻率和宽度,发射极和集电极结深度,峰值基极掺杂,发射极结的杂质梯度,氧化物厚度和固定电荷以及封装寄生电容。在提取过程中,将材料参数和易于观察到的平面尺寸(例如发射极条纹长度和金属焊盘面积)用作输入参数。随着端子集电极-基极电压的变化,在基极加宽效应开始时,这项工作加强了对跨真实器件外延集电极宽度的电流性质的最新见解。

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